CN113755838A - Metal copper surface etching process and automatic production line - Google Patents

Metal copper surface etching process and automatic production line Download PDF

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Publication number
CN113755838A
CN113755838A CN202111061746.XA CN202111061746A CN113755838A CN 113755838 A CN113755838 A CN 113755838A CN 202111061746 A CN202111061746 A CN 202111061746A CN 113755838 A CN113755838 A CN 113755838A
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etching
copper
cleaning
agent
treatment
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CN113755838B (en
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李俊
肖竞
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Anhui Tatfook Technology Co Ltd
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Anhui Tatfook Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to the technical field of etching, and provides a metal copper surface etching process, which comprises the following steps: carrying out surface microetching treatment; pattern coating; etching; and (5) surface anticorrosion treatment. Wherein, the surface of the copper is treated by using a microetching cleaning agent under the following cleaning conditions that the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s; the pattern coating step comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying; the etching comprises one-time etching, compensation etching, cleaning, fluffing and film removing; corrosion prevention by surface treatment agentThe copper surface is treated under the condition that the concentration of a surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s. The etching process for the surface of the metal copper can avoid the occurrence of defective products caused by advanced oxidation corrosion of the metal copper, thereby improving the yield of finished products.

Description

Metal copper surface etching process and automatic production line
Technical Field
The invention relates to the technical field of etching, and particularly provides a metal copper surface etching process and an automatic production line for implementing the metal copper surface etching process.
Background
The metal copper surface etching process is a method for etching a corresponding pattern on the surface of a copper plate or a copper foil by adopting a medicament. The surface of a semi-finished product manufactured by the existing copper surface etching process is easy to corrode or oxidize, thereby causing the problem of low yield of the etching process.
Disclosure of Invention
The invention aims to provide a metal copper surface etching process, which aims to solve the problem of low yield caused by corrosion or oxidation of a semi-finished product of the existing copper surface etching process.
In order to achieve the purpose, the invention adopts the technical scheme that:
in a first aspect, the present application provides a metallic copper surface etching process, including the following steps:
the method comprises the following steps of carrying out surface micro-etching treatment for removing impurities on the surface of copper, wherein the surface of the copper is treated by using a micro-etching cleaning agent under the following cleaning conditions, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s;
pattern coating, wherein the pattern coating is used for attaching a corresponding pattern on the copper surface, and the pattern coating comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
etching, wherein the etching is used for forming a pattern on the copper surface, and comprises one-time etching, compensation etching, cleaning, fluffing and film stripping;
the surface corrosion prevention treatment is used for forming a protective layer on the surface of copper, wherein the surface of the copper is treated by utilizing a surface treatment agent under the following corrosion prevention conditions, the concentration of the surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s.
The invention has the beneficial effects that: the invention provides a metal copper surface etching process, which comprises the following steps: surface microetching treatment ofRemoving impurities on the surface of the copper; pattern coating for attaching a corresponding pattern on the copper surface; etching for forming a pattern on the copper surface; and surface anticorrosion treatment for forming a protective layer on the copper surface. Wherein in the surface microetching treatment step, the microetching cleaning agent is used for cleaning at the temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm2Treating the copper surface under the cleaning condition that the cleaning time is 30-60 s; in the step of pattern coating, pressing a film, cooling and temporarily storing, exposing, tearing the film, developing, washing and drying; in the etching step, the etching comprises one-time etching, compensation etching, cleaning, fluffing and film removing; and in the surface antiseptic treatment step, the surface treatment agent is utilized to spray at the use temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm2And treating the copper surface under the anticorrosive condition with the cleaning time of 30-60 s. In conclusion, after the product manufactured by the manufacturing process is etched and formed, a surface anticorrosion treatment process is added to form a protective layer on the surface of copper, so that the purposes of corrosion resistance and oxidation resistance are achieved, and the defect products caused by advanced oxidation corrosion are avoided, thereby improving the production yield of finished products.
In one embodiment, the microetching cleaning agent is a mixed solution mainly composed of 5% -10% hydrogen peroxide, 5-10 g/L copper ions and 5% -10% sulfuric acid.
In one embodiment, in the lamination step, the lamination pressure is 3.0kg/cm2The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min;
in the developing step, the using temperature of the developing solution is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The developing time is 30-60 s; and
in the liquid washing step, the use temperature of the liquid washing is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The washing time is 5-10 s.
In one embodiment, in the primary etching step, the primary etching solution is mainly composed of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2A mixed solution of the composition whereinThe spraying pressure of the primary etching section is 2.5-3.0 kg/cm2The first etching temperature is 45-50 ℃, and the first etching speed is 2.0-5.0 m/min.
