CN108802436A - The carrier of device for testing electronic parts - Google Patents

Abstract

The present invention provide it is a kind of can be coped with by the consumption of the variety exchanging of test electron part or socket by the replacement of more subsection part, and cope with the carrier of the device for testing electronic parts of the high precision int of the positioning of terminal by the external contact terminal of test electron part and socket.Have：IC sockets (750) have the multiple terminals (753) for being correspondingly arranged with multiple external contact terminals (HB) and being connect with tester (6) via socket (50), load IC devices；Core main body (740) is formed as cyclic annular in a manner of around IC devices, IC sockets (750) is equipped in bottom；Main body (720), it is installed on the frame of test pallet (TST) (700), core main body (740) is dismantledly installed, it is formed with from socket (50) positioning pin outstanding (55) chimeric location hole (7451), (7461) in core main body (740), core main body (740) planar can be installed relatively movably relative to main body (720).

Description

The carrier of device for testing electronic parts

Technical field

The present invention relates to a kind of carriers of device for testing electronic parts.

Background technology

As in order to carry out quality inspection etc. and by BGA (Ball Grid Array) type IC package etc. by test electron zero Part is transported to the carrier of the device for testing electronic parts on socket, it is known that a kind of to have and by the outside of test electron part The carrier of the contact of multiple electric conductivity of contact terminal contact (for example, referring to patent document 1,2).Remember in patent document 1,2 The carrier of load is equipped with location hole, and positioning pin is equipped on the bulk substrate under socket or its, and positioning pin is chimeric with location hole, The positioning by test electron part and socket is carried out as a result,.

Existing technical literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2003-66095 bulletins

Patent document 2：International Publication No. 2013/168196

Invention content

Problem to be solved by the invention

With by the path and thin space of the external contact terminal of test electron part, it is desirable that by test electron zero The high precision int of the positioning of the external contact terminal of part and the contact (hereinafter referred to as terminal) of socket.On the other hand, it is desirable that logical The replacement for crossing the part of more subsection is corresponding with by the consumption of the change of the type of test electron part or socket.

Problem to be solved by this invention is, provide a kind of can cope with quilt by the replacement of the part of more subsection The replacement of the type of test electron part or the consumption of socket, and cope with by the external contact terminal of test electron part With the carrier of the device for testing electronic parts of the high precision int of the positioning of the terminal of socket.

Technical teaching for solving the problem was

[1] present invention provides a kind of carrier of device for testing electronic parts, is set in device for testing electronic parts Multiple external contact terminals are maintained at by test electron part on the socket by the pallet of interior conveying from bottom surface is outstanding, The socket that the device for testing electronic parts has tester and connect with the tester, wherein the electronic component is tested The carrier of device has：IC sockets have and are correspondingly arranged with the multiple external contact terminal and are inserted via described Multiple terminals that seat board is connect with the tester, mounting are described by test electron part；First main part, to surround It states and is formed as cyclic annular by the mode of test electron part, and the IC sockets are installed in bottom；And second main part, Be installed on the frame of the pallet, and first main part be dismantledly installed, first main part be formed with From positioning pin outstanding around the socket or the socket be fitted into location hole, first main part relative to Second main part planar can be installed relatively movably.

[2] in the present invention as stated above, can also be that first main part has described by test electron part to institute State the pressing mechanism of the internal face pressing in multiple internal faces of the first main part.

[3] in the present invention as stated above, can also be that first main part has multiple claws, the claw is set to institute Bottom is stated, the peripheral part of the IC sockets is dismantledly kept.

[4] in the present invention as stated above, can also be configured to, first main part has：Pressing mechanism, by the quilt Internal face pressing of the test electron part into multiple internal faces of first main part；And multiple claws, it sets It is placed in the bottom, dismantledly keeps the peripheral part of the IC sockets, the pressing mechanism is by the IC sockets to described more Either one or two of a claw presses.

[5] in the present invention as stated above, can also be that first main part has riveting parts, the riveting parts are set to institute Bottom is stated, and the IC sockets are fixed on the bottom, the location hole is set to the riveting parts.

[6] present invention provides a kind of manufacturing method of the carrier of device for testing electronic parts, manufactures above-mentioned electronic component The carrier of experimental rig, wherein multiple openings are formed in the peripheral part of the IC sockets, at the bottom of first main part Face forms multiple boss of the diameter more path than the opening, the boss is inserted in the opening, by the location hole With the terminal relative alignment, by making the boss deform, by the peripheral part of the IC sockets and first main body The bottom surface in portion rivets.

Invention effect

In accordance with the invention it is possible to which the replacement by the part of more subsection is coped with by the type of test electron part more It changes or the consumption of socket, further, it is possible to cope with the high-precision of the positioning of the terminal by the terminal of test electron part and socket Change.

Description of the drawings

Fig. 1 is the schematic sectional view for the device for testing electronic parts for indicating the component carrier using embodiment of the present invention.

Fig. 2 is the stereogram for the device for testing electronic parts for indicating Fig. 1.

Fig. 3 is the concept map for the transfer of the pallet in the device for testing electronic parts of definition graph 1 and Fig. 2.

Fig. 4 is the exploded perspective view for the IC accumulators for indicating to use in above-mentioned device for testing electronic parts.

Fig. 5 is the stereogram for the customization pallet for indicating to use in above-mentioned device for testing electronic parts.

Fig. 6 is the stereogram for indicating test pallet.

Fig. 7 is the exploded perspective view for the part that amplification indicates test pallet.

Fig. 8 is the part for indicating main body and the vertical view of core.

Fig. 9 is the sectional view of the 9-9 of Fig. 8.

Figure 10 is the sectional view of the 10-10 of Fig. 8.

Figure 11 is the sectional view for the state for indicating experiment (inspection) IC devices.

Figure 12 is the sectional view for the component carrier for indicating other embodiment.

Figure 13 is the sectional view for the component carrier for indicating other embodiment.

Figure 14 is the sectional view for the component carrier for indicating other embodiment.

Figure 15 is the sectional view of the method for illustrating IC sockets being mounted on core main body.

Figure 16 is the sectional view of the method for illustrating IC sockets being mounted on core main body.

Specific implementation mode

Hereinafter, based on attached drawing, embodiments of the present invention will be described.Fig. 1 is to indicate to use embodiment of the present invention Component carrier device for testing electronic parts schematic sectional view.Fig. 2 be indicate Fig. 1 device for testing electronic parts it is vertical Body figure.Fig. 3 is the concept map for the transfer of the pallet in the device for testing electronic parts of definition graph 1 and Fig. 2.

Fig. 1 and device for testing electronic parts shown in Fig. 2 are the thermal stress for applying high temperature or low temperature to IC devices, at this Under state, test whether (inspection) IC devices work normally using measuring head 5 and tester 6.Moreover, the electronic component is tested Device is classified IC devices based on test result.

In device for testing electronic parts, (it will join in customization pallet KST as multiple IC component mountings of subjects According to Fig. 5).In addition, in the processor 1 of electronic accessory device, make test pallet TST cycles (with reference to Fig. 6).IC devices by from The KST reprintings of customization pallet are tested to test pallet TST.In addition, IC devices are indicated in figure with symbol IC.

As shown in Figure 1, being equipped with space 8 in the lower part of processor 1, measuring head 5 is configured in the space 8.In measuring head 5 It is equipped with socket 50, which is connect by cable 7 with tester 6.

In the device for testing electronic parts, the socket that is placed on the IC devices and measuring head 5 of test pallet TST 50 contact and are electrically connected, and electric signal etc. are assigned to the IC devices of the state, based on the signal exported from tester 6 to IC devices It is tested (inspection).In addition, in the type switching for carrying out IC devices, socket 50 and aftermentioned core 730 are replaced with suitable In the shape of IC devices or number of pins etc..

As shown in Figures 2 and 3, processor 1 has storage part 200, loading part 300, test department 100, uninstalling portion 400.It deposits Put the IC devices that before 200 shelf test of portion or experiment is completed.The IC devices transferred from storage part 200 are transplanted on by loading part 300 Test department 100.Test department 100 is constituted in such a way that the socket 50 of measuring head 5 is towards inside.Uninstalling portion 400 will be in test department The IC devices that 100 experiments tested are completed are classified.

Fig. 4 is the exploded perspective view for the IC accumulators for indicating to use in above-mentioned device for testing electronic parts.Fig. 5 is Indicate the stereogram of customization pallet used in above-mentioned device for testing electronic parts.As shown in figure 4, storage part 200 has Accumulator 202 is completed in accumulator 201 and experiment before experiment.The storage of accumulator 201 accommodates determining for the IC devices before experiment before experiment Pallet KST processed.The customization pallet for the IC devices that the storage receiving of accumulator 202 is classified according to test result is completed in experiment KST.Accumulator 201 and experiment complete accumulator 202 and have the tray supporting frame 203 of frame-shaped and from the tray supporting before experiment The elevator 204 of the lower part portion of the entering into and up lifting of frame 203.Multiple customization pallets are stacked on tray supporting frame 203 KST.The customization pallet KST of the stacking is moved up and down by elevator 204.In addition, as shown in figure 5, customization pallet KST has Accommodate concave multiple receiving portions of IC devices.Multiple receiving portion is arranged in multiple lines and multiple rows (such as 14 rows 13 row).In addition, It is identical construction that accumulator 202 is completed in accumulator 201 and experiment before experiment.

As shown in Figures 2 and 3, accumulator 201 is set there are two accumulator STK-B and two empty pallet storings before the test Device STK-E.Two accumulator STK-B are adjacent to each other, on the side of the two accumulators STK-B, two empty pallet storings Device STK-E is adjacent to each other.In empty pallet accumulator STK-E, it is stacked with the empty customization pallet for being transplanted on uninstalling portion 400 KST。

The side of accumulator 201 is equipped with experiment and completes accumulator 202 before the test.Accumulator 202 is completed in the experiment, Equipped with eight accumulators STK-1, STK-2 ..., STK-8.Experiment completes accumulator 202 and is configured to that completion will be tested IC devices be divided into most 8 according to test result and store classifiedly.For example, the IC devices that experiment is completed complete storage in experiment In glassware 202, in addition to it can be divided into certified products and defective work, additionally it is possible to be divided into operating rate high speed certified products and The certified products of the certified products and operating rate low speed of operating rate middling speed, or can be divided into need to test again it is unqualified Product and the defective work that need not be tested again.

As shown in Fig. 2, tray conveying arm 205 is arranged between storage part 200 and device base station 101.The tray conveying arm Customization pallet KST is transplanted on loading part 300 by 205 from the downside of device base station 101.Here, being formed on device base station 101 There is a pair of of window portion 370.This pair of of window portion 370 from the downside of device base station 101 using tray conveying arm 205 to be shifted into dress The mode of the upper surface of the customization pallet KST facing devices base station 101 in load portion 300 configures.

Loading part 300 has device transport apparatus 310.The device transport apparatus 310 has two tracks 311, moveable arms 312 and moving head 320.Two tracks 311 are erected on device base station 101.Moveable arm 312 is being tested along two tracks 311 It is moved back and forth between pallet TST and customization pallet KST.In addition, the moving direction of moveable arm 312 is known as Y-direction.Moving head 320 are supported by moveable arm 312 and are moved in X direction.In moving head 320, multiple absorption (not shown) are installed downward Pad.

Device transport apparatus 310 makes to adsorb the moving heads 320 of multiple IC devices from customization pallet KST by multiple absorption layers It is moved to precise localizer (preciser) 360.IC devices are transplanted on precise localizer 360 from customization pallet KST as a result,.And And device transport apparatus 310 corrects the mutual of IC devices in precise localizer 360 by moveable arm 312 and moving head 320 Position relationship.Then, IC devices are transplanted on the test pallet TST stopped in loading part 300 by device transport apparatus 310.By This, IC devices are reprinted from customization pallet KST to test pallet TST.

As shown in Figures 2 and 3, test department 100 has equal hot cell 110, test cabinet 120 and removes hot cell 130.Equal hot cell 110 pairs of IC devices for being loaded into test pallet TST apply the thermal stress of desired high temperature or low temperature.Test cabinet 120 will be in soaking The IC devices that thermal stress is applied in room 110 are pressed into measuring head 5.Except hot cell 130 is removed in 120 proof IC of test cabinet The thermal stress of device.

In the case of applying high temperature to IC devices in equal hot cell 110, by blowing IC devices in except hot cell 130 It is cooled to room temperature.On the other hand, in the case of applying low temperature to IC devices in equal hot cell 110, pass through in except hot cell 130 The temperature for the degree that IC devices are heated to condense by warm wind or heater etc..

As shown in Fig. 2, equal hot cells 110 and except side is prominent more up than test cabinet 120 in hot cell 130.In addition, as general in Fig. 3 Shown in the property read, it is equipped with vertical conveying device in equal hot cell 110, test pallet TST is present in test cabinet 120 previous Period, later multiple test pallet TST are standby in the state of being supported in vertical conveying device.It is loaded into later more The IC devices of a test pallet TST are applied in the thermal stress of high temperature or low temperature in standby.

It is configured with measuring head 5 in the center of test cabinet 120.Test pallet TST is shifted into the top of the measuring head 5.? The center of test cabinet 120, the socket being loaded on the external contact terminal HB and measuring head 5 of the IC devices of test pallet TST 50 terminal (diagram is omitted) contact, carries out the experiment of IC devices.It is mounted with the test pallet TST of the IC devices of off-test It is shifted into and removes hot cell 130.In except hot cell 130, the IC devices of off-test are by except warm to room temperature.It is mounted with by except heat The test pallet TST of IC devices is moved to uninstalling portion 400.

It is formed on the top in equal hot cell 110 for test pallet TST to be moved to equal hot cell 110 from device base station 101 Entrance.On the other hand, the top except hot cell 130 be formed with for by test pallet TST from except hot cell 130 is moved out to dress Set the outlet of base station 101.

As shown in Fig. 2, being equipped with tray conveying device 102 in device base station 101.The tray conveying device 102 holds in the palm test Disk TST moves in equal hot cell 110 from device base station 101, and test pallet TST is moved out from except hot cell 130 to device base station 101.It should Tray conveying device 102 is made of such as rotating roller etc..

Test pallet TST is moved out from except hot cell 130 to after device base station 101 by tray conveying device 102, is loaded It is reprinted to corresponding with test result in all IC devices of test pallet TST by the way that device transport apparatus 410 is (aftermentioned) Customize pallet KST.Then, test pallet TST is transplanted on equal hot cell 110 via uninstalling portion 400 and loading part 300.

As shown in Fig. 2, being equipped with two device transport apparatus 410 in uninstalling portion 400.The device transport apparatus 410 is and sets Set the 310 identical construction of device transport apparatus in loading part 300.The IC devices that two device transport apparatus 410 complete experiment Part is reprinted from the test pallet TST for being present in device base station 101 to customization pallet KST corresponding with test result.

Two pairs of window portions 470 are formed on device base station 101.These two pair window portion 470 is to be transplanted on determining for uninstalling portion 400 The mode of the upper surface of pallet KST facing devices base station 101 processed configures.In these two pair window portion 470 and above-mentioned window portion 370 Downside is equipped with lifting platform (not shown).The lifting platform makes the customization pallet KST for being mounted with the IC devices that experiment is completed decline and move Give tray conveying arm 205.

Fig. 6 is the stereogram for indicating test pallet TST.As shown in the drawing, test pallet TST has frame 700 and multiple Component carrier 710.Frame 700 has the outline border 701 of rectangle and is arranged to the inside casing 702 of clathrate in outline border 701.The frame Frame 700 has the rectangular-shaped opening 703 that multiple lines and multiple rows are divided by outline border 701 and inside casing 702.

