GB1208337A - Method to produce printed circuits - Google Patents

Method to produce printed circuits

Info

Publication number
GB1208337A
GB1208337A GB3554168A GB3554168A GB1208337A GB 1208337 A GB1208337 A GB 1208337A GB 3554168 A GB3554168 A GB 3554168A GB 3554168 A GB3554168 A GB 3554168A GB 1208337 A GB1208337 A GB 1208337A
Authority
GB
United Kingdom
Prior art keywords
copper
substrate
bath
electroless
knac
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3554168A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of GB1208337A publication Critical patent/GB1208337A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Abstract

1,208,337. Printed circuits. INTERNATIONAL STANDARD ELECTRIC CORP. 25 July, 1968 [29 Aug., 1967], No. 35541/68. Heading H1R. [Also in Division C7] In the manufacture of a printed circuit board in which conductors and plated through holes are formed by deposition of copper electrolessly and by electroplating and etching the desired conductor pattern metallic complex salts are added to the electroless plating bath. A substrate, after coating with a thermoplastic glue layer and perforating, is mechanically roughened and then seeded by an activating solution. The thus prepared substrate is then placed in a copper electroless plating bath to which has been added metal complex cyanide salts to stabilize the bath and prevent the formation of Cu 2 O. After electrolessly plating copper on the surfaces of the substrate and holes a negative lacquer resist is applied to the substrate to leave exposed those areas corresponding to the required conductor pattern and the hole walls. These exposed areas are then reinforced by means of a copper electroplating bath. After removing the resist layer the substrate is subjected to an alkaline etching bath which removes the electroless plated portions not reinforced and a small portion of the electroplated copper thereby leaving the required conductor pattern and plated holes. The substrates may be coated with a solderable protective lacquer, or an electroless coating of a corrosion protective metal. Precious metals may be applied to the electroplated copper. Suitable electroless copper plating baths are:-(1) 15 g CuCl 2 .2H 2 O, 40 g KNaC 4 H 4 O 6 , 13 g free NaOH, 11 g formaldehyde, 0À05 g K 2 [Ni(CN) 4 ]; (2) 10 g CuCl 2 .2H 2 O, 56À5 g KNaC 4 H 6 O 6 , 14À7 g free NaOH, 12 g formaldehyde, 0À5 g K 4 [Fe(CN) 6 ]; (3) 10 g CuCl 2 .2H 2 O, 56À5 g KNaC 4 H 4 O 6 , 10 g free NaOH, 8-7 g formaldehyde, 1À3 g K 4 [Fe(CN) 6 ], 0À6 g K 3 [Cu(CN) 4 ]. Reference has been directed by the Comptroller to Specification 1,145,578.
GB3554168A 1967-08-29 1968-07-25 Method to produce printed circuits Expired GB1208337A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19671690224 DE1690224B1 (en) 1967-08-29 1967-08-29 BATHROOM FOR ELECTRONIC COPPER PLATING OF PLASTIC PANELS

Publications (1)

Publication Number Publication Date
GB1208337A true GB1208337A (en) 1970-10-14

Family

ID=5687555

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3554168A Expired GB1208337A (en) 1967-08-29 1968-07-25 Method to produce printed circuits

Country Status (6)

Country Link
BE (1) BE720093A (en)
CH (1) CH492381A (en)
DE (1) DE1690224B1 (en)
FR (1) FR1597506A (en)
GB (1) GB1208337A (en)
IE (1) IE32240B1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100591192C (en) * 2007-05-07 2010-02-17 三星电机株式会社 Radiant heat printed circuit board and method of fabricating the same
WO2015178971A1 (en) * 2014-05-19 2015-11-26 Sierra Circuits, Inc. Via in a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
CN113755838A (en) * 2021-09-10 2021-12-07 大富科技(安徽)股份有限公司 Metal copper surface etching process and automatic production line

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2932536A1 (en) * 1979-08-09 1981-02-26 Schering Ag METHOD FOR PRODUCING PRINTED CIRCUITS

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1206976B (en) * 1963-09-19 1965-12-16 Siemens Ag Process for producing printed circuits according to the build-up method
FR1449945A (en) * 1964-08-19 1966-05-06 Photocircuits Corp Improvements to Multilayer Printed Circuit Devices

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100591192C (en) * 2007-05-07 2010-02-17 三星电机株式会社 Radiant heat printed circuit board and method of fabricating the same
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
WO2015178971A1 (en) * 2014-05-19 2015-11-26 Sierra Circuits, Inc. Via in a printed circuit board
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
CN106538079A (en) * 2014-05-19 2017-03-22 塞拉电路公司 Via in a printed circuit board
US9674967B2 (en) 2014-05-19 2017-06-06 Sierra Circuits, Inc. Via in a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
CN106538079B (en) * 2014-05-19 2020-01-17 塞拉电路公司 Through hole of printed circuit board
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
CN113755838A (en) * 2021-09-10 2021-12-07 大富科技(安徽)股份有限公司 Metal copper surface etching process and automatic production line
CN113755838B (en) * 2021-09-10 2024-03-15 大富科技(安徽)股份有限公司 Metal copper surface etching process and automatic production line

Also Published As

Publication number Publication date
CH492381A (en) 1970-06-15
IE32240L (en) 1969-02-28
DE1690224B1 (en) 1971-03-25
FR1597506A (en) 1970-06-29
IE32240B1 (en) 1973-05-30
BE720093A (en) 1969-02-28

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PLNP Patent lapsed through nonpayment of renewal fees