JPS6489588A - Manufacture of pc board - Google Patents

Manufacture of pc board

Info

Publication number
JPS6489588A
JPS6489588A JP16482488A JP16482488A JPS6489588A JP S6489588 A JPS6489588 A JP S6489588A JP 16482488 A JP16482488 A JP 16482488A JP 16482488 A JP16482488 A JP 16482488A JP S6489588 A JPS6489588 A JP S6489588A
Authority
JP
Japan
Prior art keywords
nickel
copper
semiglossy
tin
nitric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16482488A
Other languages
Japanese (ja)
Inventor
Jiei Baanetsuto Danieru
Ei Deiiru Pauro
Jiei Neruson Noobueru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSI Star Inc
Original Assignee
PSI Star Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PSI Star Inc filed Critical PSI Star Inc
Publication of JPS6489588A publication Critical patent/JPS6489588A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To ensure a resist which is prevented from being etched with nitric acid and is stable and removable with a commercial removing agent without giving damage to a junction between it and a copper foil or a substrate thereof by adding a tin-nickel alloy, a semiglossy nickel, or a combination thereof to a copper part to be held, and removing remaining copper with a nitric acid etching solution. CONSTITUTION: In a method of assembling a printed circuit board by selectively removing copper from an insulating substrate, a semiglossy nickel layer is formed on a copper part to be held. A tin-nickel alloy layer is formed on the semiglossy nickel. For etching thereafter the substrate is exposed to a nitric acid etching solution in order to remove the copper part not covered with the semiglossy nickel and the tin-nickel alloy. Herein, the semiglossy nickel layer is preferably at least 0.2mil in thickness in order to ensure a proper isolation between the copper and the tin-nickel. Hereby, when nickel is used as an etching resist, the difficulties and limitation caused until now can be eliminated.
JP16482488A 1987-07-02 1988-07-01 Manufacture of pc board Pending JPS6489588A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6938287A 1987-07-02 1987-07-02

Publications (1)

Publication Number Publication Date
JPS6489588A true JPS6489588A (en) 1989-04-04

Family

ID=22088623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16482488A Pending JPS6489588A (en) 1987-07-02 1988-07-01 Manufacture of pc board

Country Status (4)

Country Link
JP (1) JPS6489588A (en)
DE (1) DE3822403A1 (en)
FR (1) FR2617667B1 (en)
GB (1) GB2206541A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912733A (en) * 1989-03-27 1990-03-27 General Electric Company Steam-water separating system for boiling water nuclear reactors
CN110927422A (en) * 2019-02-22 2020-03-27 宁波三星医疗电气股份有限公司 Electric energy meter bottom shell and injection molding process of bottom shell

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69320856T2 (en) * 1992-03-30 1999-02-04 Seiko Instruments Co. Ltd., Tokio/Tokyo Process for electrochemical finishing
EP3518631A1 (en) 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Anisotropic etching using highly branched polymers

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (en) * 1972-10-18 1974-06-14
JPS528473A (en) * 1975-07-08 1977-01-22 Hirotoshi Nomura Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist
JPS5999793A (en) * 1982-11-29 1984-06-08 山下サーキテック株式会社 Printed circuit board
JPS59175189A (en) * 1983-03-23 1984-10-03 株式会社　サト−セン Method of producing printed circuit board
JPS6094727A (en) * 1983-06-27 1985-05-27 ピ−エスアイ　スタ− Reactor for liquid etching and method
JPS61226997A (en) * 1985-03-30 1986-10-08 株式会社東芝 Manufacture of printed wiring board
JPS6240385A (en) * 1985-08-12 1987-02-21 ピ−エスアイ　スタ− Copper etching method and solution

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask
US4545850A (en) * 1984-08-20 1985-10-08 Psi Star Regenerative copper etching process and solution
US4605471A (en) * 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (en) * 1972-10-18 1974-06-14
JPS528473A (en) * 1975-07-08 1977-01-22 Hirotoshi Nomura Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist
JPS5999793A (en) * 1982-11-29 1984-06-08 山下サーキテック株式会社 Printed circuit board
JPS59175189A (en) * 1983-03-23 1984-10-03 株式会社　サト−セン Method of producing printed circuit board
JPS6094727A (en) * 1983-06-27 1985-05-27 ピ−エスアイ　スタ− Reactor for liquid etching and method
JPS61226997A (en) * 1985-03-30 1986-10-08 株式会社東芝 Manufacture of printed wiring board
JPS6240385A (en) * 1985-08-12 1987-02-21 ピ−エスアイ　スタ− Copper etching method and solution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912733A (en) * 1989-03-27 1990-03-27 General Electric Company Steam-water separating system for boiling water nuclear reactors
CN110927422A (en) * 2019-02-22 2020-03-27 宁波三星医疗电气股份有限公司 Electric energy meter bottom shell and injection molding process of bottom shell
CN110927422B (en) * 2019-02-22 2021-11-02 宁波三星医疗电气股份有限公司 Electric energy meter bottom shell and injection molding process of bottom shell

Also Published As

Publication number Publication date
GB2206541A (en) 1989-01-11
DE3822403A1 (en) 1989-01-12
FR2617667A1 (en) 1989-01-06
FR2617667B1 (en) 1991-04-26
GB8815275D0 (en) 1988-08-03

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