JPS6427233A - Pellet for junction - Google Patents

Pellet for junction

Info

Publication number
JPS6427233A
JPS6427233A JP18223187A JP18223187A JPS6427233A JP S6427233 A JPS6427233 A JP S6427233A JP 18223187 A JP18223187 A JP 18223187A JP 18223187 A JP18223187 A JP 18223187A JP S6427233 A JPS6427233 A JP S6427233A
Authority
JP
Japan
Prior art keywords
aux1
bonded
layer
pellet
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18223187A
Other languages
Japanese (ja)
Other versions
JP2673988B2 (en
Inventor
Mitsuo Inagaki
Hiroyasu Sugiki
Yasuhide Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62182231A priority Critical patent/JP2673988B2/en
Publication of JPS6427233A publication Critical patent/JPS6427233A/en
Application granted granted Critical
Publication of JP2673988B2 publication Critical patent/JP2673988B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Abstract

PURPOSE:To prevent a later component from remelting when it is heated to mount it by adding a metal layer to be easily diffused in a bonding material layer when the bonding material layer is melted to the material layer. CONSTITUTION:A pellet 12 for a junction is heated to a temperature slightly over an initial melting point, and then stopped for the heating. Aux1 Sn 1-x1 layers 13, 14 are melted, solidified, and the pellet 12 becomes a junction 19, and pair LSIs 2 are bonded by a bonded part 19 to a substrate 6. The Au of an Au layer 15 is diffused in the Aux1 Sn1-x1 like an arrow 18, the atomic fraction of the Au of the Aux1 Sn1-x1 is increased from x1 to x2, the Aux1 Sn1-x1 is varied in its alloy composition to become an Aux2 Sn1-x2. Thus, its melting point is raised from the initial melting point, the bonded part 19 is composed of the Aux1 Sn1-x2 layers 20, 21 at the top and bottom and the layer 15 at the intermediate, and it can prevent the bonded part already bonded at the time of bonding a later component from remelting.
JP62182231A 1987-07-23 1987-07-23 Pellets for joining Expired - Fee Related JP2673988B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62182231A JP2673988B2 (en) 1987-07-23 1987-07-23 Pellets for joining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62182231A JP2673988B2 (en) 1987-07-23 1987-07-23 Pellets for joining

Publications (2)

Publication Number Publication Date
JPS6427233A true JPS6427233A (en) 1989-01-30
JP2673988B2 JP2673988B2 (en) 1997-11-05

Family

ID=16114637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62182231A Expired - Fee Related JP2673988B2 (en) 1987-07-23 1987-07-23 Pellets for joining

Country Status (1)

Country Link
JP (1) JP2673988B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132968A (en) * 1975-05-14 1976-11-18 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132968A (en) * 1975-05-14 1976-11-18 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JP2673988B2 (en) 1997-11-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees