JPS6481299A - Manufacture of surface-mounting printed circuit board - Google Patents

Manufacture of surface-mounting printed circuit board

Info

Publication number
JPS6481299A
JPS6481299A JP23618687A JP23618687A JPS6481299A JP S6481299 A JPS6481299 A JP S6481299A JP 23618687 A JP23618687 A JP 23618687A JP 23618687 A JP23618687 A JP 23618687A JP S6481299 A JPS6481299 A JP S6481299A
Authority
JP
Japan
Prior art keywords
layer
copper
mounting
mounting land
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23618687A
Other languages
Japanese (ja)
Other versions
JPH0732309B2 (en
Inventor
Shusaku Izumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62236186A priority Critical patent/JPH0732309B2/en
Publication of JPS6481299A publication Critical patent/JPS6481299A/en
Publication of JPH0732309B2 publication Critical patent/JPH0732309B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To manufacture a mounting land of high accuracy by a method wherein the mounting land is formed by using only copper foil of a copper-pasted laminated board in order to enhance working efficiency of a surface-mounting operation and in order to enhance quality. CONSTITUTION:A catalyst layer 9 used to precipitate a chemically copper-plated layer is formed on a whole face of a laminated board 1 including an inner wall of a through hole 3 made in a copper-plated laminated layer 1 where copper foil 2 is formed. Then, an etching resist layer 5 is formed in a prescribed circuit part; the unnecessary copper foil 2 is melted and removed by an etching operation; in succession, the layer 5 is removed. Then, a permanent solder resist layer 8 is coated in a shape to expose only the circuit part requiring a copper-plated layer. Then, a solder resist layer 6' is coated or a masking tape 6' is pasted only on a mounting land 7. Then, a chemically copper-plated layer 4 of a prescribed thickness is precipitated only on the exposed through hole 3 and a conductor circuit; after that, the layer 6' or the tape 6' on the mounting land 7 is removed; a surface-mounting printed-circuit board having the mounting land 7 can be manufactured.
JP62236186A 1987-09-22 1987-09-22 Method of manufacturing imposition mounted printed circuit board Expired - Lifetime JPH0732309B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62236186A JPH0732309B2 (en) 1987-09-22 1987-09-22 Method of manufacturing imposition mounted printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62236186A JPH0732309B2 (en) 1987-09-22 1987-09-22 Method of manufacturing imposition mounted printed circuit board

Publications (2)

Publication Number Publication Date
JPS6481299A true JPS6481299A (en) 1989-03-27
JPH0732309B2 JPH0732309B2 (en) 1995-04-10

Family

ID=16997049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62236186A Expired - Lifetime JPH0732309B2 (en) 1987-09-22 1987-09-22 Method of manufacturing imposition mounted printed circuit board

Country Status (1)

Country Link
JP (1) JPH0732309B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217697A (en) * 1988-07-05 1990-01-22 Mitsubishi Electric Corp Manufacture of high-density printed circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543274A (en) * 1978-09-22 1980-03-27 Ntn Toyo Bearing Co Ltd Fuel injection device
JPS5575288A (en) * 1978-12-01 1980-06-06 Nippon Electric Co Method of fabricating printed circuit board
JPS612386A (en) * 1984-06-15 1986-01-08 株式会社日立製作所 Method of producing printed circuit board
JPS61121391A (en) * 1984-11-16 1986-06-09 松下電器産業株式会社 Printed wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543274A (en) * 1978-09-22 1980-03-27 Ntn Toyo Bearing Co Ltd Fuel injection device
JPS5575288A (en) * 1978-12-01 1980-06-06 Nippon Electric Co Method of fabricating printed circuit board
JPS612386A (en) * 1984-06-15 1986-01-08 株式会社日立製作所 Method of producing printed circuit board
JPS61121391A (en) * 1984-11-16 1986-06-09 松下電器産業株式会社 Printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217697A (en) * 1988-07-05 1990-01-22 Mitsubishi Electric Corp Manufacture of high-density printed circuit board

Also Published As

Publication number Publication date
JPH0732309B2 (en) 1995-04-10

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