KR970030543A - Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame - Google Patents

Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame Download PDF

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Publication number
KR970030543A
KR970030543A KR1019960019377A KR19960019377A KR970030543A KR 970030543 A KR970030543 A KR 970030543A KR 1019960019377 A KR1019960019377 A KR 1019960019377A KR 19960019377 A KR19960019377 A KR 19960019377A KR 970030543 A KR970030543 A KR 970030543A
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KR
South Korea
Prior art keywords
joining
substrate
solder
lead frame
bonding
Prior art date
Application number
KR1019960019377A
Other languages
Korean (ko)
Inventor
이사오 아라가와
요시노리 히라다
가즈또 마쯔나가
타카하루 아리조노
Original Assignee
키타오카 타카시
미쓰비시 덴키 가부시끼 가이샤
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Publication date
Application filed by 키타오카 타카시, 미쓰비시 덴키 가부시끼 가이샤 filed Critical 키타오카 타카시
Publication of KR970030543A publication Critical patent/KR970030543A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 접합시 산화 방지 가스 및 환원 가스의 공급이 불필요한 반도체칩 등의 부품을 리드 프레임 등의 기판에 접합하기 위한 접합방법 및 장치를 제공한다.The present invention provides a bonding method and apparatus for joining a component such as a semiconductor chip, which does not require the supply of an antioxidant gas and a reducing gas, to a substrate such as a lead frame.

본 발명의 접합방법은 기판상에 부품이 접합되는 접합위치에 땜납 또는 은땜납 등의 접합재료를 공급하는 단계와, 부품을 예열함과 동시에, 부품을 접합재료에 접촉시키는 단계와, 기판의 접합재료가 공급된 위치를 그의 뒷측면부터 가열하여 접합재료를 용융시키는 단계를 포함한다. 또한, 본 발명의 접합장치는 기판의 부품이 접합되는 접합위치에 땜납 또는 은땜납 등의 접합재료를 공급하는 수단과, 부품을 예열하는 수단과, 부품을 접합재료에 접촉시키는 수단과, 기판의 접합재료가 공급된 위치를 그의 뒷측면부터 가열하여 상기 접합재료를 용융시키는 수단을 포함한다.The joining method of the present invention comprises the steps of supplying a joining material such as solder or silver solder to a joining position where a part is joined on a substrate, preheating the part and contacting the part with the joining material, and joining the substrate. Heating the location from which the material is supplied from its back side to melt the bonding material. Further, the bonding apparatus of the present invention includes a means for supplying a joining material such as solder or silver solder to a joining position where a part of a substrate is joined, a means for preheating the part, a means for contacting the part with the joining material, Means for heating the position where the bonding material is supplied from its rear side to melt the bonding material.

Description

기판상의 부품접합 방법 및 장치와 리드 프레임상의 반도체칩 접합방법 및 장치Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 제1실시예에 따라 반도체칩을 리드 프레임에 접합하는 장치의 전체구성을 도시한 도면.1 is a diagram showing the overall configuration of an apparatus for bonding a semiconductor chip to a lead frame according to the first embodiment of the present invention.

Claims (4)

부품을 기판에 접합하기 위한 방법에 있어서, 상기 기판의 상기 부품이 접합되는 접합위치에 접합재료를 공급하는 단계와; 상기 부품을 예열함과 동시에, 상기 부품을 상기 접합재료에 접촉시키는 단계와; 상기 기판의 상기 접합재료가 공급된 위치를 그의 뒷측면으로부터 가열하여 상기 접합재료를 용융시키는 단계를 포함하는 것을 특징으로 하는 기판에 대한 부품의 접합방법.CLAIMS 1. A method for bonding a component to a substrate, comprising: supplying a bonding material to a bonding position at which the component of the substrate is bonded; Preheating the component and contacting the component with the bonding material; And melting the bonding material by heating the position where the bonding material of the substrate is supplied from its rear side to melt the bonding material. 부품을 기판에 접합하기 위한 장치에 있어서, 상기 기판의 상기 부품의 접합되는 접합위치에 접합재료를 공급하는 수단과; 상기 부품을 예열하는 수단과; 상기 부품을 상기 접합재료에 접촉시키는 수단과; 상기 기판의 상기 접합재료가 공급된 위치를 그의 뒷측면으로부터 가열하여 상기 접합재료를 용융시키는 수단을 포함하는 것을 특징으로 하는 기판에 대한 부품의 접합장지.An apparatus for joining a part to a substrate, comprising: means for supplying a joining material to a joining position at which the part of the substrate is joined; Means for preheating the component; Means for contacting the component with the bonding material; And means for heating the position at which the bonding material of the substrate is supplied from its rear side to melt the bonding material. 반도체칩을 리드 프레임에 접합하기 위한 방법에 있어서, 상기 리드 프레임의 다이패드상에 땜납을 공급하는 단계와; 상기 반도체칩을 예열함과 동시에, 상기 반도체칩을 상기 땜납에 접촉시키는 단계와; 상기 다이패드를 상기 땜납이 공급된 면의 뒷측으로부터 가열하여 상기 땜납을 용융시키는 단계를 포함하는 것을 특징으로 하는 리드프레임에 대한 반도체 칩의 접합방법.CLAIMS 1. A method for bonding a semiconductor chip to a lead frame, comprising: supplying solder on a die pad of the lead frame; Preheating the semiconductor chip and contacting the semiconductor chip with the solder; And heating the die pad from the back side of the surface to which the solder is supplied to melt the solder. 반도체칩을 리드프레임에 접합하기 위한 장치에 있어서, 상기 리드프레임의 다이패드상에 땜납을 공급하는 수단과; 상기 반도체칩을 예열하는 수단과; 상기 반도체칩을 상기 땜납에 접촉시키는 수단과; 상기 다이패드를 상기 땜납이 공급된 면의 뒷측으로부터 가열하여 상기 땜납을 용융시키는 수단을 포함하는 것을 특징으로 하는 리드프레임에 대한 반도체 칩의 접합장치.An apparatus for joining a semiconductor chip to a lead frame, comprising: means for supplying solder on a die pad of the lead frame; Means for preheating the semiconductor chip; Means for contacting the semiconductor chip with the solder; And means for heating the die pad from the back side of the surface to which the solder is supplied to melt the solder. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960019377A 1995-11-08 1996-05-31 Method and apparatus for joining components on substrate and method and apparatus for joining semiconductor chips on lead frame KR970030543A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-290011 1995-11-08
JP29001195 1995-11-08

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KR970030543A true KR970030543A (en) 1997-06-26

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TW (1) TW359881B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10147789B4 (en) 2001-09-27 2004-04-15 Infineon Technologies Ag Device for soldering contacts on semiconductor chips
DE112007001029B4 (en) * 2006-04-28 2014-07-17 Denso Corporation Lötformteil, its production and electronic component
CN101229602B (en) * 2008-01-24 2010-06-02 石开轩 Method of welding thermistance chip and down lead
CN102035934A (en) * 2009-09-30 2011-04-27 李晓 Dual-screen portable electronic equipment and management method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5166855A (en) * 1974-12-05 1976-06-09 Sumitomo Metal Ind Kannaiidobutsutaino ichikenchihoho
JPH0376236A (en) * 1989-08-18 1991-04-02 Fujitsu Ltd Bonding

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CN1150329A (en) 1997-05-21
TW359881B (en) 1999-06-01
CN1079992C (en) 2002-02-27

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