CN113755838B - Metal copper surface etching process and automatic production line - Google Patents

Metal copper surface etching process and automatic production line Download PDF

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Publication number
CN113755838B
CN113755838B CN202111061746.XA CN202111061746A CN113755838B CN 113755838 B CN113755838 B CN 113755838B CN 202111061746 A CN202111061746 A CN 202111061746A CN 113755838 B CN113755838 B CN 113755838B
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etching
cleaning
copper
copper surface
treatment
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CN113755838A (en
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李俊
肖竞
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Anhui Tatfook Technology Co Ltd
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Anhui Tatfook Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to the technical field of etching, and provides a metal copper surface etching process, which comprises the following steps: carrying out surface microetching treatment; pattern coating; etching; and (5) carrying out surface anti-corrosion treatment. Wherein, the microetching cleaning agent is used for treating the copper surface under the following cleaning conditions, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s; the pattern coating step comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying; etching includes one-time etching, compensation etching, cleaning, puffing and film stripping; the copper surface is treated by the surface treatment agent under the following anti-corrosion condition, the concentration of the surface treatment agent is 20 to 100 percent, the using temperature is 20 to 30 ℃, and the spraying pressure is 1.0 to 1.5kg/cm 2 The cleaning time is 30-60 s. The metal copper surface etching process provided by the invention can avoid defective products caused by advanced oxidation corrosion of metal copper, thereby improving the yield of finished products.

Description

Metal copper surface etching process and automatic production line
Technical Field
The invention relates to the technical field of etching, in particular to a metal copper surface etching process and an automatic production line for implementing the metal copper surface etching process.
Background
The metallic copper surface etching process is a method of etching a corresponding pattern on the surface of a copper plate or copper foil by using a chemical agent. The surface of a semi-finished product manufactured by the existing copper surface etching process is easy to corrode or oxidize, so that the problem of low yield of the etching process is caused.
Disclosure of Invention
The invention provides a metal copper surface etching process, which aims to solve the problem of low yield caused by corrosion or oxidation of a semi-finished product of the existing copper surface etching process.
In order to achieve the above purpose, the invention adopts the following technical scheme:
in a first aspect, the present application provides a metallic copper surface etching process comprising the steps of:
a surface microetching treatment for removing impurities from the copper surface, wherein the copper surface is treated with a microetching cleaning agent under the following cleaning conditions, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s;
the pattern coating is used for attaching a corresponding pattern on the copper surface, wherein the pattern coating comprises the steps of film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
etching for patterning a copper surface, wherein the etching includes one-time etching, compensation etching, cleaning, puffing, and film stripping;
the surface corrosion prevention treatment is used for forming a protective layer on the surface of copper, wherein the surface of copper is treated by a surface treatment agent under the following corrosion prevention conditions, the concentration of the surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s.
The invention has the beneficial effects that: the invention provides a metal copper surface etching process, which comprises the following steps: surface microetching treatment for removing impurities on the copper surface; pattern coating, which is used for attaching a corresponding pattern on the copper surface; etching for forming a pattern on the copper surface; and, a surface anti-corrosion treatment for forming a protective layer on the copper surface. Wherein in the surface microetching treatment step, microetching cleaning agent is utilized to spray at the temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm 2 The copper surface is treated under the cleaning condition that the cleaning time is 30-60 s; in the step of pattern coating, the method specifically comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying; in the etching step, the etching includes one-time etching, compensation etching, cleaning, puffing and film stripping; and, in the surface preservative treatment step, the surface treatment agent is used at the use temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm 2 The copper surface is treated under the anticorrosion condition that the cleaning time is 30-60 s. To sum upAfter the etching and forming are finished, a surface anti-corrosion treatment procedure is added to the product manufactured by the manufacturing process, and a protective layer is formed on the surface of copper so as to achieve the aims of corrosion prevention and oxidation prevention, prevent defective products from being generated due to advanced oxidation corrosion, and improve the production yield of finished products.
In one embodiment, the microetching cleaning agent is a mixed solution mainly composed of 5-10% hydrogen peroxide, 5-10 g/L copper ions and 5-10% sulfuric acid.
In one embodiment, in the film pressing step, the film pressing pressure is 3.0kg/cm 2 The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min;
in the development step, the use temperature of the developing solution is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 Developing time is 30-60 s; and
in the liquid washing step, the use temperature of the liquid washing is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 The liquid washing time is 5-10 s.
In one embodiment, in the primary etching step, the primary etching liquid medicine is mainly composed of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spraying pressure of the primary etching section is 2.5-3.0 kg/cm 2 The primary etching temperature is 45-50 ℃, and the primary etching speed is 2.0-5.0 m/min.
In one embodiment, in the compensating etching step, the compensating etchant solution is mainly composed of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spray pressure of the compensation etching section is 2.5-3.0 kg/cm < 2 >, the primary etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s.
In one embodiment, in the fluffing step, the fluffing agent is sodium hydroxide solution with the concentration of 3-6%, wherein the using temperature is 40-50 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 The fluffing time is 30-40 s.
In one embodiment, in the film stripping step, the film stripping agentThe agent is 3 to 6 percent of sodium hydroxide solution, wherein the using temperature is 40 to 50 ℃, and the spraying pressure is 1.0 to 1.5kg/cm 2 The film stripping treatment time is 30-40 s.
In one embodiment, in the surface preservative treatment step, the agent for surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant in a ratio of 1:1-1:3.
In one embodiment, a semi-finished product performance test is included between the etching step and the surface preservative treatment step, the semi-finished product performance test including an appearance test and a precision test.
In a second aspect, the application further provides an automated production line for implementing the metal copper surface etching process, wherein the automated production line comprises a feeding device, a cleaning device, an ink coating device, an etching device and a surface anti-corrosion treatment device which are sequentially connected and realize automatic transmission of incoming materials.
The invention has the beneficial effects that: according to the automatic production line provided by the invention, the steps are realized through the feeding device, the cleaning device, the printing ink coating device, the etching device and the surface anti-corrosion treatment device which are sequentially connected, and finally, the improvement of the production efficiency of copper finished products is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a process for etching a metallic copper surface according to an embodiment of the present invention;
fig. 2 is another flow chart of a copper metal surface etching process according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, the metal copper surface etching process of the present application comprises the following steps:
s001, surface microetching treatment for removing impurities on the copper surface, wherein microetching cleaning agent is used for cleaning the copper surface by the following steps ofThe copper surface is treated under clean condition, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s;
the surface microetching treatment can be usually performed by spraying or ultrasonic cleaning, and a corresponding microetching cleaning agent is selected according to the object to be cleaned, and specifically, an acidic microetching cleaning agent or an alkaline microetching cleaning agent can be used.
The microetching cleaning agent is a mixed solution mainly composed of 5-10% hydrogen peroxide, 5-10 g/L copper ions and 5-10% sulfuric acid.
S002, pattern coating, which is used for attaching a corresponding pattern on the copper surface, wherein the pattern coating step comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
it can be understood that the pattern coating is to sequentially perform the steps of film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying on the copper surface; wherein, the press mold is to cover a film layer on the copper surface to prepare for the exposure process; the cooling temporary storage is to stand the copper plate after film coating, and the general standing time is 15min; the exposure is to leave a pattern image on the copper plate after film pasting; the film tearing step is to remove the film layer on the exposed copper surface; developing to show the pattern image on the copper surface; washing and drying, namely removing the surface of the developed copper plate, and then drying to remove the water on the surface.
Specifically, in the film pressing step, the film pressing pressure was 3.0kg/cm 2 The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min; in the development step, the use temperature of the developing solution is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 Developing time is 30-60 s; and in the liquid washing step, the using temperature of the liquid washing is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 The liquid washing time is 5-10 s.
S003, etching, namely forming a pattern on the surface of copper, wherein the etching comprises one-time etching, compensation etching, cleaning, fluffing and film stripping;
as will be appreciated, the primary etching is etching of areas of the copper plate surface that are not developed; the compensation etching is to perform secondary etching on the corroded area of the copper plate so as to ensure the etching effect; the cleaning is to wash out the etching solution on the surface of the copper plate; the puffing is to use alkaline reagent to carry out puffing on the surface of the copper plate, for example, sodium hydroxide solution is adopted, the film stripping is to further wash the surface of the copper plate by using alkaline reagent, and the same alkaline solution is used in the puffing and film stripping steps.
Wherein in the primary etching step, the primary etching liquid medicine mainly comprises 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spraying pressure of the primary etching section is 2.5-3.0 kg/cm 2 The primary etching temperature is 45-50 ℃, and the primary etching speed is 2.0-5.0 m/min; in the compensation etching step, the compensation etching liquid medicine mainly consists of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spray pressure of the compensation etching section is 2.5-3.0 kg/cm < 2 >, the primary etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s; in the fluffing step, the fluffing agent is sodium hydroxide solution with the concentration of 3% -6%, wherein the using temperature is 40-50 ℃, the spraying pressure is 1.0-1.5 kg/cm < 2 >, and the fluffing time is 30-40 s; in the film stripping step, the film stripping agent is 3 to 6 percent of sodium hydroxide solution, wherein the using temperature is 40 to 50 ℃, and the spraying pressure is 1.0 to 1.5kg/cm 2 The film stripping treatment time is 30-40 s.
S004, surface corrosion prevention treatment, which is used for forming a protective layer on the surface of copper, wherein the surface of copper is treated by a surface treatment agent under the following corrosion prevention conditions, the concentration of the surface treatment agent is 20% -100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s.
In the surface preservative treatment step, the surface preservative treatment agent is a mixture formed by mixing a copper protective agent and a copper antioxidant according to a ratio of 1:1-1:3. Here, copper protectants and copper antioxidants are known commercially available products.
The invention has the beneficial effects that: the invention provides a metal copper surface etching process,the method comprises the following steps: surface microetching treatment for removing impurities on the copper surface; pattern coating, which is used for attaching a corresponding pattern on the copper surface; etching for forming a pattern on the copper surface; and, a surface anti-corrosion treatment for forming a protective layer on the copper surface. Wherein in the surface microetching treatment step, microetching cleaning agent is utilized to spray at the temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm 2 The copper surface is treated under the cleaning condition that the cleaning time is 30-60 s; in the step of pattern coating, the method specifically comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying; in the etching step, the etching includes one-time etching, compensation etching, cleaning, puffing and film stripping; and, in the surface preservative treatment step, the surface treatment agent is used at the use temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm 2 The copper surface is treated under the anticorrosion condition that the cleaning time is 30-60 s. In summary, after the etching molding is finished, a surface anti-corrosion treatment procedure is added to the product manufactured by the manufacturing process, and a protective layer is formed on the surface of copper so as to achieve the aims of corrosion prevention and oxidation prevention, prevent defective products caused by advanced oxidation corrosion, and improve the production yield of finished products.
Referring to fig. 2, in one embodiment, a semi-finished product performance test is included between the etching step and the surface preservative treatment step, including appearance test and accuracy test. It will be appreciated that the antenna material after etching has a corresponding function, and therefore, a detection step is added to extract the defective products occurring in the etching step. Specifically, the appearance detection is to compare the etching pattern on the surface of the material with the exposure pattern to determine the etching effect. Similarly, the accuracy detection is to select exposure patterns with different sizes and compare the exposure patterns with etching patterns on the surface of the incoming material to determine etching accuracy.
