CN113973440B - Circuit board insulating layer treatment process - Google Patents
Circuit board insulating layer treatment process Download PDFInfo
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- CN113973440B CN113973440B CN202111264108.8A CN202111264108A CN113973440B CN 113973440 B CN113973440 B CN 113973440B CN 202111264108 A CN202111264108 A CN 202111264108A CN 113973440 B CN113973440 B CN 113973440B
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- Prior art keywords
- layer
- copper foil
- copper
- circuit board
- insulating layer
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Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 119
- 239000011889 copper foil Substances 0.000 claims abstract description 90
- 238000005530 etching Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 22
- 239000000243 solution Substances 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007788 roughening Methods 0.000 claims description 9
- 239000003513 alkali Substances 0.000 claims description 7
- 239000002585 base Substances 0.000 claims description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 241000530268 Lycaena heteronea Species 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a circuit board insulating layer treatment process, which comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating substrate, the top surface of the insulating substrate is provided with a top copper foil, the bottom surface of the insulating substrate is provided with a bottom copper foil, the top surface of the top copper foil is provided with a first insulating layer, the bottom surface of the bottom copper foil is provided with a second insulating layer, and the treatment process comprises the following steps: A. drilling holes; B. copper deposition; C. electroplating the whole plate; D. sticking a photosensitive dry film; E. exposing and developing; F. electroplating patterns; G. etching; H. forming a first insulating layer; I. manufacturing a second insulating layer; the invention has the beneficial effects that the circuit is insulated between the circuit board and the metal contact layer by adopting the epoxy resin through a pressing mode, the defects of aging and circuit leakage existing in the original insulation by using the printing ink can be effectively overcome, the service life of the circuit board in a high-temperature and high-humidity working environment can be prolonged, the risk of leakage of the circuit board with the metal shell contact layer is avoided, and the invention has good market application value.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board insulating layer treatment process.
Background
The insulation treatment of the circuit layer of the common circuit board adopts a printing ink treatment mode, which is unfavorable for the circuit in a high-temperature and high-humidity working environment, in particular to the circuit in the contact layer with the metal shell. The printed ink is easy to have the problem of ageing of insulating property, so that the leakage phenomenon of the insulating material of the circuit board can be caused, and therefore, the prior art has defects and needs to be improved.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a circuit board insulating layer treatment process for solving the problems in the background art; in order to achieve the above purpose, the present invention adopts the following technical scheme: the circuit board insulating layer treatment process comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating substrate, a top layer copper foil is arranged on the top surface of the insulating substrate, a bottom layer copper foil is arranged on the bottom surface of the insulating substrate, a first insulating layer is arranged on the top surface of the top layer copper foil, a second insulating layer is arranged on the bottom surface of the bottom layer copper foil, and the treatment process comprises the following steps:
step A, carrying out laser drilling on a position of the copper-clad plate, which needs to be drilled;
step B, copper deposition, namely copper plating is carried out on the inner part of the drilled hole on the copper-clad plate;
Step C, electroplating the whole plate;
step D, respectively attaching photosensitive dry films on the top-layer copper foil and the bottom-layer copper foil;
E, exposing and developing, wherein the step comprises the steps of exposing the photosensitive dry films on the top-layer copper foil and the bottom-layer copper foil by using an LDI (laser direct structuring) exposure machine and performing developing treatment;
F, electroplating the patterns;
Step G, etching to form a top circuit layer and a bottom circuit layer on the insulating substrate, wherein etching liquid is used for etching and removing the copper foils except the pattern plating of the top copper foil and the bottom copper foil to form the top circuit layer and the bottom circuit layer;
Step H, using solder resist ink to solder resist the top layer circuit to form a first insulating layer;
and I, manufacturing a second insulating layer by using epoxy resin.
Preferably, the method further comprises a step K and a pre-step before the step A;
The step K comprises the following steps: step K1, cleaning a copper-clad plate, and cleaning exposed surfaces of a top copper foil and a bottom copper foil;
Step K2, roughening the copper surface, wherein the roughening treatment comprises the step of roughening the exposed surfaces of the top-layer copper foil and the bottom-layer copper foil;
and step K3, cleaning and drying the whole copper-clad plate.
