TWI787250B - Carriers for electronic component testing devices - Google Patents

Abstract

[Problem] To provide a carrier for electronic component testing equipment, the carrier can cope with the replacement of the type of electronic components to be tested or the consumption of sockets by replacing components with smaller units, and can cope with the electronic components to be tested Accurate positioning of external contact terminals of components and terminals of sockets. [Solution] The carrier system for the electronic component testing device includes: an IC socket 750 including a plurality of terminals 753 arranged to correspond to a plurality of external contact terminals HB and connected to the tester 6 via the socket board 50, and carrying IC components are placed; the core body 740 forms a ring around the IC components, and the IC socket 750 is installed at the bottom; and the body 720 is installed on the frame 700 of the test tray TST, and is detachably installed The core body 740; in the core body 740, positioning holes 7451, 7461 for fitting with the positioning pins 55 protruding from the socket board 50 are formed;

Description

Carriers for electronic component testing devices

The invention relates to a carrier for an electronic component testing device.

As a carrier for an electronic component testing device that transports an electronic component under test such as a BGA (Ball Grid Array) type IC package to a socket for quality inspection, etc., it is known that the carrier includes contact with the external contact terminal of the electronic component under test. A plurality of conductive contacts (for example, refer to Patent Documents 1 and 2). Positioning holes are set on the carriers described in Patent Documents 1 and 2, and positioning pins are set on the socket or the bottom substrate below it. By fitting the positioning pins with the positioning holes, the electronic components under test and the socket are positioned. [ Prior patent documents ] [ Patent documents ]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-66095 [Patent Document 2] International Publication No. 2013/168196

[ Problems to be Solved by the Invention ]

With the reduction in diameter and pitch of the external contact terminals of the electronic component under test, the positioning of the external contact terminal of the electronic component under test and the contacts of the socket (hereinafter referred to as terminals) is required to be highly accurate. On the other hand, the replacement of the type of electronic components to be tested or the consumption of sockets requires the replacement of smaller units of components.

The problem to be solved by the present invention is to provide a carrier for an electronic component testing device. The carrier can replace the type of the electronic component to be tested or the consumption of the socket by replacing the component of a smaller unit, and can To cope with the high precision of the positioning of the external contact terminal of the electronic component under test and the terminal of the socket. [ Means to solve the problem ]

[1] The carrier for the electronic component testing device of the present invention holds on the socket board the tray that is placed in the electronic component testing device including the tester and the socket board connected to the tester, and plural An electronic component under test protruding from a bottom surface of a plurality of external contact terminals, comprising: an IC socket including a plurality of terminals arranged to correspond to the plurality of external contact terminals and connected to the tester via the socket board, and loaded The electronic component under test; the first body part is formed in a ring around the electronic component under test, and the IC socket is mounted on the bottom; and the second body part is mounted on the frame of the tray, And detachably install the first body portion; in the first body portion, form a positioning hole that fits with a positioning pin protruding from the socket plate or around the socket plate; the first body portion is connected to the first body portion 2. The main body portion is mounted so as to be relatively movable in a plane.

[2] In this invention, the first body part may include a pressing mechanism for pressing the electronic component under test against one of the plurality of inner wall surfaces of the first body part.

[3] In this invention, the first main body may include a plurality of claws, which are provided on the bottom and detachably hold the outer periphery of the IC socket.

[4] In this invention, the first body part includes: a pressing mechanism, which is to press the electronic component under test on one of the inner wall surfaces of the first body part; and a plurality of claws part, the claw is arranged on the bottom, and detachably holds the outer peripheral portion of the IC socket; the pressing mechanism is configured to press the IC socket on any one of the plurality of claws.

[5] In this invention, the first body part includes a spacer, the spacer is arranged on the bottom, and the IC socket is fixed on the bottom; the positioning hole is arranged on the filler slot.

[6] The manufacturing method of the carrier for the electronic component testing device of the present invention is to manufacture the above-mentioned carrier for the electronic component testing device, which forms a plurality of openings on the outer periphery of the IC socket; A plurality of protrusions with a smaller diameter are formed on the bottom surface of the first body portion; insert the protrusions into the opening, and position the positioning holes opposite to the terminals; by deforming the protrusions, the IC socket The outer peripheral portion fills the bottom surface of the first body portion. [ Invention effect ]

According to the present invention, the replacement of the type of the electronic component to be tested or the consumption of the socket can be handled by the replacement of components of a smaller unit, and the high accuracy of the positioning of the terminal of the electronic component to be tested and the terminal of the socket can be dealt with. .

Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device in Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Fig. 1 and Fig. 2 .

The electronic component testing apparatus shown in FIG. 1 and FIG. 2 applies high temperature or low temperature thermal stress to the IC component, and uses the test head 5 and the tester 6 to test (check) whether the IC component operates properly in this state. Moreover, the electronic component testing device classifies IC components according to the test results.

In the electronic component testing device, a plurality of IC components to be tested are mounted on the custom-made tray KST (see FIG. 5 ). Also, in the handler 1 of the electronic component testing device, the test tray TST circulates (see FIG. 6 ). IC components are tested after being transferred from the customized tray KST to the test tray TST. In addition, IC elements are represented by symbol IC in the drawings.

As shown in FIG. 1 , a space 8 is provided below the processor 1 , and the test head 5 is placed in the space 8 . A socket board 50 is provided on the test head 5 , and the socket board 50 is connected to the tester 6 via the cable 7 .

In this electronic component testing device, the IC components loaded on the test tray TST are electrically connected to the socket board 50 on the test head 5, and an electric signal is supplied to the IC components in this state, and then according to the output from the tester 6 The signal, test (check) IC components. In addition, when changing the type of IC element, the socket board 50 and the core 730 described later are replaced with those suitable for the shape of the IC element, the number of pins, and the like.

As shown in FIG. 2 and FIG. 3 , the processor 1 includes a storage unit 200 , a loading unit 300 , a testing unit 100 and an unloading unit 400 . The storage unit 200 stores IC components before or after testing. The loading unit 300 transfers the IC device transferred from the storage unit 200 to the testing unit 100 . The test unit 100 is configured such that the socket board 50 of the test head 5 faces inside. The unloading unit 400 classifies the tested IC components that have been tested by the testing unit 100 .

Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a custom-made tray used in the above-mentioned electronic component testing device. As shown in FIG. 4 , the storage unit 200 includes a pre-test storage 201 and a test-finished storage 202 . The pre-test storage 201 is a custom-made tray KST for storing IC components before the test. The tested storage 202 stores custom-made trays KST for storing IC components sorted according to the test results. The pre-test storage 201 and the test-finished storage 202 include a frame-shaped pallet support frame 203 and an elevator 204 that enters from the lower part of the pallet support frame 203 and lifts up and down. On the tray support frame 203, a plurality of custom-made trays KST are stacked. The stacked customized pallet KST is moved up and down by the elevator 204 . In addition, as shown in FIG. 5, the custom tray KST includes a plurality of recessed housing portions for housing IC components. The plurality of housing parts are arranged in a plurality of columns and rows (for example, 14 columns and 13 rows). In addition, the pre-test repository 201 and the post-test repository 202 have the same structure.

As shown in FIGS. 2 and 3 , in the pre-test storage 201 , two storages STK-B and two empty tray storages STK-E are installed. Two storehouses STK-B are adjacent to each other, and next to these two storehouses STK-B, two empty pallet storerooms STK-E are adjacent to each other. The empty-tray storage STK-E is the empty made-to-order tray KST transferred to the unloading unit 400 in a stack.

Next to the pre-test repository 201, a tested repository 202 is provided. After testing the storage 202 here, eight storages STK-1, STK-2, . . . , STK-8 are installed. The tested storage 202 is configured to classify and store tested IC devices into a maximum of 8 types according to the test results. For example, IC components that have been tested are stored in the tested storage 202. In addition to being classified into good products and defective products, they can also be classified into high-speed good products, medium-speed good products, and low-speed products. Good products, or can be classified into defective products that need to be retested and defective products that do not need to be retested.

As shown in FIG. 2 , a tray transfer arm 205 is provided between the storage unit 200 and the device base 101 , and the tray transfer arm 205 transfers the customized tray KST from the lower side of the device base 101 to the loading unit 300 . Here, a pair of window portions 370 are formed on the device base 101 . The pair of window parts 370 is arranged to face the upper surface of the device base 101 with the custom-made tray KST transferred from the lower side of the device base 101 to the loader 300 by the tray transfer arm 205 .

The loading unit 300 includes a component conveying device 310 . The component transfer device 310 includes two rails 311 , a movable arm 312 and a movable head 320 . The two rails 311 are erected on the device base 101 . The movable arm 312 reciprocates between the test tray TST and the customized tray KST along the two rails 311 . In addition, the moving direction of the movable arm 312 is called a Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. On the movable head 320, a plurality of suction pads not shown are attached downward.

The component transfer device 310 moves the movable head 320 , on which a plurality of IC components are sucked by a plurality of suction pads, from the custom tray KST to a position corrector (preciser) 360 . Thereby, IC components are transferred from the order tray KST to the position corrector 360 . Next, the component transfer device 310 corrects the mutual positional relationship of the IC components by the position corrector 360 through the movable arm 312 and the movable head 320 . Then, the component transfer device 310 transfers the IC components to the test tray TST stopped at the loading unit 300 . Thereby, IC components are transferred from the order tray KST to the test tray TST.

As shown in FIG. 2 and FIG. 3 , the test unit 100 includes a temperature environment chamber 110 , a test chamber 120 and a room temperature recovery chamber 130 . The temperature environment chamber 110 applies a target high temperature or low temperature thermal stress to the IC devices mounted on the test tray TST. In the test chamber 120 , the IC element subjected to thermal stress in the temperature environment chamber 110 is pressed against the test head 5 . The room temperature recovery chamber 130 removes thermal stress from the IC components tested in the test chamber 120 .

When a high temperature is applied to the IC device in the temperature environment chamber 110 , the IC device is cooled to room temperature in the room temperature recovery chamber 130 by blowing air. On the other hand, when a low temperature is applied to the IC device in the temperature environment chamber 110 , the IC device is heated in the normal temperature recovery chamber 130 to a temperature at which dew condensation does not occur by warm air or a heater.

As shown in FIG. 2 , the temperature environment chamber 110 and the normal temperature recovery chamber 130 protrude upward from the test chamber 120 . Also, as schematically shown in FIG. 3, a vertical transfer device is installed in the temperature environment chamber 110, and the preceding test tray TST exists in the test chamber 120, and a plurality of subsequent test trays TST are placed in the vertical transfer device. Standby in support state. The IC components mounted on the subsequent test trays TST are subjected to high temperature or low temperature thermal stress during standby.

In the center of the test chamber 120, the test head 5 is arranged. The test tray TST is transferred onto the test head 5 . In the center of the test chamber 120, the external contact terminal HB (refer to FIG. 11 ) of the IC component mounted on the test tray TST is in contact with the terminal (not shown) of the socket board 50 on the test head 5, and the IC component is tested. . The test tray TST mounted on the tested IC device is transferred to the room temperature recovery chamber 130 . In the room temperature recovery chamber 130, the tested IC devices are deheated to room temperature. The test tray TST on which the deheated IC device is mounted is carried out to the unloading part 400 .

In the upper part of the temperature environment chamber 110, an entrance for carrying the test tray TST from the device base 101 into the temperature environment chamber 110 is formed. On the other hand, an outlet for carrying out the test tray TST from the normal temperature recovery chamber 130 to the device base 101 is formed on the upper portion of the normal temperature recovery chamber 130 .

As shown in FIG. 2 , the pallet transfer device 102 is installed on the device base 101 . The tray transfer device 102 transports the test tray TST from the device base 101 into the temperature environment chamber 110 and unloads the test tray TST from the normal temperature recovery chamber 130 to the device base 101 . The pallet conveyance device 102 is constituted by, for example, turning rollers or the like.

After the test tray TST is carried out from the normal temperature recovery chamber 130 to the device base 101 by the tray transfer device 102, all the IC components mounted on the test tray TST are transferred by the component transfer device 410 (described later) to the corresponding test result. The custom tray KST. Then, the test tray TST is transferred to the temperature environment chamber 110 via the unloading unit 400 and the loading unit 300 .

As shown in FIG. 2 , two component conveyance devices 410 are installed in the unloading section 400 . The structure of this component conveying device 410 is the same as that of the component conveying device 310 installed in the loading section 300 . The two component transfer devices 410 transfer the tested IC components from the test tray TST present on the device base 101 to the customized tray KST corresponding to the test result.

Two pairs of window portions 470 are formed on the device base 101 . These two pairs of window parts 470 are arranged so that the custom-made tray KST transferred to the unloading part 400 faces the upper surface of the device base 101 . An elevating table not shown is provided on the lower side of the two pairs of window parts 470 and the above-mentioned window part 370 . This lifting workbench lowers the custom-made tray KST on which the tested IC components are mounted, and hands it over to the tray transfer arm 205 .

FIG. 6 is a perspective view showing the test tray TST. As shown in FIG. 6 , the test tray TST includes a frame 700 and a plurality of component carriers 710 . The rack 700 includes a rectangular outer frame 701 and an inner frame 702 arranged in a grid pattern inside the outer frame 701 . The rack 700 includes a rectangular opening 703 divided into columns and rows by the outer frame 701 and the inner frame 702 .

A plurality of component carriers 710 are arranged in a plurality of columns and rows. Each component carrier 710 is disposed corresponding to each opening 703 of the rack 700 . The component carrier 710 includes a body 720 and a plurality of (for example, four as shown in FIG. 6 ) cores 730 . The main body 720 is a rectangular plate-shaped resin molded body, and the same number (four in this embodiment) of rectangular openings 721 as the core 730 is formed in a plurality of columns and rows (in this embodiment, two columns and two rows).

The plurality of bodies 720 are arranged on the lower side of the rack 700 in a plurality of columns and rows. The body 720 located on the outermost circle is configured such that its outer periphery overlaps with the outer frame 701 or the inner frame 702 , and a plurality of openings 721 overlap with the opening 703 of the frame 700 . On the other hand, the other main body 720 is arranged such that its outer peripheral portion overlaps with the inner frame 702 , and a plurality of openings 721 overlap with the opening 703 of the frame 700 . The plurality of bodies 720 are fixed on the intersection of the outer frame 701 and the inner frame 702 of the rack 700 and the intersection of the inner frames 702 with each other.

Fig. 7 is an exploded perspective view showing enlarged part of the test tray TST. As shown in FIG. 7 , the core 730 is detachably mounted on the body 720 . The core 730 is configured to correspond to each opening 721 . And the main body 720 is installed so as to be able to move slightly (swim) in a plane (in the XY plane in FIG. 7). The core 730 includes a core body 740 and an IC socket 750 . The core body 740 is a resin molded body in which a rectangular opening (through hole) 741 is formed. A plurality of (four as shown in FIG. 7 ) claws 742 are formed on the outer periphery of the core body 740 . On the main body 720, an engaging portion 722 to which the claw portion 742 is engaged is formed. The core body 740 is supported by the body 720 by the claw portion 742 engaging with the engaging portion. On the other hand, the core body 740 can be detached from the body 720 by releasing the engagement between the claw portion 742 and the engaging portion.

Here, the fit between the claw portion 742 and the engaging portion 722 does not fix the core body 740 and the body 720 , but allows the relative in-plane micro-movement (swimming) of the core body 740 and the body 720 . Thereby, as will be described later, the relative positioning of the external contact terminal HB (see FIG. 11 ) of the IC element and the terminal 753 of the IC socket 750 can be performed.

The IC socket 750 includes a rectangular plate-shaped body, and the IC socket 750 constitutes the bottom of the core 730 by fixing the flange 751 provided on the outer periphery of the body to the bottom of the core body 740 . IC components are mounted on this IC socket 750 .

