JPS644051A - Formation of bump of hand drum shape - Google Patents

Formation of bump of hand drum shape

Info

Publication number
JPS644051A
JPS644051A JP62157648A JP15764887A JPS644051A JP S644051 A JPS644051 A JP S644051A JP 62157648 A JP62157648 A JP 62157648A JP 15764887 A JP15764887 A JP 15764887A JP S644051 A JPS644051 A JP S644051A
Authority
JP
Japan
Prior art keywords
bumps
chip
solders
base
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62157648A
Other languages
Japanese (ja)
Inventor
Toshihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62157648A priority Critical patent/JPS644051A/en
Publication of JPS644051A publication Critical patent/JPS644051A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To easily form bumps of a chip to be hand-drum shape by a method wherein the bumps for the chip are formed by using an identical material and a material whose melting point is higher than that of the bumps is laid at a sealing part of a package. CONSTITUTION:An upper face of a chip 1 where two or more bumps 2 have been formed on its rear surface is fixed to an inner ceiling face of a cap 3 by using a solder 4. Two or more preliminary solders 13 are attached to the surface of a package base 12; preformed solders 14 with an appropriate thickness are laid at a sealing part between the cap 3 and the base 12; this assembly is passed inside a heating furnace. The solders 14 whose melting point is higher than that of the solder constituting parts 11 of the bumps 2 are used. By this setup, the pads 11 of the initial bumps 2 and the preliminary solders 13 (of the same composition as the pad 11) are melted, and the chip 1 and the base 12 are connected by bumps 15 as shown in the figure. Then, the cap 3 is raised upward due to a melting action of the solders 14. As a result, the bumps 15 are extended in a longitudinal direction; bumps 16 all of which are shaped like a hand drum are formed; the chip 1 and the base 12 are connected.
JP62157648A 1987-06-26 1987-06-26 Formation of bump of hand drum shape Pending JPS644051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157648A JPS644051A (en) 1987-06-26 1987-06-26 Formation of bump of hand drum shape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157648A JPS644051A (en) 1987-06-26 1987-06-26 Formation of bump of hand drum shape

Publications (1)

Publication Number Publication Date
JPS644051A true JPS644051A (en) 1989-01-09

Family

ID=15654319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157648A Pending JPS644051A (en) 1987-06-26 1987-06-26 Formation of bump of hand drum shape

Country Status (1)

Country Link
JP (1) JPS644051A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189926A (en) * 1989-01-18 1990-07-25 Nec Corp Semiconductor integrated circuit device
US4949586A (en) * 1988-11-07 1990-08-21 Intelmatic Corp. Actuator swing arm mechanism
JPH04283951A (en) * 1991-03-13 1992-10-08 Nec Corp Semiconductor device
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189676U (en) * 1983-06-01 1984-12-15 カルソニックカンセイ株式会社 Bar graph display device
JPS61205901U (en) * 1985-06-14 1986-12-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189676U (en) * 1983-06-01 1984-12-15 カルソニックカンセイ株式会社 Bar graph display device
JPS61205901U (en) * 1985-06-14 1986-12-26

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949586A (en) * 1988-11-07 1990-08-21 Intelmatic Corp. Actuator swing arm mechanism
JPH02189926A (en) * 1989-01-18 1990-07-25 Nec Corp Semiconductor integrated circuit device
JPH04283951A (en) * 1991-03-13 1992-10-08 Nec Corp Semiconductor device
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board

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