In one embodiment, in the compensation etching step, the compensation etching solution is mainly composed of 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2The spray pressure of the compensation etching section is 2.5-3.0 kg/cm2, the primary etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s.
In one embodiment, in the step of puffing, the puffing agent is a sodium hydroxide solution with the concentration of 3% -6%, wherein the using temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm2And the fluffing time is 30-40 s.
In one embodiment, in the step of removing the film, the film removing agent is 3% -6% of sodium hydroxide solution, wherein the use temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The film removing time is 30-40 s.
In one embodiment, in the surface anticorrosion treatment step, the surface anticorrosion treatment agent is a mixture formed by mixing a copper protective agent and a copper antioxidant according to a ratio of 1: 1-1: 3.
In one embodiment, a semi-finished product performance test is included between the etching step and the surface anticorrosion treatment step, and the semi-finished product performance test comprises appearance test and precision test.
In a second aspect, the present application further provides an automatic production line for implementing the above metal copper surface etching process, the automatic production line includes a feeding device, a cleaning device, an ink coating device, an etching device and a surface anti-corrosion treatment device which are sequentially connected and realize the automatic transmission of incoming materials.
The invention has the beneficial effects that: according to the automatic production line provided by the invention, the steps are realized through the feeding device, the cleaning device, the printing ink coating device, the etching device and the surface anti-corrosion treatment device which are sequentially connected, and finally, the production efficiency of a copper finished product is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a flow chart of a copper metal surface etching process according to an embodiment of the present invention;
fig. 2 is another flow chart of a copper metal surface etching process according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, the etching process for copper surface according to the present application includes the following steps:
s001, carrying out surface microetching treatment for removing impurities on the surface of copper, wherein the surface of the copper is treated by using a microetching cleaning agent under the following cleaning conditions that the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s;
the surface microetching treatment can be performed by spraying or ultrasonic cleaning, and a corresponding microetching cleaning agent is selected according to an impurity removal object, specifically, the microetching cleaning agent can be an acidic microetching cleaning agent or an alkaline microetching cleaning agent.
Illustratively, the microetching cleaning agent is a mixed solution mainly composed of 5% -10% hydrogen peroxide, 5-10 g/L copper ions and 5% -10% sulfuric acid.
S002, pattern coating, namely attaching corresponding patterns to the surface of the copper, wherein the pattern coating comprises the steps of film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
as can be understood, pattern coating is the steps of film pressing, temporary cooling storage, exposure, film tearing, development, liquid washing and drying sequentially performed on the copper surface; wherein, the pressing die is used for covering a film layer on the surface of copper and preparing for an exposure process; the temporary cooling storage is to keep the coated copper plate still, and the still standing time is generally 15 min; exposing to leave pattern image on the copper plate after film pasting; the film tearing is to remove the exposed film layer on the copper surface; developing to show the pattern image on the copper surface; the surface of the developed copper plate is removed by liquid washing and drying, and then, the copper plate is subjected to drying treatment to remove moisture on the surface.
Specifically, in the lamination step, the lamination pressure was 3.0kg/cm2The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min; in the developing step, the using temperature of the developing solution is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The developing time is 30-60 s; and in the step of liquid washing, the using temperature of the liquid washing is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The washing time is 5-10 s.
S003, etching, namely forming a pattern on the copper surface, wherein the etching comprises primary etching, compensation etching, cleaning, fluffing and film removing;
understandably, the primary etching is to etch the undeveloped area of the copper plate surface; the compensation etching is to carry out secondary etching on the corroded area of the copper plate so as to ensure the etching effect; the cleaning is to wash away the etching solution on the surface of the copper plate; fluffing is performed by fluffing the surface of the copper plate with an alkaline agent, for example, a sodium hydroxide solution, and stripping is performed by further cleaning the surface of the copper plate with an alkaline agent, and generally, the same alkaline solution is used for fluffing and stripping steps.
Wherein, in the primary etching step, the primary etching liquid medicine mainly comprises 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2The spraying pressure of the primary etching section is 2.5-3.0 kg/cm2The first etching temperature is 45-50 ℃, and the first etching speed is 2.0-5.0 m/min; in the compensation etching step, the compensation etching liquid mainly comprises 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2The spray pressure of the compensation etching section is 2.5-3.0 kg/cm2, the primary etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s; in the fluffing step, the fluffing agent is a sodium hydroxide solution with the concentration of 3-6%, wherein the use temperature is 40-50 ℃, the spraying pressure is 1.0-1.5 kg/cm2, and the fluffing time is 30-40 s; in the step of film removing, the film removing agent is 3 to 6 percentSodium hydroxide solution, wherein the using temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The film removing time is 30-40 s.