FIG. 8 is a plan view showing part of the body 720 and the core 730 . Figure 9 is a sectional view of 9-9 in Figure 8. Figure 10 is a sectional view of 10-10 in Figure 8. As shown in these figures, the core body 740 is a rectangular ring-shaped resin molded body forming the above-mentioned opening 741, and includes four claws 742, a pair of rod receiving parts 743, 744, and a pair of positioning parts 745, 746. A pair of rod receiving portions 743 , 744 and a pair of positioning portions 745 , 746 constitute sides of the core body 740 . A pair of rod receiving parts 743, 744 share a vertex of the core body 740, and a pair of positioning parts 745, 746 share a vertex. Also, one rod receiving portion 743 and one positioning portion 745 are opposed to each other, and the other rod receiving portion 744 and the other positioning portion 746 are opposed to each other.

The pair of rod housing parts 743 and 744 are hollow bodies in the shape of a cuboid. The rod receiving part 743 on one side accommodates the pressing mechanism 760 inside, and the rod receiving part 744 on the other side houses the pressing mechanism 761 inside. At the lower part of the center in the width direction of the outer wall surface 7431 of the rod accommodating part 743, the claw part 742 is provided so that it may extend upward. Similarly, at the lower part of the center in the width direction of the outer wall surface 7441 of the rod housing part 744, the claw part 742 is provided so as to extend upward.

A pair of positioning parts 745 and 746 are solid bodies in the shape of a cuboid. A positioning hole 7451 is formed at the central portion in the longitudinal direction and in the central portion in the width direction of the bottom surface of one positioning portion 745 . A positioning hole 7461 is formed at the central portion in the longitudinal direction and in the central portion in the width direction of the bottom surface of the other positioning portion 746 . One of the pair of positioning holes 7451, 7461 is a circular hole for positioning in the X direction and Y direction in the figure, and the other side of the pair of positioning holes 7451, 7461 is used for positioning only in the Y direction in the figure Long hole. A claw portion 742 is formed at the center portion in the longitudinal direction of the upper surface of the positioning portion 745 and at the end portion on the outer peripheral side so as to extend upward. Similarly, the claw portion 742 is formed to extend upward at the central portion in the longitudinal direction of the upper surface of the positioning portion 746 and at the end portion on the outer peripheral side.

The four claws 742 include a shaft portion 7421 and a locking claw 7422 formed on the upper end of the shaft portion 7421. The four locking claws 7422 are arranged at the same height. On the other hand, on each of the four surfaces (inner wall surface 7211 ) of the peripheral wall constituting the opening 721 of the main body 720 , an engaging portion 722 to which the locking claw 7422 is locked is formed. The engaging portion 722 is a concave portion formed in the center portion in the width direction of the inner wall surface 7211 . The four engaging parts 722 are arranged at the same height. Here, a gap is formed between the inner wall surface 7211 and the shaft portion 7421 . In addition, a gap is formed between the side surface of the locking claw 7422 and the engaging portion 722 . Thereby, the locking claw 7422 and the engaging portion 722 are relatively movable in the horizontal direction only by the amount of the gap. Therefore, the core 730 is movable relative to the body 720 in the horizontal direction by only the amount of the gap.

In the lower portion of the inner wall surface 7432 of the rod housing portion 743 , an opening 7432A is formed over a wide range in the width direction of the inner wall surface 7432 . In this opening 7432A, a rotating shaft 7603 extending horizontally along the width direction of the inner wall surface 7432 (the depth direction in FIG. 9 ) is provided. On the other hand, in the lower portion of the inner wall surface 7442 of the rod housing portion 744 , an opening 7442A is formed over a wide range in the width direction of the inner wall surface 7442 . In this opening 7442A, a rotating shaft 7613 extending horizontally along the width direction of the inner wall surface 7442 (the depth direction in FIG. 10 ) is provided.

The pressing mechanism 760 on one side includes a rod 7601 and a spring 7602 . The rod 7601 is rotatably supported by a rotating shaft 7603 . The rod 7601 includes a holding portion 7601A suspended from the rotating shaft 7603 and a spring receiving portion 7601B protruding from the top of the holding portion 7601A to the inside of the rod receiving portion 743 . The pressing portion 7601A is formed in a plate shape and extends in the width direction of the inner wall surface 7432 . Also, the spring receiving portion 7601B is provided at the central portion in the longitudinal direction of the pressing portion 7601A.

Spring 7602 is a compression spring. A convex portion 7601C to which one end of the spring 7602 is attached is formed on the upper surface of the spring receiving portion 7601B. On the other hand, on the inner upper surface of the rod housing portion 743, a convex portion 7433 to which the other end of the spring 7602 is attached is formed. Here, the spring 7602 is installed between the upper and lower protrusions 7601C and 7433 in an elastically compressed state, and rotates toward the outside of the rod accommodating portion 743 at the front end of the pressing portion 7601A (clockwise in FIG. 9 ). The rod 7601 is biased. On the other hand, a flat surface 7601D abutting against the side surface of the IC element is formed at the front end of the pressing portion 7601A. Thereby, the IC element is pressed against the inner wall surface 7452 of the positioning portion 745 by the pressing mechanism 760 .

The pressing mechanism 761 on the other side includes a rod 7611 and a spring 7612 . The rod 7611 is rotatably supported by a rotating shaft 7613 . The rod 7611 includes a holding portion 7611A suspended from the rotating shaft 7613 and a spring receiving portion 7611B protruding from the top of the holding portion 7611A to the inside of the rod receiving portion 744 . The pressing portion 7611A is configured in a plate shape and extends in the width direction of the inner wall surface 7442 . Also, the spring receiving portion 7611B is provided at the central portion in the longitudinal direction of the pressing portion 7611A.

