JPS5513985A - Ic mounting structure - Google Patents

Ic mounting structure

Info

Publication number
JPS5513985A
JPS5513985A JP8759578A JP8759578A JPS5513985A JP S5513985 A JPS5513985 A JP S5513985A JP 8759578 A JP8759578 A JP 8759578A JP 8759578 A JP8759578 A JP 8759578A JP S5513985 A JPS5513985 A JP S5513985A
Authority
JP
Japan
Prior art keywords
recess
pattern
bump
soldering bump
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8759578A
Other languages
Japanese (ja)
Inventor
Hiroyuki Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP8759578A priority Critical patent/JPS5513985A/en
Publication of JPS5513985A publication Critical patent/JPS5513985A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent the melted solder from swelling out of the circuit pattern by providing the recess on the pattern which position corresponds to that of the soldering bump on the under side of IC.
CONSTITUTION: On a pattern 1 provided is a recess 1a which position corresponds to that of soldering bump 3 on the under side of IC 2. The diameter of the recess 1a is preferably almost same to the diameter of the slodering bump. Bonding is carried out by setting the soldering bump 3 of IC 2 in the recess 1a on the pattern and then hot-melting the solder. Thus, the soldering bump 3 is exactly positioned with the recess 1a on the pattern and bonding is effected without swelling the solder out of the recess 1a at melting. This will lead to the uniform condition in fusion at each soldering bump and high reliable and stable bonding.
COPYRIGHT: (C)1980,JPO&Japio
JP8759578A 1978-07-18 1978-07-18 Ic mounting structure Pending JPS5513985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8759578A JPS5513985A (en) 1978-07-18 1978-07-18 Ic mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8759578A JPS5513985A (en) 1978-07-18 1978-07-18 Ic mounting structure

Publications (1)

Publication Number Publication Date
JPS5513985A true JPS5513985A (en) 1980-01-31

Family

ID=13919341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8759578A Pending JPS5513985A (en) 1978-07-18 1978-07-18 Ic mounting structure

Country Status (1)

Country Link
JP (1) JPS5513985A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org
JPH0158657B2 (en) * 1980-08-05 1989-12-13 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh

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