JPS6461029A - Formation of bump electrode bond - Google Patents

Formation of bump electrode bond

Info

Publication number
JPS6461029A
JPS6461029A JP62218826A JP21882687A JPS6461029A JP S6461029 A JPS6461029 A JP S6461029A JP 62218826 A JP62218826 A JP 62218826A JP 21882687 A JP21882687 A JP 21882687A JP S6461029 A JPS6461029 A JP S6461029A
Authority
JP
Japan
Prior art keywords
bonded
bump electrode
electrodes
chips
electrode bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62218826A
Other languages
Japanese (ja)
Other versions
JPH0513537B2 (en
Inventor
Toshio Yamagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62218826A priority Critical patent/JPS6461029A/en
Publication of JPS6461029A publication Critical patent/JPS6461029A/en
Publication of JPH0513537B2 publication Critical patent/JPH0513537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

PURPOSE:To form a bump electrode bond which is sufficiently bonded and has high bonding rate by destroying an oxide film by bonding bump electrode so as to intrude them to each other. CONSTITUTION:Bump electrodes 3, 4 of soft metal are provided at the electrode connector of a pair of semiconductor chips 1, 2. The chips 1, 2 are faced, and so aligned that the corresponding electrodes 3, 4 are disposed at predetermined positions. Then, they are heated, the chips 1, 2 are pressed, and heated until the centers of the electrodes 3, 4 are deformed in the state intruded to each other. Then, an oxide film 5 is broken so that clean metal surface is presented at the bonded parts 6 of the electrodes 3, 4. Accordingly, they are sufficiently thermally press-bonded at the bonded parts 6. Thus, the bump electrode bond which are sufficiently bonded and has high bonding rate is formed.
JP62218826A 1987-08-31 1987-08-31 Formation of bump electrode bond Granted JPS6461029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62218826A JPS6461029A (en) 1987-08-31 1987-08-31 Formation of bump electrode bond

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218826A JPS6461029A (en) 1987-08-31 1987-08-31 Formation of bump electrode bond

Publications (2)

Publication Number Publication Date
JPS6461029A true JPS6461029A (en) 1989-03-08
JPH0513537B2 JPH0513537B2 (en) 1993-02-22

Family

ID=16725952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218826A Granted JPS6461029A (en) 1987-08-31 1987-08-31 Formation of bump electrode bond

Country Status (1)

Country Link
JP (1) JPS6461029A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148495A (en) * 1994-11-25 1996-06-07 Fujitsu Ltd Semiconductor device, manufacture thereof, and adhesion evaluation method of semiconductor device bump
US5722160A (en) * 1994-10-28 1998-03-03 Hitachi, Ltd. Packaging method of BGA type electronic component
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722160A (en) * 1994-10-28 1998-03-03 Hitachi, Ltd. Packaging method of BGA type electronic component
JPH08148495A (en) * 1994-11-25 1996-06-07 Fujitsu Ltd Semiconductor device, manufacture thereof, and adhesion evaluation method of semiconductor device bump
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor

Also Published As

Publication number Publication date
JPH0513537B2 (en) 1993-02-22

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Legal Events

Date Code Title Description
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