Spring 7612 is a compression spring. A convex portion 7611C to which one end of the spring 7612 is attached is formed on the upper surface of the spring receiving portion 7611B. On the other hand, on the inner upper surface of the rod housing portion 744, a convex portion 7443 to which the other end of the spring 7612 is attached is formed. Here, the spring 7612 is installed between the upper and lower protrusions 7611C and 7443 in an elastically compressed state, and rotates toward the outside of the rod accommodating portion 744 at the front end of the pressing portion 7611A (clockwise in FIG. 9 ). The rod 7611 is biased. On the other hand, a flat surface 7611D abutting against the side surface of the IC element is formed at the front end of the pressing portion 7611A. Thereby, the IC element is pressed against the inner wall surface 7462 of the positioning portion 746 by the pressing mechanism 761 .

A plurality of shims 749 are disposed on the bottom surface (lower end surface) of the core body 740 . The spacers 749 are disposed on the four corners of the bottom surface of the core body 740 and each side of the bottom surface of the core body 740 . In contrast, a rectangular ring-shaped flange 751 made of metal or resin is integrally provided on the outer periphery of the IC socket 750, and a plurality of openings ( illustration omitted). Each shim 749 includes a body with a circular cross-section and a head with a circular cross-section. The trunk of the spacer 749 protrudes downward from the bottom of the core body 740 and fits into the opening of the IC socket 750 . The head portion of the spacer 749 is larger in diameter than the trunk portion and the opening of the IC socket 750, and widens radially from the front end (lower end) of the trunk portion. Thus, the head of the spacer 749 and the bottom surface of the core body 740 clamp the flange 751 .

In the center of the IC socket 750, a rectangular opening 752 is formed. Here, an unillustrated light sensor is set at a predetermined position of the electronic component testing device, and the core 730 stops at the position of light from the light sensor, or at the position of light passing through the light sensor. The light sensor includes a light-emitting part and a light-receiving part facing up and down, and emits light when the opening 752 is located between the light-emitting part and the light-receiving part. When the IC component exists on the IC socket 750, since the light is blocked by the IC component, the IC component is detected. On the other hand, when the IC component does not exist on the IC socket 750, since the light emitted from the light emitting unit passes through the opening 752 and is received by the light receiving element, the IC component is not detected.

Between the opening 752 of the IC socket 750 and the flange 751, a plurality of terminals 753 are formed. The plurality of terminals 753 are provided to correspond to the plurality of ball-shaped external contact terminals HB provided on the bottom surface of the IC element. Therefore, the external contact terminal HB is in contact with the terminal 753 . In addition, in this embodiment, since the plurality of external contact terminals HB of the IC element are arranged in a plurality of rows in a rectangular ring shape, the plurality of terminals 753 are arranged in a plurality of rows in a rectangular ring shape. However, the arrangement of the external contact terminal HB of the IC element and the terminal 753 of the IC socket 750 is not limited to the arrangement of the present embodiment, and can be appropriately changed.

The IC socket 750 is configured by embedding a plurality of terminals 753 in an insulating sheet-shaped base material. The terminal 753 is made of a conductive elastic member. Examples of the conductive elastic member constituting the terminal 753 include synthetic rubber with a conductive filler or synthetic resin such as polyester with a conductive filler.

Here, when the height of the lower end of the rods 7601, 7611 is arranged at the height of the flange 751, a notch (not shown) for avoiding interference with the rods 7601, 7611 is formed in the flange 751 . Also, the area of the main body of the IC socket 750 is set to be smaller than the area of the IC element. Thereby, interference of the rods 7601, 7611 and the IC socket 750 is prevented.

Fig. 11 is a cross-sectional view showing a state of testing (inspecting) an IC device. In addition, only the configuration corresponding to FIG. 9 is shown in FIG. 11, which will be described below, and the configuration corresponding to FIG. 10 is the same as the configuration corresponding to FIG. 9, so the illustration is omitted, and some parts are omitted. instruction of.

As shown in FIG. 11 , a pair of positioning pins 55 are provided on the test head 5 . The positioning pin 55 on one side is arranged in a manner corresponding to the positioning hole 7451, and is fitted into the positioning hole 7451. In addition, the other positioning pin 55 is arranged so as to correspond to the positioning hole 7461 (see FIG. 10 ), and is fitted into the positioning hole 7461 . In addition, the positioning pin 55 can also be arranged on the test head 5 or around the test head 5 .

The push rod 121 is configured to be liftable above the socket board 50 . The push rod 121 is mounted on an unillustrated Z-axis driving device (such as a fluid cylinder). When testing an IC component, the Z-axis driving device presses the IC socket 750 against the socket board 50 through the IC component through the push rod 121 .

A plurality of terminals (not shown) are formed on the surface of the socket board 50 . The number and arrangement of the plurality of terminals are set to correspond to the number and arrangement of the plurality of external contact terminals HB of the IC element. Each terminal is a pad made of metal such as Au, and wiring is connected to each terminal. These plural lines are connected to the tester 6 .

The test of the IC element is performed by the tester 6 in a state where the external contact terminal HB of the IC element is in electrical contact with the terminal of the socket board 50 via the terminal 753 of the IC socket 750 . The test result of the IC component is stored in an address determined by, for example, the identification number attached to the test tray TST and the number of the IC component allocated in the test tray TST.

Here, as described above, the inner wall surface 7452 of the core main body 740 for pressing the IC element by the pressing mechanism 760 exists. Also, among the plurality of external contact terminals HB of the IC element, the row of external contact terminals HB closest to the inner wall surface 7452 and parallel to the inner wall surface 7452 exists. Also, among the plurality of terminals 753 of the IC socket 750 , there is a row of the terminals 753 closest to the inner wall surface 7452 and arranged parallel to the inner wall surface 7452 . Furthermore, among the plurality of terminals (not shown) of the socket board 50 , there is a row of terminals closest to the inner wall surface 7452 and arranged parallel to the inner wall surface 7452 .

A predetermined dimensional tolerance is set for a dimension A between the center of the positioning hole 7451 and the inner wall surface 7452 . In addition, a predetermined dimensional tolerance is set for a dimension B between the center of the external contact terminal HB constituting the external contact terminal HB and the side surface of the IC element in contact with the inner wall surface 7452 . Also, a predetermined dimensional tolerance is set for a dimension C between the center of the positioning hole 7451 and the center of the row of terminals 753 constituting the terminal 753 . Furthermore, a predetermined dimensional tolerance is set for the dimension C between the center of the positioning hole 7451 and the terminals constituting the row of terminals of the socket board.

Similarly, although the drawing is omitted, the inner wall surface 7462 of the core body 740 that presses the IC element by the pressing mechanism 761 exists. Also, among the plurality of external contact terminals HB of the IC element, the row of the external contact terminals HB closest to the inner wall surface 7462 and parallel to the inner wall surface 7462 exists. Furthermore, among the plurality of terminals 753 of the IC socket 750 , there is a row of the terminals 753 closest to the inner wall surface 7462 and arranged parallel to the inner wall surface 7462 . Furthermore, among the plurality of terminals (not shown) of the socket board 50 , there is a row of terminals closest to the inner wall surface 7462 and arranged parallel to the inner wall surface 7462 .

A predetermined dimensional tolerance is set for a dimension A between the center of the positioning hole 7461 and the inner wall surface 7462 . Also, a predetermined dimensional tolerance is set for the dimension B between the center of the external contact terminal HB constituting the external contact terminal HB and the side surface of the IC element that contacts the inner wall surface 7462 . Also, a predetermined dimensional tolerance is set for a dimension C between the center of the positioning hole 7461 and the center of the row of terminals 753 constituting the terminal 753 . Furthermore, a predetermined dimensional tolerance is set for the dimension C between the center of the positioning hole 7461 and the terminals constituting the row of terminals of the socket board.

As shown in the above description, the component carrier 710 of this embodiment includes: an IC socket 750; a core body 740, which is installed on the bottom of the IC socket 750 formed to surround the IC component; and a body 720, which The core body 740 mounted on the frame 700 of the test tray TST is detachably mounted.

Thereby, the replacement of the type of IC components or the consumption of the IC socket 750 will not replace the main body 720 mounted on the rack 700 regardless of the replacement of the whole test tray TST or the whole of the components mounted on the rack 700. , and by replacing the core body 740 installed in the body 720, it can be dealt with. Therefore, replacement of the type of IC components or consumption of the IC socket 750 can be accommodated by replacement of components in smaller units.

Here, in the core body 740 , positioning holes 7451 and 7461 for fitting with the positioning pins 55 protruding from the socket plate 50 are formed. Also, the core body 740 is installed relative to the body 720 to be relatively movable in a plane. Therefore, what affects the positioning accuracy of the external contact terminal HB of the IC element and the terminal 753 of the IC socket 750 is the dimensional tolerance of the IC element, the core body 740 and the IC socket 750 . That is, the tolerance of the components of the body 720 has no influence on the positioning accuracy of the external contact terminal HB of the IC component and the terminal 753 of the IC socket 750 . Therefore, the positioning accuracy of the external contact terminal HB of the IC element and the terminal 753 of the IC socket 750 can be improved.

Moreover, the core body 740 includes: a pressing mechanism 760 for pressing the IC element on the inner wall surface 7452 of the core body 740; and a pressing mechanism 761 for pressing the IC element on the inner wall surface 7462 of the core body 740. Thereby, what affects the positioning accuracy of the external contact terminal HB of the IC element and the terminal 753 of the IC socket 750 is the fit tolerance between the positioning pin 55 and the positioning holes 7451, 7461, the positioning hole 7451 or the positioning holes 7451, 7461 and Tolerance of dimension A between the inner wall surfaces 7452, tolerance of dimension B between the external contact terminal HB of the IC element and the side surface of the IC element, tolerance of dimension B between the terminal 753 of the IC socket 750 and the inner wall surface 7452, and The tolerance of dimension C between the positioning hole 7451 or the positioning holes 7451 , 7461 and the terminal 753 of the IC socket 750 . Therefore, the positioning accuracy of the external contact terminal HB of the IC element and the terminal 753 of the IC socket 750 can be further improved.

FIG. 12 and FIG. 13 are cross-sectional views showing component carriers 710 of other embodiments. In addition, only the configuration corresponding to FIG. 9 is shown in FIG. 12 and FIG. 13, which will be described below, and the configuration corresponding to FIG. 10 is the same as the configuration corresponding to FIG. 9, so the illustration is omitted. , and omit some descriptions.

As shown in this figure, in the component carrier 710 of this embodiment, the IC socket 750 is provided so that the core body 740 can be disassembled. A hook 770 is provided on the bottom surface of the rod receiving portion 743 , and a hook 770 is also provided on the bottom surface of the positioning portion 745 . The pair of hooks 770 are engaged with the flange 751 of the IC socket 750, and hold the IC socket 750 in a state positioned in the left and right directions in the figure.