Example 1
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is copper protective agent and copper antioxidant according to the proportion1:1, the concentration of the surface treatment agent is 100%, the spraying temperature is 20 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 20-25 nm.
Example 2
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, the concentration of the chemical agent of the surface treatment is 90 percent, the spraying temperature is 20 ℃, the spraying time is 60 seconds, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 15-20 nm.
Example 3
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, the concentration of the chemical agent of the surface treatment is 80 percent, the spraying temperature is 20 ℃, the spraying time is 60 seconds, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 8-12 nm.
Example 4
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, the concentration of the chemical agent of the surface treatment is 100 percent, the spraying temperature is 25 ℃, the spraying time is 60 seconds, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 30-35 nm.
Example 5
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent for the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, and the chemical agent for the surface preservative treatment is prepared by the following steps ofThe concentration is 100%, the spraying temperature is 30 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 28-40 nm.
Example 6
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, the concentration of the chemical agent of the surface treatment is 100 percent, the spraying temperature is 20 ℃, the spraying time is 30 seconds, and the spraying pressure is 1.0kg/cm 2 . Finally, the thickness of the formed protective layer is 3-5 nm.
Example 7
After finishing the working procedures of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the working procedures of surface preservative treatment, wherein the chemical agent of the surface preservative treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the proportion of 1:1, the concentration of the chemical agent of the surface treatment is 100 percent, the spraying temperature is 20 ℃, the spraying time is 30 seconds, and the spraying pressure is 1.5kg/cm 2 . Finally, the thickness of the formed protective layer is 3-5 nm.
From the results of the embodiments 1 to 3, it is understood that the higher the concentration of the surface treatment agent is, the thicker the protective layer is; from the results of examples 1, 4 and 5, it is understood that the higher the spraying temperature of the surface treatment agent is, the thicker the protective layer is; from the results of the embodiments 1 and 6, it is understood that the longer the spraying time of the surface treatment agent is, the thicker the protective layer is; and, as is clear from the results of the implementation of examples 1 and 7, the spray pressure of the surface treatment agent has little influence on the thickness of the protective layer.
In a second aspect, the application also provides an automated production line for implementing the metal copper surface etching process, wherein the automated production line comprises a feeding device, a cleaning device, an ink coating device, an etching device and a surface anti-corrosion treatment device which are sequentially connected and realize automatic transmission of incoming materials.
According to the automatic production line provided by the invention, the steps are realized through the feeding device, the cleaning device, the printing ink coating device, the etching device and the surface anti-corrosion treatment device which are sequentially connected, and finally, the improvement of the production efficiency of copper finished products is realized.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (9)

1. A metal copper surface etching process is characterized in that: the metal copper surface etching process comprises the following steps:
a surface microetching treatment for removing impurities from the copper surface, wherein the copper surface is treated with a microetching cleaning agent under the following cleaning conditions, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s;
the pattern coating is used for attaching a corresponding pattern on the copper surface, wherein the pattern coating comprises the steps of film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
etching for patterning a copper surface, wherein the etching includes one-time etching, compensation etching, cleaning, puffing, and film stripping;
the surface corrosion prevention treatment is used for forming a protective layer on the surface of copper, wherein the surface of copper is treated by a surface treatment agent under the following corrosion prevention conditions, the concentration of the surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The cleaning time is 30-60 s; in the surface preservative treatment step, the surface preservative treatment agent is a mixture formed by mixing a copper protective agent and a copper antioxidant according to a ratio of 1:1-1:3.
2. The metallic copper surface etching process according to claim 1, wherein: the microetching cleaning agent is a mixed solution mainly composed of 5-10% hydrogen peroxide, 5-10 g/L copper ions and 5-10% sulfuric acid.
3. The metallic copper surface etching process according to claim 1, wherein:
in the film pressing step, the film pressing pressure was 3.0kg/cm 2 The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min;
in the development step, the use temperature of the developing solution is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 Developing time is 30-60 s; and
in the liquid washing step, the use temperature of the liquid washing is 20-30 ℃ and the spraying pressure is 1.0-1.5 kg/cm 2 The liquid washing time is 5-10 s.
