JPS5411864A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS5411864A JPS5411864A JP7713777A JP7713777A JPS5411864A JP S5411864 A JPS5411864 A JP S5411864A JP 7713777 A JP7713777 A JP 7713777A JP 7713777 A JP7713777 A JP 7713777A JP S5411864 A JPS5411864 A JP S5411864A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- fitted
- soldering method
- dipping
- float
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
PURPOSE: To provide the subject method comprising the steps of inserting lead wires of parts to be fitted such as electronic parts and the like in fitting holes of a printed substrate, coating the parts to be fitted with a thin sponge and dipping the same in molten solder, thereby to prevent the float-up and the like of the parts and the carry out highly reliable soldering operations.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7713777A JPS5411864A (en) | 1977-06-30 | 1977-06-30 | Soldering method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7713777A JPS5411864A (en) | 1977-06-30 | 1977-06-30 | Soldering method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5411864A true JPS5411864A (en) | 1979-01-29 |
Family
ID=13625402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7713777A Pending JPS5411864A (en) | 1977-06-30 | 1977-06-30 | Soldering method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5411864A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57107951U (en) * | 1980-12-24 | 1982-07-03 |
-
1977
- 1977-06-30 JP JP7713777A patent/JPS5411864A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57107951U (en) * | 1980-12-24 | 1982-07-03 | ||
JPS624668Y2 (en) * | 1980-12-24 | 1987-02-03 |
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