Multiple component carriers 710 are arranged in multiple lines and multiple rows.703 pairs of each opening of each component carrier 710 and frame 700 It should be arranged.Component carrier 710 has main body 720 and multiple (for example, 4 as shown) cores 730.Main body 720 is rectangular plate-like Resin molded body, with multiple lines and multiple rows (be in the present embodiment 2 rows 2 row) be formed with identical as the number of core 730 quantity ( In present embodiment be 4) rectangular-shaped opening 721.

Multiple main bodys 720 are arranged in the downside of frame 700 with multiple lines and multiple rows.Main body 720 positioned at most peripheral is with its periphery Portion is Chong Die with outline border 701 or inside casing 702, and 721 modes Chong Die with the opening 703 of frame 700 of multiple openings configure.Another party Face, other main bodys 720 are Chong Die with inside casing 702 with its peripheral part, 721 sides Chong Die with the opening 703 of frame 700 of multiple openings Formula configures.These multiple main bodys 720 are fixed on the outline border 701 of frame 700 and the cross part of inside casing 702 and inside casing 702 is mutual Cross part.

Fig. 7 is the exploded perspective view for the part that amplification indicates test pallet TST.As shown in the drawing, core 730 is detachable Ground is installed on main body 720.Core 730 is configured accordingly with each opening 721, and can be pacified to fine motion (loosening) relative to main body 720 Dress is planar (in figure in X/Y plane).Core 730 has core main body 740 and IC sockets 750.Core main body 740 is to be formed with rectangle The resin molded body of the opening (through-hole) 741 of shape.It is formed in the peripheral part of the core main body 740 and multiple (as shown is four It is a) claw 742.The holding section 722 engaged for claw 742 is formed in main body 720.Core main body 740 is blocked by claw 742 Main body 720 is supported on together in holding section.It on the other hand, can be by core by making the engaging of claw 742 and holding section release Main body 740 is unloaded from main body 720.

Here, claw 742 and the chimeric of holding section 722 are not fixed core main body 740 and main body 720, and allow core main body 740 and fine motion (loosening) of the main body 720 in opposite plane.As a result, as be described hereinafter, the external contact of IC devices can be carried out The opposite positioning of the terminal 753 of terminal HB (referring to Fig.1 1) and IC sockets 750.

IC sockets 750 have the main body for being formed as rectangular plate-like, the flange of the peripheral part by that will be set to the main body 751 are fixed on the bottom of core main body 740, and IC sockets 750 constitute the bottom of core 730.IC devices are loaded in the IC sockets 750.

Fig. 8 is the vertical view of the part and core 730 that indicate main body 720.Fig. 9 is the sectional view of the 9-9 of Fig. 8.Figure 10 It is the sectional view of the 10-10 of Fig. 8.As shown in these figures, core main body 740 is to be formed with the rectangular ring of above-mentioned opening 741 Resin molded body, and have：Four claws 742, a pair of of bar receiving portion 743,744, a pair of of positioning region 745,746.A pair of of bar is received Appearance portion 743,744 and a pair of of positioning region 745,746 constitute each side of core main body 740.A pair of of bar receiving portion 743,744 shared cores One vertex of main body 740, there are one vertex altogether for a pair of of positioning region 745,746.In addition, a bar receiving portion 743 and a positioning region 745 is mutually opposed, and another bar receiving portion 744 and another positioning region 746 are mutually opposed.

A pair of of bar receiving portion 743,744 is the ducted body of rectangular shape.One bar receiving portion 743 is in inside receiving pressing Mechanism 760, another bar receiving portion 744 accommodate pressing mechanism 761 in inside.In the width of the outside wall surface 7431 of bar receiving portion 743 The lower part in direction center, claw 742 are arranged in a manner of extending upward.Equally, in the outside wall surface 7441 of bar receiving portion 744 Width direction center lower part, claw 742 is to being arranged in a manner of being extended by top.

A pair of of positioning region 745,746 is the solid of rectangular shape.Length direction in the bottom surface of a positioning region 745 Central portion and width direction central portion is formed with location hole 7451, the length direction central portion in the bottom surface of another positioning region 746 And width direction central portion is formed with location hole 7461.One side of a pair of of location hole 7451,7461 is for carrying out the X in figure The circular hole of the positioning of direction and Y-direction, another party of a pair of of location hole 7451,7461 are used only for carrying out the Y-direction in figure The slot hole of positioning.In the length direction central portion of the upper surface of positioning region 745 and the end of peripheral side, claw 742 is with upward The mode of Fang Yanshen is formed.Equally, in the length direction central portion of the upper surface of positioning region 746 and the end of peripheral side, claw 742 are formed in a manner of extending upward.

Four claws 742 have axle portion 7421 and are formed in the engagement pawl 7422 of the upper end of axle portion 7421.Four engagement pawl 7422 are configured to height in the same manner.In contrast, at the four sides (internal face 7211) of the peripheral wall for the opening 721 for constituting main body 720 It is respectively formed with the holding section 722 engaged for engagement pawl 7422.Holding section 722 is the width direction for being formed in internal face 7211 The recess portion of central portion.Four holding sections 722 are configured to identical height.Here, the shape between internal face 7211 and axle portion 7421 At there is gap.In addition, being formed with gap between the side of engagement pawl 7422 and holding section 722.7422 He of engagement pawl as a result, Holding section 722 can relatively move the amount in above-mentioned gap in the horizontal direction.Therefore, core 730 can exist relative to main body 720 The amount in above-mentioned gap is relatively moved in horizontal direction.

