FR2408974A1 - Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards - Google Patents

Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards

Info

Publication number
FR2408974A1
FR2408974A1 FR7733912A FR7733912A FR2408974A1 FR 2408974 A1 FR2408974 A1 FR 2408974A1 FR 7733912 A FR7733912 A FR 7733912A FR 7733912 A FR7733912 A FR 7733912A FR 2408974 A1 FR2408974 A1 FR 2408974A1
Authority
FR
France
Prior art keywords
components
wave
conveyor
pref
esp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7733912A
Other languages
French (fr)
Other versions
FR2408974B1 (en
Inventor
Pierre Brehon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7733912A priority Critical patent/FR2408974A1/en
Publication of FR2408974A1 publication Critical patent/FR2408974A1/en
Application granted granted Critical
Publication of FR2408974B1 publication Critical patent/FR2408974B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

The components are carried along a conveyor which is inclined at an angle w.r.t. the horizontal so the conveyor slopes downwards at an angle which is pref. 5-15 degrees C. The conveyor is located above a flow soldering bath in which a wave of/molten solder is created; and the components travel in the same direction as the wave. The wave is pref. directed along a path parallel with the axis of the conveyor; and the speed of the components is pref. the same as the speed of the wave, esp. 20-100 mm/sec; in the pref. appts. the conveyor carries the tags through a pickling bath before they come into contact with the flow solder wave. Method prevents an excessive amt. of solder alloy remaining on the tags; and provides a mass prodn. technique for electric- or electronic- components.
FR7733912A 1977-11-10 1977-11-10 Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards Granted FR2408974A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7733912A FR2408974A1 (en) 1977-11-10 1977-11-10 Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7733912A FR2408974A1 (en) 1977-11-10 1977-11-10 Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards

Publications (2)

Publication Number Publication Date
FR2408974A1 true FR2408974A1 (en) 1979-06-08
FR2408974B1 FR2408974B1 (en) 1981-01-16

Family

ID=9197487

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7733912A Granted FR2408974A1 (en) 1977-11-10 1977-11-10 Tinning of terminal tags on electric components - esp. components to be mounted on printed circuit boards

Country Status (1)

Country Link
FR (1) FR2408974A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067939A2 (en) * 1981-06-16 1982-12-29 Matsushita Electric Industrial Co., Ltd. Soldering apparatus for printed circuit board
EP0219812A2 (en) * 1985-10-25 1987-04-29 Analog Devices, Inc. Packaged semiconductor device having solderable external leads and process for its production
EP0385843A1 (en) * 1989-03-02 1990-09-05 SOLEMS S.A. Société dite: Method of producing contacts for thin-film electrodes on glass

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067939A2 (en) * 1981-06-16 1982-12-29 Matsushita Electric Industrial Co., Ltd. Soldering apparatus for printed circuit board
EP0067939A3 (en) * 1981-06-16 1983-01-26 Matsushita Electric Industrial Co., Ltd. Soldering apparatus for printed circuit board
EP0219812A2 (en) * 1985-10-25 1987-04-29 Analog Devices, Inc. Packaged semiconductor device having solderable external leads and process for its production
EP0219812A3 (en) * 1985-10-25 1987-09-30 Analog Devices, Inc. Packaged semiconductor device having solderable external leads and process for its production
EP0385843A1 (en) * 1989-03-02 1990-09-05 SOLEMS S.A. Société dite: Method of producing contacts for thin-film electrodes on glass
FR2644011A1 (en) * 1989-03-02 1990-09-07 Solems Sa METHOD OF MAKING CONTACTS FOR THIN FILM ELECTRODES ON GLASS

Also Published As

Publication number Publication date
FR2408974B1 (en) 1981-01-16

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Legal Events

Date Code Title Description
ST Notification of lapse