The hook 770 provided on the bottom surface of the positioning portion 745 is fixed. On the other hand, as shown in the figure, the hook 770 provided on the bottom surface of the rod receiving portion 743 is configured to be movable between a position engaged with the flange 751 and a position separated from the flange 751 (not shown). move. Here, the pressing mechanism 760 presses the IC socket 750 against the hook 770 in the fixed state.

As shown in the above description, the component carrier 710 in this embodiment includes a plurality of hooks 770, which are arranged on the bottom of the core body 740, and detachably hold the flange 751 of the IC socket 750. Thereby, the replacement of the type of IC components or the consumption of the IC socket 750 can be handled by replacing the components with the IC socket 750 as the smallest unit.

Also, the pressing mechanism 760 presses the IC socket 750 against the hook 770 in the fixed state, thereby, The IC socket 750 can be detachably installed on the core body 740 , and the IC socket 750 is positioned with the contact point with the hook 770 as a reference point for positioning the positioning hole 7451 and the positioning pin 55 .

Fig. 14 is a cross-sectional view showing a component carrier 710 of another embodiment. In addition, as shown in FIG. 14, in the component carrier 710 of this embodiment, the positioning holes 7451 and 7461 are provided at the center of the spacer 749. Thereby, it is not necessary to provide dedicated spaces for forming the positioning holes 7451 and 7461 in the positioning portions 745 and 746 . Therefore, the core body 740 can be miniaturized.

FIG. 15 and FIG. 16 are sectional views for explaining the method of mounting the IC socket 750 on the core body 740 . As shown in these figures, after positioning the IC socket 750 and the core body 740, the flange 751 of the IC socket 750 is fixed to the bottom surface of the core body 740 by thermal filling.

First, the IC socket 750 and the core body 740 are prepared. A plurality of openings 751A are formed in the flange 751 of the IC socket 750 . On the bottom surface of the core body 740, a plurality of protrusions 749B are formed. The positions of the plurality of protrusions 749B correspond to the positions of the plurality of openings 751A. Also, the diameter of the opening 751A is larger than the diameter of the protrusion 749B, and the IC socket 750 can slightly move (swim) in a plane relative to the core body 740 .

Next, the IC socket 750 is disposed on the bottom of the core body 740 . At this time, after aligning the positions of the plurality of protrusions 749B and the plurality of openings 751A, all the protrusions 749B are inserted into the openings 751A. Here, the camera 8 is installed above the positioning holes 7451 and 7461 and above the terminal 753 closest to the positioning holes 7451 and 7461 among the plurality of terminals 753 of the IC socket 750 . The positioning hole 7451 is photographed by the camera 8 above the positioning hole 7451, and the terminal 753 is photographed by the camera 8 above the terminal 753 closest to the positioning hole 7451. By analyzing the photographed images of these cameras 8, the relative position deviation between the positioning hole 7451 and the terminal 753 closest to the positioning hole 7451 is detected. On the other hand, the positioning hole 7461 is photographed by the camera 8 above the positioning hole 7461, and the terminal 753 is photographed by the camera 8 above the terminal 753 closest to the positioning hole 7461. By analyzing the photographed images of these cameras 8, the positioning hole 7461 and the terminal closest to the positioning hole 7461 are detected. 753 relative positional deviation. Then, the IC is placed within an allowable range in such a way that the relative positional deviation between the positioning hole 7451 and the terminal 753 closest to the positioning hole 7451, and the relative positional deviation between the positioning hole 7461 and the terminal 753 closest to the positioning hole 7461 are within the allowable range. The socket 750 moves in a plane relative to the core body 740 .

Then, a spacer 749 is formed (refer to FIG. 9, etc.), whereby the bottom surface of the spacer 749 and the core body 740 sandwiches the flange 751 of the IC socket 750, and the flange 751 of the IC socket 750 is fixed to the core body 740. the underside. In this step, the protrusion 749B is pressurized from the front end side to the base end side by using a resin thermal caulking device (not shown) to cause thermal deformation, whereby the shim 749 is formed. According to the above, it is possible to manufacture the component carrier 710 that can cope with the miniaturization and fine pitch of the external contact terminals HB of IC components.

In addition, the embodiment described above is described for easy understanding of this invention, and is not described for limiting this invention. Therefore, each element disclosed in the above-mentioned embodiments also includes all design changes or equivalents within the technical scope of the present invention.

For example, in the above-mentioned embodiment, the pressing mechanism 760, 761 is provided to press the IC element against the inner wall surface 7452, 7462 as the reference surface, but this is not essential. For example, by surrounding the inner wall surfaces 7432, 7442, 7452, and 7462 of the IC element, it is also possible to perform positioning of the IC element in a plane.

