JPS528473A - Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist - Google Patents

Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist

Info

Publication number
JPS528473A
JPS528473A JP8429075A JP8429075A JPS528473A JP S528473 A JPS528473 A JP S528473A JP 8429075 A JP8429075 A JP 8429075A JP 8429075 A JP8429075 A JP 8429075A JP S528473 A JPS528473 A JP S528473A
Authority
JP
Japan
Prior art keywords
tinnnickel
gist
etching
substrate
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8429075A
Other languages
Japanese (ja)
Inventor
Hirotoshi Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8429075A priority Critical patent/JPS528473A/en
Publication of JPS528473A publication Critical patent/JPS528473A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP8429075A 1975-07-08 1975-07-08 Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist Pending JPS528473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8429075A JPS528473A (en) 1975-07-08 1975-07-08 Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8429075A JPS528473A (en) 1975-07-08 1975-07-08 Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist

Publications (1)

Publication Number Publication Date
JPS528473A true JPS528473A (en) 1977-01-22

Family

ID=13826327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8429075A Pending JPS528473A (en) 1975-07-08 1975-07-08 Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist

Country Status (1)

Country Link
JP (1) JPS528473A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561989A (en) * 1979-06-20 1981-01-10 Nippon Signal Co Ltd Display unit
JPS6489588A (en) * 1987-07-02 1989-04-04 Psi Star Inc Manufacture of pc board
JPH06310831A (en) * 1993-04-27 1994-11-04 C Uyemura & Co Ltd Electroless plating on copper circuit pattern of printed-wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (en) * 1972-10-18 1974-06-14
JPS49119161A (en) * 1973-03-20 1974-11-14
JPS5042377A (en) * 1973-08-18 1975-04-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (en) * 1972-10-18 1974-06-14
JPS49119161A (en) * 1973-03-20 1974-11-14
JPS5042377A (en) * 1973-08-18 1975-04-17

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561989A (en) * 1979-06-20 1981-01-10 Nippon Signal Co Ltd Display unit
JPS6489588A (en) * 1987-07-02 1989-04-04 Psi Star Inc Manufacture of pc board
JPH06310831A (en) * 1993-04-27 1994-11-04 C Uyemura & Co Ltd Electroless plating on copper circuit pattern of printed-wiring board

Similar Documents

Publication Publication Date Title
JPS5335163A (en) Method of producing printed circuit board substrate having through hole from metallic material
JPS5265862A (en) Method of plating printed circuit board
JPS528473A (en) Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist
JPS5228666A (en) Method of producing flexible printed circuit substrate
JPS51119969A (en) Method of manufacturing printed wiring substrate
JPS51141363A (en) Method of manufacturing printed wiring board
JPS5262661A (en) Method of producing metallic core organic coating printed circuit wiring board
JPS51132466A (en) Method of manufacturing independent lands on printed wiring board
JPS5235866A (en) Method of plating through hole of printed circuit board
JPS51140172A (en) Method of manufacturing printed wiring substrate
JPS5212462A (en) Method of manufacturing printed circuit board
JPS525467A (en) Method of plating throughhholes opposite copper surfaces of printed circuit wiring board
JPS51145865A (en) Method of manufacturing printed wiring board
JPS51132458A (en) Method of manufacturing printed wiring board
JPS5274868A (en) Method of producing flexible printed circuit substrate
JPS51129676A (en) Method of manufacturing printed wiring substrate
JPS5222775A (en) Method of manufacturing printed circuit board
JPS5223664A (en) Method of manufacturing printed circuit board
JPS5281561A (en) Method of producing conductive blank for printed circuit substrate
JPS525470A (en) Method of manufacturing printed circuit substrate
JPS52138671A (en) Method of producing printed circuit substrate
JPS52124172A (en) Method of producing printed circuit substrate
JPS5259855A (en) Method of producing multiilayer printed circuit substrate
JPS5227561A (en) Method of producing printed circuit substrate
JPS5279274A (en) Method of producing printed circuit substrate