S004, performing surface anticorrosion treatment for forming a protective layer on the surface of copper, wherein the surface of the copper is treated by using a surface treatment agent under the following anticorrosion conditions, the concentration of the surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s.
In the surface anticorrosion treatment step, a surface anticorrosion treatment agent is a mixture formed by mixing a copper protective agent and a copper antioxidant according to a ratio of 1: 1-1: 3. Here, the copper protectant and the copper antioxidant are known commercial products.
The invention has the beneficial effects that: the invention provides a metal copper surface etching process, which comprises the following steps: carrying out surface micro-etching treatment for removing impurities on the surface of the copper; pattern coating for attaching a corresponding pattern on the copper surface; etching for forming a pattern on the copper surface; and surface anticorrosion treatment for forming a protective layer on the copper surface. Wherein in the surface microetching treatment step, the microetching cleaning agent is used for cleaning at the temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm2Treating the copper surface under the cleaning condition that the cleaning time is 30-60 s; in the step of pattern coating, pressing a film, cooling and temporarily storing, exposing, tearing the film, developing, washing and drying; in the etching step, the etching comprises one-time etching, compensation etching, cleaning, fluffing and film removing; and in the surface antiseptic treatment step, the surface treatment agent is utilized to spray at the use temperature of 20-30 ℃ and the spraying pressure of 1.0-1.5 kg/cm2And treating the copper surface under the anticorrosive condition with the cleaning time of 30-60 s. In conclusion, after the product manufactured by the manufacturing process is etched and formed, a surface anticorrosion treatment process is added to form a protective layer on the surface of copper, so that the purposes of corrosion resistance and oxidation resistance are achieved, and the defect products caused by advanced oxidation corrosion are avoided, thereby improving the production yield of finished products.
Referring to fig. 2, in one embodiment, a semi-finished product performance test is included between the etching step and the surface anticorrosion treatment step, and the semi-finished product performance test includes an appearance test and a precision test. It can be understood that the antenna material after etching has a corresponding function, and therefore, a detection step is added to extract the defective products generated in the etching step. Specifically, the appearance inspection is to compare the etching pattern on the surface of the material with the exposure pattern to determine the etching effect. Similarly, the precision detection is to compare the exposure patterns with different dimensions with the etching patterns on the surface of the supplied material to determine the etching precision.
Example 1
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 100 percent, the spraying temperature is 20 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 20-25 nm.
Example 2
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 90%, the spraying temperature is 20 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 15-20 nm.
Example 3
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 80%, the spraying temperature is 20 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 8-12 nm.
Example 4
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 100 percent, the spraying temperature is 25 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 30-35 nm.
Example 5
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 100 percent, the spraying temperature is 30 ℃, the spraying time is 60s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 28-40 nm.
Example 6
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 100 percent, the spraying temperature is 20 ℃, the spraying time is 30s, and the spraying pressure is 1.0kg/cm2. Finally, the thickness of the formed protective layer is 3-5 nm.
Example 7
After finishing the process steps of surface pretreatment, pattern coating, etching and semi-finished product performance detection, in the process step of surface anticorrosion treatment, the agent for surface anticorrosion treatment is a mixture formed by mixing a copper protective agent and a copper antioxidant according to the ratio of 1:1, the concentration of the agent for surface treatment is 100 percent, the spraying temperature is 20 ℃, the spraying time is 30s, and the spraying pressure is 1.5kg/cm2. Finally, the thickness of the formed protective layer is 3-5 nm.
From the results of examples 1 to 3, it is understood that the higher the concentration of the surface treatment agent, the thicker the thickness of the protective layer; from the results of examples 1, 4, and 5, it is understood that the higher the spraying temperature of the surface treatment agent, the thicker the protective layer; from the results of examples 1 and 6, it is understood that the longer the time for spraying the surface treatment agent, the thicker the thickness of the protective layer; as is clear from the results of examples 1 and 7, the thickness of the protective layer was not greatly affected by the spray pressure of the surface treatment agent.
In a second aspect, the present application further provides an automatic production line for implementing the above metal copper surface etching process, where the automatic production line includes a feeding device, a cleaning device, an ink coating device, an etching device, and a surface anticorrosion treatment device, which are sequentially connected and implement automatic transmission of incoming materials.