In the lower part of the internal face 7432 of bar receiving portion 743, formed in the wide scope of the width direction of internal face 7432 There is opening 7432A.It is horizontal-extending equipped with the width direction (depth direction of Fig. 9) along internal face 7432 in opening 7432A Rotary shaft 7603.On the other hand, in the lower part of the internal face 7442 of bar receiving portion 744, in the width direction of internal face 7442 Opening 7442A is formed in wide scope.It is equipped with the width direction (depth of Figure 10 along internal face 7442 in opening 7442A Direction) horizontal-extending rotary shaft 7613.

One pressing mechanism 760 has bar 7601 and spring 7602.Bar 7601 is rotatably supported in rotary shaft 7603.It should Bar 7601 has the press section 7601A to hang down from rotary shaft 7603 and from the top of press section 7601A to bar receiving portion 743 Inside spring seat portions 7601B outstanding.Press section 7601A is configured to plate, and the width direction along internal face 7432 extends.Separately Outside, the length direction central portion in press section 7601A is arranged in spring seat portions 7601B.

Spring 7602 is compression helical spring.It is formed with the one of installation spring 7602 in the upper surface of spring seat portions 7601B The protrusion 7601C at end.On the other hand, the other end of installation spring 7602 is formed in the upper surface of the inside of bar receiving portion 743 Protrusion 7433.Here, spring 7602 is arranged in the state of elastic compression between upper and lower protrusion 7601C, 7433, it will It applies in the direction (clockwise direction of Fig. 9) that bar 7601 is rotated towards the front end of press section 7601A to the outside of bar receiving portion 743 Power.Moreover, being formed with the plane 7601D abutted with the side of IC devices in the front end of press section 7601A.Pass through pressing as a result, Mechanism 760, IC devices are pressed to the internal face 7452 of positioning region 745.

Another pressing mechanism 761 has bar 7611 and spring 7612.Bar 7611 is rotatably supported in rotary shaft 7613. The bar 7611 has the press section 7611A to hang down from rotary shaft 7613 and from the top of press section 7611A to bar receiving portion 744 Inside spring seat portions 7611B outstanding.Press section 7611A is configured to plate, and the width direction of inside wall surface 7442 extends. In addition, the length direction central portion in press section 7611A is arranged in spring seat portions 7611B.

Spring 7612 is compression helical spring.It is formed with the one of installation spring 7612 in the upper surface of spring seat portions 7611B The protrusion 7611C at end.On the other hand, the other end of installation spring 7612 is formed in the upper surface of the inside of bar receiving portion 744 Protrusion 7443.Here, spring 7612 is arranged in the state of elastic compression between upper and lower protrusion 7611C, 7443, it will It applies in the direction (clockwise direction of Fig. 9) that bar 7611 is rotated towards the front end of press section 7611A to the outside of bar receiving portion 744 Power.Moreover, being formed with the plane 7611D abutted with the side of IC devices in the front end of press section 7611A.Pass through pressing as a result, Mechanism 761, IC devices are pressed to the internal face 7462 of positioning region 746.

It is equipped with multiple riveting parts 749 in the bottom surface (lower face) of core main body 740.Riveting parts 749 are arranged in core main body 740 Bottom surface four angles and core main body 740 bottom surface each side.In contrast, it is integrally formed with by gold in the periphery of IC sockets 750 Belong to or the flange 751 of the rectangular ring of resin composition has been correspondingly formed in the flange 751 with the position of riveting parts 749 Multiple openings (diagram is omitted).Each riveting parts 749 have that cross sectional shape is circular body part and cross sectional shape is circular head Portion.The body part of riveting parts 749 protrudes downwards from the bottom surface of core main body 740, chimeric with the opening of IC sockets 750.Riveting The head diameter of part 749 is more than body part and the opening of IC sockets 750, from the front end (lower end) of body part to radial development.It is logical Seize flange 751 on both sides by the arms in the bottom surface on the head and core main body 740 of crossing the riveting parts 749.

Rectangular-shaped opening 752 is formed in the central portion of IC sockets 750.Here, in the rule of device for testing electronic parts Positioning has installed optical sensor (not shown), and core 730 stops or pass through the optical sensor in the position of the light of the optical sensor Light position.The optical sensor has illumination region and acceptance part opposite to each other up and down, opening 752 be located at illumination region and by Light is projected in timing between light portion.In the case where IC devices are present on IC sockets 750, by by IC device shielding lights Line detects IC devices.On the other hand, in the case where IC devices do not exist on IC sockets 750, due to being projected from illumination region Light by opening 752 by photo detector light, to which IC devices be not detected.

It is formed with multiple terminals 753 between the opening 752 and flange 751 of IC sockets 750.These multiple terminals 753 with Multiple spherical external contact terminal HB in the bottom surface of IC devices are arranged correspondingly to be arranged.External contact terminal HB as a result, It is contacted with terminal 753.In addition, in the present embodiment, since multiple external contact terminal HB of IC devices are arranged in multiple row Rectangular ring, so multiple terminals 753 are arranged in rectangular ring with multiple row.But the external contact terminal HB of IC devices and The configuration of the terminal 753 of IC sockets 750 is not limited to the configuration of present embodiment, can change as appropriate.

IC sockets 750 are to be embedded with the structures of multiple terminals 753 in the base material of the sheet of insulating properties.Terminal 753 is by conduction Property elastomeric element constitute.About the elastomeric element for the electric conductivity for constituting terminal 753, it can be illustrated in synthetic rubber and add Component made of electroconductive stuffing adds component etc. made of electroconductive stuffing in the synthetic resin such as polyester.

Here, height of the level configurations of the lower end of bar 7601,7611 at flange 751, to be formed in flange 751 For avoiding and the defect portion of the interference of bar 7601,7611 (diagram is omitted).In addition, the area of the main part of IC sockets 750 is set It is set to the area less than IC devices.The interference of 7601,7611 and IC of bar sockets 750 is prevented as a result,.

Figure 11 is the sectional view for the state for indicating experiment (inspection) IC devices.In addition, only will structure corresponding with Fig. 9 It indicates in fig. 11, and described below, but structure corresponding with Figure 10 and mechanism corresponding with Fig. 9 are identical, therefore, Illustration omitted omits a part of explanation.

As shown in figure 11, a pair of of positioning pin 55 is arranged on measuring head 5.One positioning pin 55 is corresponding with location hole 7451 Ground configures, chimeric with the location hole 7451.In addition, another positioning pin 55 is correspondingly matched with location hole 7461 (referring to Fig.1 0) It sets, it is chimeric with the location hole 7461.In addition, positioning pin 55 can be arranged on measuring head 5, can also be arranged in measuring head 5 Around.

Pusher 121 is liftably arranged in the top of socket 50.The pusher 121 is installed on Z axis (not shown) and drives Dynamic device (such as hydraulic cylinder).When carrying out the experiment of IC devices, Z axis driving device will via IC devices using pusher 121 IC sockets 750 are pressed to socket 50.

Multiple terminals are formed on the surface of socket 50 (diagram is omitted).The quantity of multiple terminals and configuration and IC devices The quantity of multiple external contact terminal HB of part and configuration are correspondingly set.Each terminal is the pad being made of metals such as Au, It is connected with wiring in each terminal.These multiple wirings are connect with tester 6.

The experiment of IC devices the external contact terminal HB and socket 50 that make IC devices terminal via IC sockets 750 Terminal 753 be in electrical contact in the state of using tester 6 execute.The test result of the IC devices, which is stored into, is for example held in the palm by test In the address that the number of subsidiary identiflication number and the IC devices distributed in test pallet TST determines on disk TST.

Here, as above-mentioned, there are the internal faces 7452 for the core main body 740 that IC devices are pressed by pressing mechanism 760. In addition, existing in multiple external contact terminal HB of IC devices closest to internal face 7452 and flat relative to internal face 7452 The row of the external contact terminal HB arranged capablely.In addition, existing closest to internal face in multiple terminals 753 of IC sockets 750 7452 and the row of terminal 753 that are arranged in parallel relative to internal face 7452.In turn, in multiple terminals of socket 50 (figure Show omission) in exist closest to internal face 7452 and the row of terminal that are arranged in parallel relative to internal face 7452.

It is set with defined dimensional tolerance on size A between the center of location hole 7451 and internal face 7452.Separately Outside, constitute said external contact terminal HB row external contact terminal HB center and with the internal face 7452 of IC devices It is set with defined dimensional tolerance on size B between the side of abutting.In addition, on the center and composition of location hole 7451 It states and is set with defined dimensional tolerance on the size C between the center of the terminal 753 of the row of terminal 753.In turn, in location hole Size is public as defined in being set on size C between the terminal of the row of 7451 center and the terminal of the above-mentioned socket of composition Difference.

Equally, although illustration omitted, in the core main body 740 that there are IC devices to be pressed by pressing mechanism 761 Wall surface 7462.In addition, existing closest to internal face 7462 and relative to inner wall in multiple external contact terminal HB of IC devices The row for the external contact terminal HB that face 7462 is arranged in parallel.It is most connect in addition, existing in multiple terminals 753 of IC sockets 750 Nearly internal face 7462 and the row of terminal 753 being arranged in parallel relative to internal face 7462.In turn, in the multiple of socket 50 Exist in terminal (diagram omit) closest to internal face 7462 and the row of terminal that are arranged in parallel relative to internal face 7462.

It is set with defined dimensional tolerance on size A between the center of location hole 7461 and internal face 7462.Separately Outside, constitute said external contact terminal HB row external contact terminal HB center and with the internal face 7462 of IC devices It is set with defined dimensional tolerance on size B between the side of abutting.In addition, on the center and composition of location hole 7461 It states and is set with defined dimensional tolerance on the size C between the center of the terminal 753 of the row of terminal 753.In turn, in location hole Size is public as defined in being set on size C between the terminal of the row of 7461 center and the terminal of the above-mentioned socket of composition Difference.

As described above, the component carrier 710 of present embodiment has：IC sockets 750；Core main body 740, to surround The mode of IC devices forms and is equipped with IC sockets 750 in bottom；Main body 720 is installed on the frame 700 of test pallet TST And core main body 740 is dismantledly installed.

It is changed without the whole or part mounted on frame 700 of test pallet TST as a result, integrally etc., is changed without and is installed on frame The main body 720 of frame 700 and replace the core main body 740 for being installed on main body 720, cope with replacement or the IC of the type of IC devices The consumption of socket 750.Therefore, it is possible to by the part of smaller unit more bring reply IC devices type replacement or The consumption of IC sockets 750.