1: Processor

5: Test head

6: Tester

7: cable

8: camera

50: socket board

51: terminal

55: Locating pin

100: Testing Department

101: device base

102: pallet handling device

110: Temperature environment chamber

120:Test room

121: putter

130: room temperature recovery room

200: storage department

201: Repository before testing

202: After testing the repository

203: Pallet support frame

204: lift

205: Tray transfer arm

300: loading department

310: Component handling device

311: track

312: movable arm

320: movable head

360:Position modifier

370‧‧‧window part 400‧‧‧unloading part 410‧‧‧component handling device 470‧‧‧window TST‧‧‧test tray 700‧‧‧rack 701‧‧‧outer frame 702‧‧‧inner frame 703 ‧‧‧Opening 710‧‧‧Component Carrier 720‧‧‧Body 721‧‧‧Opening 7211‧‧‧Inner Wall Surface 722‧‧‧Engaging Part 730‧‧‧Core 740‧‧‧Core Body 741‧‧‧Opening 742‧‧‧claw part 7421‧‧‧shaft part 7422‧‧‧locking claw 743, 744‧‧‧rod receiving part 7431, 7441‧‧‧outer wall surface 7432, 7442‧‧‧inner wall surface 7432A, 7442A‧‧‧ Opening 7433, 7443‧‧‧Convex part 745, 746‧‧‧Positioning part 7451, 7461‧‧‧Positioning hole 7452, 7462‧‧‧Inner wall surface 749‧‧‧Shim 749B‧‧‧Protrusion 750‧‧‧IC Socket 751‧‧‧Flange 751A‧‧‧Opening 752‧‧‧Opening 753‧‧‧Terminal 760, 761‧‧‧Pressing Mechanism 7601, 7611‧‧‧Rod 7601A, 7611A‧‧‧Pressing Part 7601B, 7611B ‧‧‧Spring receiving part 7601C, 7611C

Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device in Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Fig. 1 and Fig. 2 . Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a custom-made tray used in the above-mentioned electronic component testing device. Fig. 6 is a perspective view showing a test tray. Fig. 7 is an exploded perspective view showing enlarged part of the test tray. Fig. 8 is a plan view showing part of the main body and the core. Figure 9 is a sectional view of 9-9 in Figure 8. Figure 10 is a sectional view of 10-10 in Figure 8. Fig. 11 is a cross-sectional view showing a state of testing (inspecting) an IC device. Fig. 12 is a cross-sectional view showing another embodiment of a component carrier. Fig. 13 is a cross-sectional view showing another embodiment of a component carrier. Fig. 14 is a cross-sectional view showing another embodiment of a component carrier. Fig. 15 is a sectional view for explaining the method of mounting the IC socket on the core body. Fig. 16 is a sectional view for explaining the method of mounting the IC socket on the core body.

5‧‧‧Test head

50‧‧‧Socket board

55‧‧‧locating pin

121‧‧‧putter

710‧‧‧Component carrier

720‧‧‧Body

722‧‧‧Catch Department

730‧‧‧core

740‧‧‧core body

742‧‧‧claw

7421‧‧‧Shaft

7422‧‧‧Detent claw

743‧‧‧Rod Storage Department

7431‧‧‧Outer wall

7432‧‧‧Inner wall surface

7432A‧‧‧opening

7433‧‧‧Convex part

745‧‧‧Positioning Department

7451‧‧‧Positioning hole

7452‧‧‧Inner wall surface

750‧‧‧IC socket

752‧‧‧opening

753‧‧‧terminal

760‧‧‧press mechanism

7601‧‧‧Rod

7601A‧‧‧Repressed part

7601B‧‧‧Spring receiving part

7601C‧‧‧Convex part

7601D‧‧‧plane

7602‧‧‧Spring

7603‧‧‧rotating shaft

HB‧‧‧External contact terminal

A, B, C‧‧‧size

IC‧‧‧IC components

Claims (6)

A carrier for an electronic component testing device, which is set on a tray carried in the electronic component testing device, the electronic component testing device includes a tester, and a socket board connected to the tester, and the carrier for the electronic component testing device A plurality of external contact terminals protruding from the bottom surface of the electronic component to be tested is held on the socket board, which includes: an IC socket including an IC socket arranged to correspond to the plurality of external contact terminals and connected to the test socket via the socket board. a plurality of terminals connected to the device, and mount the electronic component under test; the first body part is a resin molded body that forms a ring shape around the electronic component under test, and mounts the IC socket on the bottom; and the second body part 2. The main body part is installed on the frame between the frame of the tray and the first main body part, and the resin molded body of the first main body part is detachably installed; on the first main body part, A positioning hole is formed to fit with a positioning pin protruding from the socket board or the periphery of the socket board; the first body part is mounted to the second body part so as to be relatively movable in a plane; the IC socket and the The first body part is mutually independent components; the second body part includes an opening part; the first body part corresponds to the opening part and is installed on the second body part. A carrier for an electronic component testing device according to claim 1, wherein: the first body part includes a pressing mechanism for pressing the electronic component to be tested on one of the plurality of inner wall surfaces of the first body part . A carrier for electronic component testing devices as claimed in claim 1 or 2 of the patent scope, wherein the first body part includes a plurality of claws, and the claws are arranged on the bottom to detachably hold the IC Perimeter of the socket. A carrier for an electronic component testing device according to claim 1, wherein: the first body part includes: a pressing mechanism, which presses the electronic component to be tested on one of the plurality of inner wall surfaces of the first body part Inner wall surface; and a plurality of claws, the claws are arranged on the bottom, and detachably hold the outer periphery of the IC socket; the pressing mechanism is to press the IC socket in the plurality of claws either one. Such as the carrier for electronic component testing device of claim 1 or 2 of the patent scope, wherein the first body part includes a spacer, and the spacer is arranged on the bottom, and the IC socket is fixed on the Bottom; the positioning hole is set on the filler. A method of manufacturing a carrier for an electronic component testing device, manufacturing a carrier for an electronic component testing device according to any one of items 1, 2, and 5 of the scope of the patent application, forming a plurality of openings on the outer periphery of the IC socket part, forming a plurality of protrusions with a diameter smaller than the diameter of the opening on the bottom surface of the first body part, inserting the protrusions into the opening, and aligning the positioning hole opposite to the terminal, by making The protrusion is deformed, and the outer peripheral portion of the IC socket is filled with the bottom surface of the first body portion.

Images