JPS54133449A - Solder for aluminum and aluminum alloy - Google Patents
Solder for aluminum and aluminum alloyInfo
- Publication number
- JPS54133449A JPS54133449A JP4025478A JP4025478A JPS54133449A JP S54133449 A JPS54133449 A JP S54133449A JP 4025478 A JP4025478 A JP 4025478A JP 4025478 A JP4025478 A JP 4025478A JP S54133449 A JPS54133449 A JP S54133449A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- aluminum
- improved
- small quantity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:Low temperature solder for Al, Al alloy improved wettability and anticorrosive property, by adding a small quantity of Zn and Ag to Pb-Sb alloy. CONSTITUTION:Solder composed of Sb; 3-15wt.%, Zn; 1.0-5%, Ag; 0.1-5%, balance; Pb and having about 250 deg.C of melting point. By using the above solder, wettability with Al, Al alloy is improved by adding a small quantity of Zn to the basic component Pb-Sb and moreover, anticorrosive property is improved by adding a small quantity of Ag. Soldering of Al, Al alloy is able to carry out by usual soldering method without using flux eapecially. Also, superior workability is able to attain because the solder is melted about 250 deg.C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4025478A JPS54133449A (en) | 1978-04-07 | 1978-04-07 | Solder for aluminum and aluminum alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4025478A JPS54133449A (en) | 1978-04-07 | 1978-04-07 | Solder for aluminum and aluminum alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54133449A true JPS54133449A (en) | 1979-10-17 |
Family
ID=12575542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4025478A Pending JPS54133449A (en) | 1978-04-07 | 1978-04-07 | Solder for aluminum and aluminum alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54133449A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2387347A (en) * | 2002-04-09 | 2003-10-15 | Ford Motor Co | Tin and Zinc-based solder fillers for aluminium body parts and methods of applying the same |
-
1978
- 1978-04-07 JP JP4025478A patent/JPS54133449A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2387347A (en) * | 2002-04-09 | 2003-10-15 | Ford Motor Co | Tin and Zinc-based solder fillers for aluminium body parts and methods of applying the same |
US6840434B2 (en) | 2002-04-09 | 2005-01-11 | Ford Motor Company | Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same |
GB2387347B (en) * | 2002-04-09 | 2005-09-14 | Ford Motor Co | Tin-based solder fillers for aluminium body parts and methods of applying the same |
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