JPS6418298A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6418298A
JPS6418298A JP17527687A JP17527687A JPS6418298A JP S6418298 A JPS6418298 A JP S6418298A JP 17527687 A JP17527687 A JP 17527687A JP 17527687 A JP17527687 A JP 17527687A JP S6418298 A JPS6418298 A JP S6418298A
Authority
JP
Japan
Prior art keywords
solder
resist layer
melted
board
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17527687A
Other languages
Japanese (ja)
Inventor
Keiji Nagura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP17527687A priority Critical patent/JPS6418298A/en
Publication of JPS6418298A publication Critical patent/JPS6418298A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To eliminate a troublesome work of applying and removing a masking tape to and from a land area for components to be attached later by a method wherein a 2nd resist layer which is not melted at the temperature of a solder bath but is melted at the temperature of a solder iron is formed on a land resist layer on a board. CONSTITUTION:A conventional land resist layer 3 is formed on a conductor layer 2 formed on a board 1 as a 1st insulating layer. A resist layer 4 which has a melting point lower than that of the resist layer 3 is formed on the resist layer 3 as a 2nd insulating layer. The resist layer 4, i.e. the 2nd insulating layer, is made of material which is not melted at the processing temperature of a solder bath but is melted at the temperature of a solder iron. As a land area (a) for components to be attached later on the board 1 is protected by the resist layer 4, even if the board 1 is subjected to a solder dip treatment in the solder bath, the solder does not adhere to the lands of the components to be attached later. With this constitution, the construction of applying a masking tape can be eliminated and the adhesion of solder at the time of the solder dip treatment can be securely avoided by a very simple means.
JP17527687A 1987-07-13 1987-07-13 Printed wiring board Pending JPS6418298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17527687A JPS6418298A (en) 1987-07-13 1987-07-13 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17527687A JPS6418298A (en) 1987-07-13 1987-07-13 Printed wiring board

Publications (1)

Publication Number Publication Date
JPS6418298A true JPS6418298A (en) 1989-01-23

Family

ID=15993306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17527687A Pending JPS6418298A (en) 1987-07-13 1987-07-13 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS6418298A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351872U (en) * 1989-09-28 1991-05-20
JPH0552358U (en) * 1991-12-19 1993-07-13 株式会社松井製作所 Universal joint

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57197896A (en) * 1981-05-29 1982-12-04 Nippon Electric Co Method of soldering printed board
JPS5835996A (en) * 1981-08-28 1983-03-02 富士通株式会社 Method of connecting lead wire to printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57197896A (en) * 1981-05-29 1982-12-04 Nippon Electric Co Method of soldering printed board
JPS5835996A (en) * 1981-08-28 1983-03-02 富士通株式会社 Method of connecting lead wire to printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351872U (en) * 1989-09-28 1991-05-20
JPH0552358U (en) * 1991-12-19 1993-07-13 株式会社松井製作所 Universal joint

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