GB1497312A - Production of printed circuit arrangements - Google Patents

Production of printed circuit arrangements

Info

Publication number
GB1497312A
GB1497312A GB43289/75A GB4328975A GB1497312A GB 1497312 A GB1497312 A GB 1497312A GB 43289/75 A GB43289/75 A GB 43289/75A GB 4328975 A GB4328975 A GB 4328975A GB 1497312 A GB1497312 A GB 1497312A
Authority
GB
United Kingdom
Prior art keywords
substrate
copper
photoresist
holes
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB43289/75A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB43289/75A priority Critical patent/GB1497312A/en
Priority to ZA765930A priority patent/ZA765930B/en
Priority to DE2645947A priority patent/DE2645947C2/en
Priority to AU18624/76A priority patent/AU498261B2/en
Priority to JP51125546A priority patent/JPS5271681A/en
Priority to US05/852,392 priority patent/US4118523A/en
Publication of GB1497312A publication Critical patent/GB1497312A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Abstract

1497312 Printed circuits INTERNATIONAL COMPUTERS Ltd 18 Oct 1976 [22 Oct 1975] 43289/75 Heading H1R A printed circuit having through holes is formed by coating a polyamide film on both surfaces with a thin layer of chromium overlain by a thin layer of copper, on which layers of photoresist are deposited and exposed to U.V. light through masks defining the positions of holes to be formed in the substrate. After development to expose the hole locations, the substrate and metallized layers are etched in respectively ferric chloride and alkaline ferricyanide in an oscillating jig, and then in hydrazine hydrate to penetrate the substrate; the hold being undercut beneath the metallization with a narrower a narrower central region (Figs. 1 to 5, not shown). Thereafter a second photoresist is applied, masked, and illuminated to define a narrow band of substrate surrounding each of the holes and to remove the overhang. The photoresist is removed and the walls of the holes and the annular rings are electrolessly copper plated to provide electrical continuity and reinforced with copper by electroplating. A further photresist is applied to both sides of the substrate, masked, and illuminated to define a required surface pattern of conductors. After development, these are deposited electrolytically from copper or nickel, and plated protectively with tin/lead or gold. The photoresist is removed and the chromium and copper layers are etched out from between the conductors using ferric chloride or ammoniacal etchant (Figs. 6 to 8, not shown).
GB43289/75A 1975-10-22 1975-10-22 Production of printed circuit arrangements Expired GB1497312A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB43289/75A GB1497312A (en) 1975-10-22 1975-10-22 Production of printed circuit arrangements
ZA765930A ZA765930B (en) 1975-10-22 1976-10-04 Improvements in or relating to production of semiconductor devices
DE2645947A DE2645947C2 (en) 1975-10-22 1976-10-12 Process for the manufacture of a printed circuit
AU18624/76A AU498261B2 (en) 1975-10-22 1976-10-13 Production of printed circuits
JP51125546A JPS5271681A (en) 1975-10-22 1976-10-21 Method of forming printed circuit unit
US05/852,392 US4118523A (en) 1975-10-22 1977-11-17 Production of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB43289/75A GB1497312A (en) 1975-10-22 1975-10-22 Production of printed circuit arrangements

Publications (1)

Publication Number Publication Date
GB1497312A true GB1497312A (en) 1978-01-05

Family

ID=10428105

Family Applications (1)

Application Number Title Priority Date Filing Date
GB43289/75A Expired GB1497312A (en) 1975-10-22 1975-10-22 Production of printed circuit arrangements

Country Status (5)

Country Link
JP (1) JPS5271681A (en)
AU (1) AU498261B2 (en)
DE (1) DE2645947C2 (en)
GB (1) GB1497312A (en)
ZA (1) ZA765930B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517050A (en) * 1983-12-05 1985-05-14 E. I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
US4472238A (en) * 1983-12-05 1984-09-18 E. I. Du Pont De Nemours And Company Process using plasma for forming conductive through-holes through a dielectric layer
DE202014006674U1 (en) * 2014-08-20 2015-11-23 Automotive Lighting Reutlingen Gmbh Printed circuit board for vehicle lighting devices
CN112235951B (en) * 2020-10-20 2021-09-21 盐城维信电子有限公司 Method for manufacturing circuit boards with different copper thicknesses

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3268653A (en) * 1964-04-29 1966-08-23 Ibm Printed circuit board with solder resistant coating in the through-hole connectors
US3471631A (en) * 1968-04-03 1969-10-07 Us Air Force Fabrication of microminiature multilayer circuit boards
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers

Also Published As

Publication number Publication date
JPS5271681A (en) 1977-06-15
DE2645947A1 (en) 1977-04-28
AU1862476A (en) 1978-04-20
JPS5731667B2 (en) 1982-07-06
ZA765930B (en) 1977-09-28
DE2645947C2 (en) 1983-01-27
AU498261B2 (en) 1979-02-22

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee