JPS5764473A - Method for supersonic preliminary soldering - Google Patents

Method for supersonic preliminary soldering

Info

Publication number
JPS5764473A
JPS5764473A JP14042780A JP14042780A JPS5764473A JP S5764473 A JPS5764473 A JP S5764473A JP 14042780 A JP14042780 A JP 14042780A JP 14042780 A JP14042780 A JP 14042780A JP S5764473 A JPS5764473 A JP S5764473A
Authority
JP
Japan
Prior art keywords
supersonic
solder
phone
soldered
amplitude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14042780A
Other languages
Japanese (ja)
Other versions
JPS6059070B2 (en
Inventor
Tadao Kushima
Tomiro Yasuda
Hiroshi Kato
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14042780A priority Critical patent/JPS6059070B2/en
Publication of JPS5764473A publication Critical patent/JPS5764473A/en
Publication of JPS6059070B2 publication Critical patent/JPS6059070B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To execute preliminary soldering of excellent quality, by changing the distance between a supersonic phone and the surface to be soldered and the amplitude of a supersonic wave, when supersonic preliminary soldering is performed on the surface of a metal without using any flux.
CONSTITUTION: A solder 12 composed of 95% Pb and 5% Sn is placed on the surface of a member to be soldered 1 in a non-oxidizing atmosphere, and the front end of a supersonic phone 13 is contacted to the solder 12. Then, the solder 12 is heated through the member to be soldered 1 by a heating plate 6 to a temperature which is higher than the melting point of the solder, and thus, the solder 12 is melted. A 30kHz supersonic vibration is applied to the supersonic phone 13 and the amplitude is gradually increased. As the amplitude is gradually increased, the distance between the end of the supersonic phone 13 and the surface of the member to be soldered 1 is gradually reduced, and then, the supersonic phone 13 is gradually separated from the surface. As the phone 13 is gradually separated from the surface, the amplitude of the supersonic vibration is gradually reduced. In this way, the molten solder is not oxidized and scattered, and, at the same time, preliminary soldering which are excellent in the wetting property and reliability is performed under a high solder yield.
COPYRIGHT: (C)1982,JPO&Japio
JP14042780A 1980-10-09 1980-10-09 Ultrasonic pre-soldering method Expired JPS6059070B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14042780A JPS6059070B2 (en) 1980-10-09 1980-10-09 Ultrasonic pre-soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14042780A JPS6059070B2 (en) 1980-10-09 1980-10-09 Ultrasonic pre-soldering method

Publications (2)

Publication Number Publication Date
JPS5764473A true JPS5764473A (en) 1982-04-19
JPS6059070B2 JPS6059070B2 (en) 1985-12-23

Family

ID=15268432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14042780A Expired JPS6059070B2 (en) 1980-10-09 1980-10-09 Ultrasonic pre-soldering method

Country Status (1)

Country Link
JP (1) JPS6059070B2 (en)

Also Published As

Publication number Publication date
JPS6059070B2 (en) 1985-12-23

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