JPS5764473A - Method for supersonic preliminary soldering - Google Patents
Method for supersonic preliminary solderingInfo
- Publication number
- JPS5764473A JPS5764473A JP14042780A JP14042780A JPS5764473A JP S5764473 A JPS5764473 A JP S5764473A JP 14042780 A JP14042780 A JP 14042780A JP 14042780 A JP14042780 A JP 14042780A JP S5764473 A JPS5764473 A JP S5764473A
- Authority
- JP
- Japan
- Prior art keywords
- supersonic
- solder
- phone
- soldered
- amplitude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To execute preliminary soldering of excellent quality, by changing the distance between a supersonic phone and the surface to be soldered and the amplitude of a supersonic wave, when supersonic preliminary soldering is performed on the surface of a metal without using any flux.
CONSTITUTION: A solder 12 composed of 95% Pb and 5% Sn is placed on the surface of a member to be soldered 1 in a non-oxidizing atmosphere, and the front end of a supersonic phone 13 is contacted to the solder 12. Then, the solder 12 is heated through the member to be soldered 1 by a heating plate 6 to a temperature which is higher than the melting point of the solder, and thus, the solder 12 is melted. A 30kHz supersonic vibration is applied to the supersonic phone 13 and the amplitude is gradually increased. As the amplitude is gradually increased, the distance between the end of the supersonic phone 13 and the surface of the member to be soldered 1 is gradually reduced, and then, the supersonic phone 13 is gradually separated from the surface. As the phone 13 is gradually separated from the surface, the amplitude of the supersonic vibration is gradually reduced. In this way, the molten solder is not oxidized and scattered, and, at the same time, preliminary soldering which are excellent in the wetting property and reliability is performed under a high solder yield.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14042780A JPS6059070B2 (en) | 1980-10-09 | 1980-10-09 | Ultrasonic pre-soldering method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14042780A JPS6059070B2 (en) | 1980-10-09 | 1980-10-09 | Ultrasonic pre-soldering method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5764473A true JPS5764473A (en) | 1982-04-19 |
JPS6059070B2 JPS6059070B2 (en) | 1985-12-23 |
Family
ID=15268432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14042780A Expired JPS6059070B2 (en) | 1980-10-09 | 1980-10-09 | Ultrasonic pre-soldering method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6059070B2 (en) |
-
1980
- 1980-10-09 JP JP14042780A patent/JPS6059070B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6059070B2 (en) | 1985-12-23 |
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