According to the automatic production line provided by the invention, the steps are realized through the feeding device, the cleaning device, the printing ink coating device, the etching device and the surface anti-corrosion treatment device which are sequentially connected, and finally, the production efficiency of a copper finished product is improved.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A metal copper surface etching process is characterized in that: the metal copper surface etching process comprises the following steps:
the method comprises the following steps of carrying out surface micro-etching treatment for removing impurities on the surface of copper, wherein the surface of the copper is treated by using a micro-etching cleaning agent under the following cleaning conditions, the cleaning temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s;
pattern coating, wherein the pattern coating is used for attaching a corresponding pattern on the copper surface, and the pattern coating comprises film pressing, cooling temporary storage, exposure, film tearing, development, liquid washing and drying;
etching, wherein the etching is used for forming a pattern on the copper surface, and comprises one-time etching, compensation etching, cleaning, fluffing and film stripping;
the surface corrosion prevention treatment is used for forming a protective layer on the surface of copper, wherein the surface of the copper is treated by utilizing a surface treatment agent under the following corrosion prevention conditions, the concentration of the surface treatment agent is 20-100%, the use temperature is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The cleaning time is 30-60 s.
2. The metallic copper surface etching process of claim 1, wherein: the microetching cleaning agent is a mixed solution mainly composed of 5% -10% of hydrogen peroxide, 5-10 g/L of copper ions and 5% -10% of sulfuric acid.
3. The metallic copper surface etching process of claim 1, wherein:
in the film pressing step, the film pressing pressure is 3.0kg/cm2The temperature of the film pressing roller is 70-80 ℃, and the film pressing speed is 2-5 m/min;
in the developing step, the using temperature of the developing solution is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The developing time is 30-60 s; and
in the liquid washing step, the use temperature of the liquid washing is 20-30 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The washing time is 5-10 s.
4. The metallic copper surface etching process of claim 1, wherein:
in the primary etching step, primary etching liquid medicine mainly comprises 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2The spraying pressure of the primary etching section is 2.5-3.0 kg/cm2The first etching temperature is 45-50 ℃, and the first etching speed is 2.0-5.0 m/min.
5. The metallic copper surface etching process of claim 1, wherein:
in the compensation etching step, the compensation etching liquid medicine mainly comprises 1.0-1.4 mol/L HCl and 150-170 g/L CuCl2The spray pressure of the compensation etching section is 2.5-3.0 kg/cm2The first etching temperature is 45-50 ℃, and the compensation etching time is 10-15 s.
6. The metallic copper surface etching process of claim 1, wherein:
in the step of loosening, the loosening agent is a sodium hydroxide solution with the concentration of 3% -6%, wherein the using temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm2And the fluffing time is 30-40 s.
7. The process of etching a copper metal surface according to claim 1, wherein:
in the step of film removing, the film removing agent is 3% -6% of sodium hydroxide solution, wherein the use temperature is 40-50 ℃, and the spraying pressure is 1.0-1.5 kg/cm2The film removing time is 30-40 s.
8. The metallic copper surface etching process of claim 1, wherein:
in the surface anticorrosion treatment step, the surface anticorrosion treatment agent is a mixture formed by mixing a copper protective agent and a copper antioxidant according to a ratio of 1: 1-1: 3.
9. The metallic copper surface etching process of claim 1, wherein: and detecting the performance of a semi-finished product between the etching step and the surface anticorrosion treatment step, wherein the detection of the performance of the semi-finished product comprises appearance detection and precision detection.
10. An automated production line for carrying out the etching process of copper metal surfaces according to any one of claims 1 to 9, characterized in that: the automatic production line comprises a feeding device, a cleaning device, an ink coating device, an etching device and a surface anti-corrosion treatment device which are sequentially connected and realize automatic transmission of supplied materials.
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CN105208781A (en) * 2015-08-10 2015-12-30 江门崇达电路技术有限公司 Etching method for external layer of thick copper plate
CN108668452A (en) * 2018-06-12 2018-10-16 江苏博敏电子有限公司 A kind of PCB fine-lines electrolytic etching recycles correlation technology with copper
CN212064519U (en) * 2020-06-23 2020-12-01 珠海市凯诺微电子有限公司 Production equipment for manufacturing thick copper FPC circuit board
CN112638046A (en) * 2020-12-25 2021-04-09 合肥圣达电子科技实业有限公司 Method for preparing high-reliability ceramic copper-clad plate by etching

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1208337A (en) * 1967-08-29 1970-10-14 Int Standard Electric Corp Method to produce printed circuits
US4917758A (en) * 1988-05-20 1990-04-17 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
US5294519A (en) * 1990-07-05 1994-03-15 Kansai Paint Co., Ltd. Process for preparing printed-circuit board
CN103209546A (en) * 2013-04-03 2013-07-17 遂宁市广天电子有限公司 Method for making line in direct negative etching way
CN105208781A (en) * 2015-08-10 2015-12-30 江门崇达电路技术有限公司 Etching method for external layer of thick copper plate
CN108668452A (en) * 2018-06-12 2018-10-16 江苏博敏电子有限公司 A kind of PCB fine-lines electrolytic etching recycles correlation technology with copper
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