Here, core main body 740 be formed with from the chimeric location hole 7451 of 50 positioning pin 55 outstanding of socket, 7461.Moreover, core main body 740 is relatively planar moveably mounted relative to main body 720.As a result, to the outer of IC devices What the positioning accuracy of the terminal 753 of portion's contact terminal HB and IC socket 750 affected is that IC devices, core main body 740 and IC are inserted The tolerance of the size of seat 750.That is, the tolerance of the part of main body 720 will not insert external contact the terminal HB and IC of IC devices The positioning accuracy of the terminal 753 of seat 750 affects.Thus, it is possible to improve external contact terminal HB and the IC socket of IC devices The positioning accuracy of 750 terminal 753.

In addition, core main body 740 has 760 He of pressing mechanism for pressing IC devices to the internal face 7452 of core main body 740 The pressing mechanism 761 that IC devices are pressed to the internal face 7462 of core main body 740.As a result, to the external contact terminal of IC devices What the positioning accuracy of the terminal 753 of HB and IC sockets 750 affected is the chimeric of positioning pin 55 and location hole 7451,7461 The tolerance of size A, the outside of IC devices between tolerance, positioning pin 55 or location hole 7451,7461 and internal face 7452 connect The tolerance of size B, the terminal 753 of IC sockets 750 between the side of the sub- HB and IC devices of contravention and between internal face 7452 The tolerance of size C between the tolerance and positioning pin 55 of size B or the terminal 753 of 7451,7461 and IC of location hole sockets 750. Therefore, it is possible to further increase IC devices external contact terminal HB and IC socket 750 terminal 753 positioning accuracy.

Figure 12 and Figure 13 is the sectional view for the component carrier 710 for indicating other embodiment.In addition, only will be corresponding with Fig. 9 Structure indicate that described below, but structure corresponding with Figure 10 and structure corresponding with Fig. 9 are identical in fig. 11, because This, illustration omitted omits a part of explanation.

As shown in the drawing, in the component carrier of present embodiment 710, IC sockets 750 can be filled relative to core main body 740 It is arranged with tearing open.It is equipped with hook portion 770 in the bottom surface of bar receiving portion 743, hook portion 770 also is provided in the bottom surface of positioning region 745.This Hook portion 770 is engaged with the flange 751 of IC sockets 750, by IC sockets 750 in the state of left and right directions in being positioned at figure into Row is kept.

The hook portion 770 for being set to the bottom surface of positioning region 745 is fixed.On the other hand, it is set to the bottom of bar receiving portion 743 The hook portion 770 in face is as shown, is configured in the position engaged with flange 751 and the position separated with flange 751 (diagram is omitted) Between move.Here, hook portion 770 of the pressing mechanism 760 by IC sockets 750 relative to stationary state presses.

As described above, in the component carrier of present embodiment 710, have multiple hook portions 770, multiple hook portion 770 It is set to the bottom of core main body 740, dismantledly keeps the flange 751 of IC sockets 750.As a result, by making IC sockets 750 For the replacement of the part of least unit, the replacement of the type of IC devices or the consumption of IC sockets 750 are coped with.

In addition, pressing mechanism 760 is pressed by the hook portion 770 by IC sockets 750 relative to stationary state, it can IC sockets 750 are dismantledly installed relative to core main body 740, and can be by the IC sockets 750 with the abutting with hook portion 770 Point is positioned relative to location hole 7451 and positioning pin 55 on the basis of point.

Figure 14 is the sectional view for the component carrier 710 for indicating other embodiment.In addition, it is as shown in the drawing, in this implementation In the component carrier 710 of mode, location hole 7451,7461 is arranged at the center of riveting parts 749.It as a result, need not be in positioning region 745,746 settings are used to form the private space of location hole 7451,7461.Thus, it is possible to which core main body 740 is made to minimize.

Figure 15 and Figure 16 is the sectional view of the method for illustrating IC sockets 750 being mounted on core main body 740.Such as these Shown in figure, after the positioning for carrying out IC sockets 750 and core main body 740, by hot riveting, the flange 751 of IC sockets 750 is consolidated It is scheduled on the bottom surface of core main body 740.

First, prepare IC sockets 750 and core main body 740.Multiple opening 751A are formed in the flange 751 of IC sockets 750. Multiple boss 749B are formed in the bottom surface of core main body 740.The position pair of the position of multiple boss 749B and multiple opening 751A It answers.In addition, opening 751A diameter bigger of the diameter than boss 749B, IC sockets 750 relative to core main body 740 planar It can fine motion (loosening).

Then, IC sockets 750 are configured to the bottom of core main body 740.At this moment, multiple boss 749B are directed at and multiple are opened The position of mouth 751A, by whole boss 749B insertion openings 751A.Here, in the top of location hole 7451,7461 and in IC Camera 8 is set closest to the top of the terminal 753 of location hole 7451,7461 in multiple terminals 753 of socket 750.By fixed The camera 8 of the top in position hole 7451 shoots location hole 7451, passes through the top of the terminal 753 closest to location hole 7451 Camera 8 shoots the terminal 753.By parsing the shooting image of these cameras 8, location hole 7451 is detected and closest to calmly The opposite dislocation of the terminal 753 in position hole 7451.On the other hand, it is shot and is positioned by the camera 8 of the top of location hole 7461 Hole 7461 shoots the terminal 753 by the camera 8 of the top of the terminal 753 closest to location hole 7461.By parsing this The shooting image of a little cameras 8 detects location hole 7461 and closest to the opposite dislocation of the terminal 753 of location hole 7461.And And in order to make location hole 7451 and closest to location hole 7451 terminal 753 opposite dislocation and location hole 7461 and most connect The opposite dislocation of the terminal 753 of nearly location hole 7461 is included in permissible range, makes IC sockets 750 relative to 740 phase of core main body It planar moves over the ground.