4. The metallic copper surface etching process according to claim 1, wherein:
in the primary etching step, the primary etching liquid medicine mainly consists of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spraying pressure of the primary etching section is 2.5-3.0 kg/cm 2 The primary etching temperature is 45-50 ℃, and the primary etching speed is 2.0-5.0 m/min.
5. The metallic copper surface etching process according to claim 1, wherein:
in the compensation etching step, the compensation etching liquid medicine mainly consists of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl 2 The mixed solution is composed, wherein the spray pressure of the compensation etching section is 2.5-3.0 kg/cm 2 The primary etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s.
6. The metallic copper surface etching process according to claim 1, wherein:
in the fluffing step, the fluffing agent is sodium hydroxide solution with the concentration of 3% -6%, wherein the using temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm 2 The fluffing time is 30-40 s.
7. The metallic copper surface etching process according to claim 1, wherein:
in the film stripping step, the film stripping agent is 3 to 6 percent of sodium hydroxide solution, wherein the using temperature is 40 to 50 ℃, and the spraying pressure is 1.0 to 1.5kg/cm 2 The film stripping treatment time is 30-40 s.
8. The metallic copper surface etching process according to claim 1, wherein: semi-finished product performance detection is included between the etching step and the surface preservative treatment step, and includes appearance detection and precision detection.
9. An automated production line for carrying out the metallic copper surface etching process according to any one of claims 1 to 8, characterized in that: the automatic production line comprises a feeding device, a cleaning device, an ink coating device, an etching device and a surface anti-corrosion treatment device which are sequentially connected and used for realizing automatic transmission of incoming materials.
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US4917758A (en) * 1988-05-20 1990-04-17 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
US5294519A (en) * 1990-07-05 1994-03-15 Kansai Paint Co., Ltd. Process for preparing printed-circuit board
CN103209546A (en) * 2013-04-03 2013-07-17 遂宁市广天电子有限公司 Method for making line in direct negative etching way
CN105208781A (en) * 2015-08-10 2015-12-30 江门崇达电路技术有限公司 Etching method for external layer of thick copper plate
CN108668452A (en) * 2018-06-12 2018-10-16 江苏博敏电子有限公司 A kind of PCB fine-lines electrolytic etching recycles correlation technology with copper
CN212064519U (en) * 2020-06-23 2020-12-01 珠海市凯诺微电子有限公司 Production equipment for manufacturing thick copper FPC circuit board
CN112638046A (en) * 2020-12-25 2021-04-09 合肥圣达电子科技实业有限公司 Method for preparing high-reliability ceramic copper-clad plate by etching

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1208337A (en) * 1967-08-29 1970-10-14 Int Standard Electric Corp Method to produce printed circuits
US4917758A (en) * 1988-05-20 1990-04-17 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
US5294519A (en) * 1990-07-05 1994-03-15 Kansai Paint Co., Ltd. Process for preparing printed-circuit board
CN103209546A (en) * 2013-04-03 2013-07-17 遂宁市广天电子有限公司 Method for making line in direct negative etching way
CN105208781A (en) * 2015-08-10 2015-12-30 江门崇达电路技术有限公司 Etching method for external layer of thick copper plate
CN108668452A (en) * 2018-06-12 2018-10-16 江苏博敏电子有限公司 A kind of PCB fine-lines electrolytic etching recycles correlation technology with copper
CN212064519U (en) * 2020-06-23 2020-12-01 珠海市凯诺微电子有限公司 Production equipment for manufacturing thick copper FPC circuit board
CN112638046A (en) * 2020-12-25 2021-04-09 合肥圣达电子科技实业有限公司 Method for preparing high-reliability ceramic copper-clad plate by etching

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