JPS54100941A - Low temperature fusion plating material - Google Patents

Low temperature fusion plating material

Info

Publication number
JPS54100941A
JPS54100941A JP775678A JP775678A JPS54100941A JP S54100941 A JPS54100941 A JP S54100941A JP 775678 A JP775678 A JP 775678A JP 775678 A JP775678 A JP 775678A JP S54100941 A JPS54100941 A JP S54100941A
Authority
JP
Japan
Prior art keywords
layer
plating material
low temperature
alloy
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP775678A
Other languages
Japanese (ja)
Inventor
Sumio Sawada
Takehiko Shinoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP775678A priority Critical patent/JPS54100941A/en
Publication of JPS54100941A publication Critical patent/JPS54100941A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:An In layer is plated on Sn-Pb alloy plated substrate to provide an economical low temperature fusion plating material having an easily controllable thickness and easy soldability at low temperatures. CONSTITUTION:A low temperature fusion material 1 consistis of Sn-Pb alloy layer 3 and In layer 4. The Sn-Pb layer 3 consists of 57 to 67% of Sn and 43 to 33% of Pb. The In layer 4 occupies 14 to 30% by weight of total plating material. Both plating layers 3 and 4 are preferably electroplated for thickness control, but when a thicker Sn-Pb layer 3 is used, the layer 3 can be plated by molten plating. When soldering a unit element 5 to a substrate 2, the unit 5 is placed on the In layer 4 and heat is applied to solder portion or to total assembly. As soon as In layer 4 is molten, the Sn-Pb alloy layer is melted into the In layer to form sufficient amount of ternary alloy to effecturate bonding of the unit 5 and the substrate 2 such as wire or plate. This inventive plating material solders at a temperature 30 to 40 deg.C lower than conventional Sn-Pb plating material.
JP775678A 1978-01-25 1978-01-25 Low temperature fusion plating material Pending JPS54100941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP775678A JPS54100941A (en) 1978-01-25 1978-01-25 Low temperature fusion plating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP775678A JPS54100941A (en) 1978-01-25 1978-01-25 Low temperature fusion plating material

Publications (1)

Publication Number Publication Date
JPS54100941A true JPS54100941A (en) 1979-08-09

Family

ID=11674531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP775678A Pending JPS54100941A (en) 1978-01-25 1978-01-25 Low temperature fusion plating material

Country Status (1)

Country Link
JP (1) JPS54100941A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959278A (en) * 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
EP0834376A4 (en) * 1995-06-20 2003-01-22 Matsushita Electric Ind Co Ltd Solder, and soldered electronic component and electronic circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959278A (en) * 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
EP0834376A4 (en) * 1995-06-20 2003-01-22 Matsushita Electric Ind Co Ltd Solder, and soldered electronic component and electronic circuit board

Similar Documents

Publication Publication Date Title
JP2001035978A (en) Lead-free solder connection structure body
KR960029492A (en) Manufacturing method of reflow plating member, reflow plating member obtained by the method
US5508562A (en) Outer electrode structure for a chip type electronic part appropriate for reflow soldering
JPS54100941A (en) Low temperature fusion plating material
JPS5586130A (en) Connection of semiconductor element
JPS54159173A (en) Construction of bump electrode
JPS575851A (en) Production of frame material for glass
EP0144998A3 (en) Rapid solidified soldering filler metals
JPS5474248A (en) Clad solder
JPS5596662A (en) Electronic component member
JPS58127355A (en) Lead frame
GB1438842A (en) Liquid interface diffusion method of bonding parts made of titanium or titanium based alloy
JPS5752590A (en) Au alloy brazing filler metal of low melting point
JPS57149759A (en) Tape carrier for semiconductor
JPS5468752A (en) Conductive material of substrate for holding electronic parts
JPS58182839A (en) Semiconductor device
JPS5684432A (en) Gold brazing material
JPS54133449A (en) Solder for aluminum and aluminum alloy
JPS5662672A (en) Connection method of cu or cu alloy
SONNENSCHEIN et al. Method for attaching a fused-quartz mirror to a conductive metal substrate[Patent]
JPS57211763A (en) Surface treatment for lead frame for semiconductor
JPS57152134A (en) Semiconductor device
JPS5472676A (en) Lead frame having alloy intermediate layer
JPS5739190A (en) Preparation of solder plated or tin plated wire
JPS6427233A (en) Pellet for junction