JPS6437077A - Reflow soldering - Google Patents

Reflow soldering

Info

Publication number
JPS6437077A
JPS6437077A JP19263487A JP19263487A JPS6437077A JP S6437077 A JPS6437077 A JP S6437077A JP 19263487 A JP19263487 A JP 19263487A JP 19263487 A JP19263487 A JP 19263487A JP S6437077 A JPS6437077 A JP S6437077A
Authority
JP
Japan
Prior art keywords
solder
component
chip component
fine vibration
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19263487A
Other languages
Japanese (ja)
Inventor
Masaru Denda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19263487A priority Critical patent/JPS6437077A/en
Publication of JPS6437077A publication Critical patent/JPS6437077A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce soldering defects and reduce man-hours for solder amendment in a later process significantly by applying a fine vibration to a mounted component in a solder melting process. CONSTITUTION:When solder is heated to the temperature higher than the solder melting point in a solder melting process and the solder is in the melted state, a fine vibration such as an ultrasonic vibration is applied to a chip component 6 by a fine vibration generator 1. Therefore, the friction resistance between the melted solder and the chip component is reduced and self-alignment is effectively achieved so that the chip component can be matched with the center of a land and the solder is solidified as it is by a cooling process and a solder connection is achieved. With this constitution, soldering defects such as the discrepancy of the component can be avoided.
JP19263487A 1987-08-03 1987-08-03 Reflow soldering Pending JPS6437077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19263487A JPS6437077A (en) 1987-08-03 1987-08-03 Reflow soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19263487A JPS6437077A (en) 1987-08-03 1987-08-03 Reflow soldering

Publications (1)

Publication Number Publication Date
JPS6437077A true JPS6437077A (en) 1989-02-07

Family

ID=16294515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19263487A Pending JPS6437077A (en) 1987-08-03 1987-08-03 Reflow soldering

Country Status (1)

Country Link
JP (1) JPS6437077A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
JPH06260744A (en) * 1992-07-09 1994-09-16 Tsuda Seisakusho:Yugen Printed circuit board manufacturing method and device
JPH08330722A (en) * 1995-05-30 1996-12-13 Nec Corp Method of soldering electronic part
EP1195217A1 (en) * 1999-06-11 2002-04-10 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
JPH06260744A (en) * 1992-07-09 1994-09-16 Tsuda Seisakusho:Yugen Printed circuit board manufacturing method and device
JPH08330722A (en) * 1995-05-30 1996-12-13 Nec Corp Method of soldering electronic part
EP1195217A1 (en) * 1999-06-11 2002-04-10 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method
US6702175B1 (en) 1999-06-11 2004-03-09 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method

Similar Documents

Publication Publication Date Title
CA2135794A1 (en) Tin-Bismuth Solder Connection Having Improved High Temperature Properties, and Process for Forming Same
FR2279306B1 (en)
CA2030865A1 (en) Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
JPS6413735A (en) Method of mounting semiconductor device and mounted semiconductor device
EP0297511A3 (en) Connection structure between components for semiconductor apparatus
FR2392758A1 (en) GOLD LAYER WELDING PROCESS
ATE167098T1 (en) WELDING PROCESS BY MELTING CAST IRON COMPONENTS WITH SPHERICAL GRAPHITE
GB8626254D0 (en) Solder preform
JPS6437077A (en) Reflow soldering
JPS57190768A (en) Soldering method for parts
JPS5389368A (en) Production of semiconductor integrated circuit
Lodge et al. Methods of Joining Components
JPS5575893A (en) Production of solder
Lodge et al. Methods of Joining Components by Laser Soldering
JPS644051A (en) Formation of bump of hand drum shape
KR970030543A (en) Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame
JPH08111581A (en) Method of soldering ball grid array printed wiring board
JPS5668579A (en) Connecting method by melting solder
JPS5764473A (en) Method for supersonic preliminary soldering
JPS6431449A (en) Lead frame for semiconductor device
JPS57192057A (en) Semiconductor device
Boynton Soldering Flux
ES440185A1 (en) Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)
JPS56161662A (en) Semiconductor device
Socolowski Solder Preform and Methods Employing the Same