JPS6437077A - Reflow soldering - Google Patents
Reflow solderingInfo
- Publication number
- JPS6437077A JPS6437077A JP19263487A JP19263487A JPS6437077A JP S6437077 A JPS6437077 A JP S6437077A JP 19263487 A JP19263487 A JP 19263487A JP 19263487 A JP19263487 A JP 19263487A JP S6437077 A JPS6437077 A JP S6437077A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- component
- chip component
- fine vibration
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To reduce soldering defects and reduce man-hours for solder amendment in a later process significantly by applying a fine vibration to a mounted component in a solder melting process. CONSTITUTION:When solder is heated to the temperature higher than the solder melting point in a solder melting process and the solder is in the melted state, a fine vibration such as an ultrasonic vibration is applied to a chip component 6 by a fine vibration generator 1. Therefore, the friction resistance between the melted solder and the chip component is reduced and self-alignment is effectively achieved so that the chip component can be matched with the center of a land and the solder is solidified as it is by a cooling process and a solder connection is achieved. With this constitution, soldering defects such as the discrepancy of the component can be avoided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19263487A JPS6437077A (en) | 1987-08-03 | 1987-08-03 | Reflow soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19263487A JPS6437077A (en) | 1987-08-03 | 1987-08-03 | Reflow soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437077A true JPS6437077A (en) | 1989-02-07 |
Family
ID=16294515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19263487A Pending JPS6437077A (en) | 1987-08-03 | 1987-08-03 | Reflow soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437077A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5048746A (en) * | 1989-12-08 | 1991-09-17 | Electrovert Ltd. | Tunnel for fluxless soldering |
JPH06260744A (en) * | 1992-07-09 | 1994-09-16 | Tsuda Seisakusho:Yugen | Printed circuit board manufacturing method and device |
JPH08330722A (en) * | 1995-05-30 | 1996-12-13 | Nec Corp | Method of soldering electronic part |
EP1195217A1 (en) * | 1999-06-11 | 2002-04-10 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
-
1987
- 1987-08-03 JP JP19263487A patent/JPS6437077A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5048746A (en) * | 1989-12-08 | 1991-09-17 | Electrovert Ltd. | Tunnel for fluxless soldering |
JPH06260744A (en) * | 1992-07-09 | 1994-09-16 | Tsuda Seisakusho:Yugen | Printed circuit board manufacturing method and device |
JPH08330722A (en) * | 1995-05-30 | 1996-12-13 | Nec Corp | Method of soldering electronic part |
EP1195217A1 (en) * | 1999-06-11 | 2002-04-10 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
US6702175B1 (en) | 1999-06-11 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2135794A1 (en) | Tin-Bismuth Solder Connection Having Improved High Temperature Properties, and Process for Forming Same | |
FR2279306B1 (en) | ||
CA2030865A1 (en) | Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board | |
JPS6413735A (en) | Method of mounting semiconductor device and mounted semiconductor device | |
EP0297511A3 (en) | Connection structure between components for semiconductor apparatus | |
FR2392758A1 (en) | GOLD LAYER WELDING PROCESS | |
ATE167098T1 (en) | WELDING PROCESS BY MELTING CAST IRON COMPONENTS WITH SPHERICAL GRAPHITE | |
GB8626254D0 (en) | Solder preform | |
JPS6437077A (en) | Reflow soldering | |
JPS57190768A (en) | Soldering method for parts | |
JPS5389368A (en) | Production of semiconductor integrated circuit | |
Lodge et al. | Methods of Joining Components | |
JPS5575893A (en) | Production of solder | |
Lodge et al. | Methods of Joining Components by Laser Soldering | |
JPS644051A (en) | Formation of bump of hand drum shape | |
KR970030543A (en) | Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame | |
JPH08111581A (en) | Method of soldering ball grid array printed wiring board | |
JPS5668579A (en) | Connecting method by melting solder | |
JPS5764473A (en) | Method for supersonic preliminary soldering | |
JPS6431449A (en) | Lead frame for semiconductor device | |
JPS57192057A (en) | Semiconductor device | |
Boynton | Soldering Flux | |
ES440185A1 (en) | Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding) | |
JPS56161662A (en) | Semiconductor device | |
Socolowski | Solder Preform and Methods Employing the Same |