Preferably, the step E includes:
E1, exposing, namely respectively exposing the photosensitive dry films on the top copper foil and the bottom copper foil by using an LDI exposure machine to form exposure patterns and character patterns on the top copper foil and the bottom copper foil by using the photosensitive dry films;
e2, developing, namely dissolving the photosensitive dry films of the unexposed parts of the top-layer copper foil and the bottom-layer copper foil by using a weak base solution;
Step E3, drying the copper-clad plate;
Preferably, the step F includes:
step F1, plating a layer of copper on unexposed positions of the top copper foil and the bottom copper foil respectively to form a top copper plating layer and a bottom copper plating layer;
and F2, plating an etching-resistant layer on the top copper plating layer and the bottom copper plating layer respectively.
Preferably, step L is further included after step F and before step G, wherein step L includes removing the film, removing the photosensitive dry film covered on the top copper foil and the bottom copper foil by using a strong alkali solution, and washing the copper-clad plate with water.
Preferably, after the step G and before the step H, a step M is further included, and a line inspection step, where the step M includes:
m1, removing etching-resistant layers on a top copper foil and a bottom copper foil;
and M2, performing optical visual inspection on the top circuit layer and the bottom circuit layer.
Preferably, the step H includes the steps of:
step H1, brushing solder resist ink on the top circuit layer;
Step H2, heating and pre-baking the solder resist ink to primarily solidify the solder resist ink;
Step H3, solidifying the solder resist ink by using an LDI exposure machine to form a solder resist pattern, and attaching the solder resist pattern on the top circuit layer;
And H4, cleaning the solder resist ink of the unexposed area, and heating to cure the solder resist ink.
Preferably, the step I includes the steps of:
Step I1, manufacturing a semi-cured insulating sheet by using epoxy resin;
step I2, sticking the semi-cured insulating sheet on the bottom circuit layer;
and step I3, heating and pressing the semi-cured insulating sheet and the circuit board to enable the semi-cured insulating sheet and the circuit board to be completely combined, and forming a second insulating layer on the bottom surface of the circuit board, wherein the thickness of the second insulating layer is 0.15-0.2MM.
Preferably, the weak base solution is sodium carbonate aqueous solution, and the concentration is 0.8% -1.2%.
Preferably, the strong alkali solution is sodium hydroxide aqueous solution, and the concentration is 2.0% -3.0%.
Compared with the prior art, the method has the beneficial effects that by adopting the scheme, the circuit is insulated on the circuit board and the metal contact layer in a pressing manner by adopting the epoxy resin, the defects of aging and circuit leakage existing in the prior insulation by using the printing ink can be effectively overcome, the service life of the circuit board in a high-temperature and high-humidity working environment can be prolonged, the risk of leakage of the contact layer with the metal shell is avoided, and the method has good market application value.
Drawings
FIG. 1 is a schematic diagram of a circuit board structure according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of the circuit board processing steps according to the embodiment of FIG. 1;
FIG. 3 is a schematic flow chart of a pre-step in the circuit board treatment process according to the present invention;
FIG. 4 is a schematic flow chart of the exposing and developing steps in the circuit board treatment process of the present invention;
FIG. 5 is a schematic flow chart of a pattern electroplating step in the circuit board treatment process of the present invention;
FIG. 6 is a schematic diagram showing a circuit inspection process in the circuit board treatment process according to the present invention;
FIG. 7 is a schematic flow chart of a step of forming a first insulating layer by using solder resist ink in the circuit board treatment process of the present invention;
Fig. 8 is a schematic flow chart of a step of manufacturing a second insulating layer by using epoxy resin in the circuit board treatment process of the present invention.
Detailed Description
In order that the invention may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. There is shown in the drawings an embodiment of the invention; this invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; the terms "vertical", "horizontal", "left", "right", "front", "rear" and the like are used in this specification for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1-2, an embodiment of the present invention is a circuit board insulation layer treatment process, including a copper-clad plate 2, the copper-clad plate 2 includes an insulation substrate 3, a top copper foil 4 is disposed on a top surface of the insulation substrate 3, a bottom copper foil 5 is disposed on a bottom surface of the insulation substrate, a first insulation layer 6 is disposed on a top surface of the top copper foil 4, a second insulation layer 7 is disposed on a bottom surface of the bottom copper foil 5, and the treatment process includes the following steps:
Step A (11), carrying out laser drilling on a position of the copper-clad plate, which needs to be drilled; enabling the drill holes to sequentially penetrate through the top copper foil, the insulating substrate and the bottom copper foil;
B (12) copper deposition, namely copper plating is carried out on the inner part of the drilled hole on the copper-clad plate; the top copper foil is communicated with the bottom copper foil;
step C (13), electroplating the whole plate; thickening the thickness of the top copper foil and the bottom copper foil;
step D (14), respectively attaching photosensitive dry films on the top copper foil and the bottom copper foil;
E (15), exposing and developing, wherein the step comprises exposing the photosensitive dry films on the top copper foil and the bottom copper foil by using an LDI exposure machine, and performing developing treatment;
F (16), pattern electroplating;
G (17) etching to form a top circuit layer and a bottom circuit layer on the insulating substrate, wherein etching liquid is used for etching and removing the copper foils except the pattern electroplating of the top copper foil and the bottom copper foil to form the top circuit layer and the bottom circuit layer;
Step H (18), using solder resist ink to solder resist the top layer circuit to form a first insulating layer;
and step I (19), manufacturing a second insulating layer by using epoxy resin.
Preferably, as shown in fig. 3, a pre-step K (10) is further included before the step a, and the step K (10) includes:
Step K1 (101), cleaning a copper-clad plate, and cleaning exposed surfaces of a top copper foil and a bottom copper foil;
step K2 (102), roughening the copper surface, wherein the roughening treatment comprises the roughening treatment of the exposed surfaces of the top-layer copper foil and the bottom-layer copper foil;
And step K3 (103), cleaning and drying the whole copper-clad plate.
Removing oxidation and greasy dirt on the copper surface, cleaning the roughened copper surface to increase the adhesion force of the copper foil surface, wherein the roughened copper surface can be subjected to chemical microetching, physical polishing or sand blasting treatment, and the chemical microetching adopts a sulfuric acid solution with the concentration of 3% -5% and a hydrogen peroxide solution.
Preferably, as shown in fig. 4, the step E (15) includes:
E1 (151) exposing, namely exposing the photosensitive dry films on the top copper foil and the bottom copper foil by using an LDI exposure machine respectively to form exposure patterns and character patterns on the top copper foil and the bottom copper foil by using the photosensitive dry films; the exposure function is to make the partial figure on the photosensitive dry film photosensitive, thus form the photosensitive figure on the copper foil, the LDI exposure machine does not need film direct imaging, reduce film cost of manufacture, reduce film alignment error, the figure exposure is more accurate, the exposure speed is faster, and the energy consumption is lower.
E2 (152) developing, and dissolving the photosensitive dry films of the unexposed parts on the top copper foil and the bottom copper foil by using a weak base solution; the development is to remove the photosensitive dry film of the unexposed part to leave the photosensitive part, the unexposed photosensitive dry film does not have polymerization reaction and is dissolved by weak base, the polymerized photosensitive material is left on the plate surface to protect the copper surface below from being dissolved by etching liquid, wherein the temperature of the developing liquid is 28-32 ℃, and the developing pressure is 1.0-2.0kgf/cm 2.
E3 (153), drying the copper-clad plate;
preferably, as shown in fig. 5, the step F (16) includes:
F1 (161), plating a layer of copper on the unexposed positions of the top copper foil and the bottom copper foil respectively to form a top copper plating layer and a bottom copper plating layer; the copper layer at the pattern is thickened.
F2 (162), plating an etching-resistant layer on the top copper plating layer and the bottom copper plating layer respectively; the etching-resistant layer is used for protecting the bottom layer pattern from being etched, and the etching-resistant layer is lead or tin-lead.
Preferably, the method further comprises a film removing step after the step F (16) and before the step G (17), wherein the film removing step comprises the step L of removing the photosensitive dry films covered on the top-layer copper foil and the bottom-layer copper foil by using a strong alkali solution and washing the copper-clad plate by water; the temperature of the strong alkali solution is 45-55 ℃, the stripping pressure is 2.0-3.0kfg/cm < 2 >, and the washing pressure is 1.0-3.0kgf/cm 2.
Preferably, as shown in fig. 6, step M (180) is further included after step G (17) and before step H (18), and the line inspection step, where step M (180) includes:
m1 (1801), removing the etching-resistant layers on the top copper foil and the bottom copper foil; exposing the desired circuitry.
Step M2 (1802), performing an optical visual inspection on the top circuit layer and the bottom circuit layer; ensuring the perfect patterns of the top circuit layer and the bottom circuit layer.
Preferably, as shown in fig. 7, the step H (18) includes the steps of:
Step H1 (181), coating solder resist ink on the top circuit layer, and standing for 15 minutes;
Step H2 (182), heating and pre-baking the solder resist ink to primarily solidify the solder resist ink;
step H3 (183), curing the solder resist ink by using an LDI exposure machine to form a solder resist pattern, and attaching the solder resist pattern on the top circuit layer;
Step H4 (184), cleaning the solder resist ink of the unexposed area, and heating to cure the solder resist ink.
Preferably, as shown in fig. 8, the step I (19) includes the steps of:
Step I1 (191), manufacturing a semi-cured insulating sheet by using epoxy resin;
Step I2 (192), sticking the semi-cured insulating sheet on the bottom circuit layer;
And step I3 (193), heating and pressing the semi-cured insulating sheet and the circuit board to enable the semi-cured insulating sheet and the circuit board to be completely combined, and forming a second insulating layer on the bottom surface of the circuit board, wherein the thickness of the second insulating layer is 0.15-0.2MM.
Preferably, the weak base solution is sodium carbonate aqueous solution, and the concentration is 0.8% -1.2%.
Preferably, the strong alkali solution is sodium hydroxide aqueous solution, and the concentration is 2.0% -3.0%.
In various other embodiments, the photosensitive dry film may be replaced with photosensitive ink.
The above-described features are continuously combined with each other to form various embodiments not listed above, and are regarded as the scope of the present invention described in the specification; and, it will be apparent to those skilled in the art from this disclosure that modifications and variations can be made without departing from the scope of the invention defined in the appended claims.
Claims (7)
1. The circuit board insulating layer treatment process is characterized by comprising a copper-clad plate, wherein the copper-clad plate comprises an insulating substrate, the top surface of the insulating substrate is provided with a top copper foil, the bottom surface of the insulating substrate is provided with a bottom copper foil, the top surface of the top copper foil is provided with a first insulating layer, the bottom surface of the bottom copper foil is provided with a second insulating layer, and the treatment process comprises the following steps:
step A, carrying out laser drilling on a position of the copper-clad plate, which needs to be drilled;
step B, copper deposition, namely copper plating is carried out on the inner part of the drilled hole on the copper-clad plate;
Step C, electroplating the whole plate;
step D, respectively attaching photosensitive dry films on the top-layer copper foil and the bottom-layer copper foil;
E, exposing and developing, wherein the step comprises the steps of exposing the photosensitive dry films on the top-layer copper foil and the bottom-layer copper foil by using an LDI (laser direct structuring) exposure machine and performing developing treatment;
F, electroplating the patterns;
Step G, etching to form a top circuit layer and a bottom circuit layer on the insulating substrate, wherein etching liquid is used for etching and removing the copper foils except the pattern plating of the top copper foil and the bottom copper foil to form the top circuit layer and the bottom circuit layer;
Step H, using solder resist ink to solder resist the top layer circuit to form a first insulating layer;
step I, manufacturing a second insulating layer by using epoxy resin;
The step F comprises the following steps:
step F1, plating a layer of copper on unexposed positions of the top copper foil and the bottom copper foil respectively to form a top copper plating layer and a bottom copper plating layer;
step F2, plating an etching-resistant layer on the top copper plating layer and the bottom copper plating layer respectively;
the step H comprises the following steps:
step H1, brushing solder resist ink on the top circuit layer;
Step H2, heating and pre-baking the solder resist ink to primarily solidify the solder resist ink;
Step H3, solidifying the solder resist ink by using an LDI exposure machine to form a solder resist pattern, and attaching the solder resist pattern on the top circuit layer;
Step H4, cleaning the solder resist ink of the unexposed area, and heating to cure the solder resist ink;
The step I comprises the following steps:
Step I1, manufacturing a semi-cured insulating sheet by using epoxy resin;
step I2, sticking the semi-cured insulating sheet on the bottom circuit layer;
and step I3, heating and pressing the semi-cured insulating sheet and the circuit board to enable the semi-cured insulating sheet and the circuit board to be completely combined, and forming a second insulating layer on the bottom surface of the circuit board, wherein the thickness of the second insulating layer is 0.15-0.2MM.
2. The process for treating an insulation layer of a circuit board according to claim 1, further comprising a step K, a pre-step, before the step a;
The step K comprises the following steps: step K1, cleaning a copper-clad plate, and cleaning exposed surfaces of a top copper foil and a bottom copper foil;
Step K2, roughening the copper surface, wherein the roughening treatment comprises the step of roughening the exposed surfaces of the top-layer copper foil and the bottom-layer copper foil;
and step K3, cleaning and drying the whole copper-clad plate.
3. The process for treating an insulation layer of a circuit board according to claim 1, wherein the step E comprises:
E1, exposing, namely respectively exposing the photosensitive dry films on the top copper foil and the bottom copper foil by using an LDI exposure machine to form exposure patterns and character patterns on the top copper foil and the bottom copper foil by using the photosensitive dry films;
e2, developing, namely dissolving the photosensitive dry films of the unexposed parts of the top-layer copper foil and the bottom-layer copper foil by using a weak base solution;
And E3, drying the copper-clad plate.
4. The process according to claim 1, further comprising a step L after the step F and before the step G, wherein the step L includes removing a film, removing a photosensitive dry film coated on the top copper foil and the bottom copper foil by using a strong alkali solution, and washing the copper-clad plate with water.
5. The process according to claim 1, further comprising a step M after the step G and before the step H, wherein the step M includes:
m1, removing etching-resistant layers on a top copper foil and a bottom copper foil;
and M2, performing optical visual inspection on the top circuit layer and the bottom circuit layer.
6. The process for treating an insulating layer of a circuit board according to claim 3, wherein the weak base solution is an aqueous solution of sodium carbonate, and the concentration is 0.8% -1.2%.
7. The process for treating an insulating layer of a circuit board according to claim 4, wherein the strong alkali solution is an aqueous sodium hydroxide solution, and the concentration is 2.0% -3.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111264108.8A CN113973440B (en) | 2021-10-28 | 2021-10-28 | Circuit board insulating layer treatment process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111264108.8A CN113973440B (en) | 2021-10-28 | 2021-10-28 | Circuit board insulating layer treatment process |
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| Publication Number | Publication Date |
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| CN113973440A CN113973440A (en) | 2022-01-25 |
| CN113973440B true CN113973440B (en) | 2024-05-03 |
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| CN202111264108.8A Active CN113973440B (en) | 2021-10-28 | 2021-10-28 | Circuit board insulating layer treatment process |
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| CN115379653A (en) * | 2022-09-15 | 2022-11-22 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by laser drilling and coarsening insulating base material by using pattern track |
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| CN104320916A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Hollow-type double-sided flexible printed circuit board |
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