JPS6453427A - Bonding process - Google Patents

Bonding process

Info

Publication number
JPS6453427A
JPS6453427A JP19519387A JP19519387A JPS6453427A JP S6453427 A JPS6453427 A JP S6453427A JP 19519387 A JP19519387 A JP 19519387A JP 19519387 A JP19519387 A JP 19519387A JP S6453427 A JPS6453427 A JP S6453427A
Authority
JP
Japan
Prior art keywords
terminals
active metal
pressure
electrode terminals
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19519387A
Other languages
Japanese (ja)
Inventor
Hiroshi Morita
Tomiaki Yamamoto
Keiko Ishizawa
Tsuneichi Yoshino
Hisashi Naito
Koji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP19519387A priority Critical patent/JPS6453427A/en
Publication of JPS6453427A publication Critical patent/JPS6453427A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable a secure bonding process to be performed at low pressure without damaging a semiconductor element by a method wherein metallic bumps comprising low melting point bonding metallic alloy are formed on at least either of the terminals of an electronic component or the connecting terminals of a bonded body. CONSTITUTION:An active metal 1 is thermal-pressure fixed on an electrode terminals 201 and then plastic-deformed by heating at the temperature of 140-150 deg.C and the pressure of 10-100kg/cm<2>. Next, when the active metal 1 coated with resist is etched away, metallic bumps 203 are formed on the electrode terminals 201. Successively, the electrode terminals 201 are aligned with connecting terminals 23 one another to be thermal-pressure fixed using a tool 41. The low melting point active metal 1 comprising Pb-Sn-Zn alloy with Sb added thereto as another active metal can be firmly bonded onto glass, other oxides and metals. Furthermore, the temperature difference when the active metal 1 is cooled down to be bonded onto terminals at low temperature is little so that any exfoliation between terminals and crack may be prevented from occurring.
JP19519387A 1986-09-25 1987-08-06 Bonding process Pending JPS6453427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19519387A JPS6453427A (en) 1986-09-25 1987-08-06 Bonding process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22476587 1986-09-25
JP19519387A JPS6453427A (en) 1986-09-25 1987-08-06 Bonding process

Publications (1)

Publication Number Publication Date
JPS6453427A true JPS6453427A (en) 1989-03-01

Family

ID=26508983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19519387A Pending JPS6453427A (en) 1986-09-25 1987-08-06 Bonding process

Country Status (1)

Country Link
JP (1) JPS6453427A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017216299A (en) * 2016-05-30 2017-12-07 パナソニックＩｐマネジメント株式会社 Circuit member connection structure and connection method
JP2018533206A (en) * 2015-10-06 2018-11-08 シン フィルム エレクトロニクス エーエスエー Electronic device having an antenna, one or more metal traces, and / or an inductor comprising a print adhesion promoter thereon, and a method for manufacturing the same
WO2019103132A1 (en) * 2017-11-27 2019-05-31 住友電工プリントサーキット株式会社 Flexible printed wiring board and method for producing flexible printed wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018533206A (en) * 2015-10-06 2018-11-08 シン フィルム エレクトロニクス エーエスエー Electronic device having an antenna, one or more metal traces, and / or an inductor comprising a print adhesion promoter thereon, and a method for manufacturing the same
JP2017216299A (en) * 2016-05-30 2017-12-07 パナソニックＩｐマネジメント株式会社 Circuit member connection structure and connection method
CN107452706A (en) * 2016-05-30 2017-12-08 松下知识产权经营株式会社 The connecting structure of circuit block and connection method
CN107452706B (en) * 2016-05-30 2023-03-24 松下知识产权经营株式会社 Connection structure and connection method for circuit components
WO2019103132A1 (en) * 2017-11-27 2019-05-31 住友電工プリントサーキット株式会社 Flexible printed wiring board and method for producing flexible printed wiring board
CN111418272A (en) * 2017-11-27 2020-07-14 住友电工印刷电路株式会社 Flexible printed circuit board and method of manufacturing the same
JPWO2019103132A1 (en) * 2017-11-27 2020-12-17 住友電工プリントサーキット株式会社 Manufacturing method of flexible printed wiring board and flexible printed wiring board
CN111418272B (en) * 2017-11-27 2023-08-29 住友电工印刷电路株式会社 Flexible printed circuit board and method of manufacturing the same

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