Then, riveting parts 749 (with reference to Fig. 9 etc.) are formed, are pressed from both sides by using the bottom surface of the riveting parts 749 and core main body 740 The flange 751 of IC sockets 750, is fixed on the bottom surface of core main body 740 by the firmly flange 751 of IC sockets 750.In this process, lead to It crosses and boss 749B is pressurizeed from front end side to base end side using resin rivet hot connection device (not shown) and makes its thermal deformation, formed Riveting parts 749.Thereby, it is possible to manufacture the device of the path for the external contact terminal HB that can cope with IC devices and fine-pitch Part carrier 710.

In addition, embodiments described above be for easy understanding the present invention and records, rather than in order to limit What invention was recorded.To which each element disclosed in above-mentioned embodiment is to include the whole for the technical scope for belonging to the present invention Design alteration or equipollent objective.

For example, in the above-described embodiment, pressing mechanism 760,761 is arranged, by IC devices to the inner wall as reference plane Face 7452,7462 presses, but it's not necessary.For example, it is also possible to by internal face 7432 around IC devices, 7442, 7452,7462 the position etc. in the plane of IC devices is determined.

Description of symbols

1 processor

5 measuring heads

6 testers

7 cables

8 cameras

50 sockets

51 terminals

55 positioning pins

100 test departments

101 device base stations

102 tray conveying devices

110 equal hot cells

120 test cabinets

121 pushers

130 remove hot cell

200 storage parts

Accumulator before 201 experiments

Accumulator is completed in 202 experiments

203 tray supporting frames

204 elevators

205 tray conveying arms

300 loading parts

310 device transport apparatus

311 tracks

312 moveable arms

320 moving heads

360 precise localizers

370 window portions

400 uninstalling portion

410 device transport apparatus

470 window portions

TST test pallets

700 frames

701 outline borders

702 inside casings

703 openings

710 component carriers

720 main bodys

721 openings

7211 internal faces

722 holding sections

730 cores

740 core main bodys

741 openings

742 claws

7421 axle portions

7422 engagement pawl

743,744 bar receiving portion

7431,7441 outside wall surface

7432,7442 internal face

7432A, 7442A are open

7433,7443 protrusion

745,746 positioning region

7451,7461 location hole

7452,7462 internal face

749 riveting parts

749B boss

750 IC sockets

751 flanges

751A is open

752 openings

753 terminals

760,761 pressing mechanism

7601,7611 bar

The press section 7601A, 7611A

7601B, 7611B spring seat portions

The protrusion 7601C, 7611C

7601D, 7611D plane

7602,7612 spring

770 hook portions

Claims (6)

1. It, will 1. a kind of carrier of device for testing electronic parts is set to the pallet conveyed in device for testing electronic parts Multiple external contact terminals are maintained at by test electron part on the socket from bottom surface is outstanding, the electronic component experiment The socket that device has tester and connect with the tester, which is characterized in that the load of the device for testing electronic parts Body has：

   IC sockets have and are correspondingly arranged with the multiple external contact terminal and via the socket and the test Multiple terminals of device connection, mounting are described by test electron part；

   First main part is formed as cyclic annular in a manner of around the part by test electron, and is equipped in bottom described IC sockets；And

   Second main part is installed on the frame of the pallet, and is dismantledly equipped with first main part,

   It is formed in first main part chimeric with from positioning pin outstanding around the socket or the socket Location hole,

   First main part planar can be installed relatively movably relative to second main part.
2. 2. the carrier of device for testing electronic parts according to claim 1, which is characterized in that

   First main part has one by test electron part into multiple internal faces of first main part by described The pressing mechanism of a internal face pressing.
3. 3. the carrier of device for testing electronic parts according to claim 1 or 2, which is characterized in that

   First main part has multiple claws, and the claw is set to the bottom, dismantledly keeps the IC sockets Peripheral part.
4. 4. the carrier of device for testing electronic parts according to claim 1, which is characterized in that

   First main part has：

   Pressing mechanism, by an internal face by test electron part into multiple internal faces of first main part Pressing；And

   Multiple claws, are set to the bottom, dismantledly keep the peripheral part of the IC sockets,

   The pressing mechanism presses the IC sockets to either one or two of the multiple claw.
5. 5. the carrier of device for testing electronic parts according to claim 1, which is characterized in that

   First main part has riveting parts, and the riveting parts are set to the bottom, and the IC sockets are fixed on institute Bottom is stated,

   The location hole is set to the riveting parts.
6. 6. a kind of manufacturing method of the carrier of device for testing electronic parts, which is characterized in that appoint in manufacturing claims 1~5 The carrier of device for testing electronic parts described in one,

   Multiple openings are formed in the peripheral part of the IC sockets,

   Multiple boss of the diameter more path than the opening are formed in the bottom surface of first main part,

   The boss is inserted in the opening, by the location hole and the terminal relative alignment,

   By making the boss deform, by the bottom surface riveting of the peripheral part of the IC sockets and first main part It connects.