JPS6453427A - Bonding process - Google Patents
Bonding processInfo
- Publication number
- JPS6453427A JPS6453427A JP19519387A JP19519387A JPS6453427A JP S6453427 A JPS6453427 A JP S6453427A JP 19519387 A JP19519387 A JP 19519387A JP 19519387 A JP19519387 A JP 19519387A JP S6453427 A JPS6453427 A JP S6453427A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- active metal
- pressure
- electrode terminals
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To enable a secure bonding process to be performed at low pressure without damaging a semiconductor element by a method wherein metallic bumps comprising low melting point bonding metallic alloy are formed on at least either of the terminals of an electronic component or the connecting terminals of a bonded body. CONSTITUTION:An active metal 1 is thermal-pressure fixed on an electrode terminals 201 and then plastic-deformed by heating at the temperature of 140-150 deg.C and the pressure of 10-100kg/cm<2>. Next, when the active metal 1 coated with resist is etched away, metallic bumps 203 are formed on the electrode terminals 201. Successively, the electrode terminals 201 are aligned with connecting terminals 23 one another to be thermal-pressure fixed using a tool 41. The low melting point active metal 1 comprising Pb-Sn-Zn alloy with Sb added thereto as another active metal can be firmly bonded onto glass, other oxides and metals. Furthermore, the temperature difference when the active metal 1 is cooled down to be bonded onto terminals at low temperature is little so that any exfoliation between terminals and crack may be prevented from occurring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19519387A JPS6453427A (en) | 1986-09-25 | 1987-08-06 | Bonding process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22476587 | 1986-09-25 | ||
JP19519387A JPS6453427A (en) | 1986-09-25 | 1987-08-06 | Bonding process |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6453427A true JPS6453427A (en) | 1989-03-01 |
Family
ID=26508983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19519387A Pending JPS6453427A (en) | 1986-09-25 | 1987-08-06 | Bonding process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6453427A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017216299A (en) * | 2016-05-30 | 2017-12-07 | パナソニックIpマネジメント株式会社 | Circuit member connection structure and connection method |
JP2018533206A (en) * | 2015-10-06 | 2018-11-08 | シン フィルム エレクトロニクス エーエスエー | Electronic device having an antenna, one or more metal traces, and / or an inductor comprising a print adhesion promoter thereon, and a method for manufacturing the same |
WO2019103132A1 (en) * | 2017-11-27 | 2019-05-31 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board and method for producing flexible printed wiring board |
-
1987
- 1987-08-06 JP JP19519387A patent/JPS6453427A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018533206A (en) * | 2015-10-06 | 2018-11-08 | シン フィルム エレクトロニクス エーエスエー | Electronic device having an antenna, one or more metal traces, and / or an inductor comprising a print adhesion promoter thereon, and a method for manufacturing the same |
JP2017216299A (en) * | 2016-05-30 | 2017-12-07 | パナソニックIpマネジメント株式会社 | Circuit member connection structure and connection method |
CN107452706A (en) * | 2016-05-30 | 2017-12-08 | 松下知识产权经营株式会社 | The connecting structure of circuit block and connection method |
CN107452706B (en) * | 2016-05-30 | 2023-03-24 | 松下知识产权经营株式会社 | Connection structure and connection method for circuit components |
WO2019103132A1 (en) * | 2017-11-27 | 2019-05-31 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board and method for producing flexible printed wiring board |
CN111418272A (en) * | 2017-11-27 | 2020-07-14 | 住友电工印刷电路株式会社 | Flexible printed circuit board and method of manufacturing the same |
JPWO2019103132A1 (en) * | 2017-11-27 | 2020-12-17 | 住友電工プリントサーキット株式会社 | Manufacturing method of flexible printed wiring board and flexible printed wiring board |
CN111418272B (en) * | 2017-11-27 | 2023-08-29 | 住友电工印刷电路株式会社 | Flexible printed circuit board and method of manufacturing the same |
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