CN104320916A - Hollow-type double-sided flexible printed circuit board - Google Patents
Hollow-type double-sided flexible printed circuit board Download PDFInfo
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- CN104320916A CN104320916A CN201410640551.4A CN201410640551A CN104320916A CN 104320916 A CN104320916 A CN 104320916A CN 201410640551 A CN201410640551 A CN 201410640551A CN 104320916 A CN104320916 A CN 104320916A
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Abstract
The invention discloses a hollow-type double-sided flexible printed circuit board, and relates to the technical field of printed circuit boards. The production technology comprises the steps of (1) manufacturing a double-sided board, (2) drilling holes, (3) conducting copper plating, (4) conducting film pressing and exposure, (5) conducting developing, etching and film stripping, (6) conducting microetching, (7) conducting covering film pressing, (8) conducting reinforcing, (9) conducting solder plating and horizontal solder coating, (10) conducting printing and baking, and (11) conducting finished product inspection. The hollow-type double-sided flexible printed circuit board is simple in production technology, scientific in design, high in operability, capable of achieving combination of a hollow board and the double-sided board, and capable of meeting the requirement of a client.
Description
Technical field:
The present invention relates to printed circuit board technology field, be specifically related to a kind of production technology of hollow type double-faced flexible printed circuit board.
Background technology:
Flexible circuit board has many-sided application.First radio-frequency (RF) identification (RFID), the i.e. electronic tag that is commonly called as of people, as used the contactless card needed for the electronic toll collection (ETC) on highway to be exactly a kind of electronic tag.On the other hand, flexible circuit board is applied to Organic Light Emitting Diode (OLED), and the flexible screen can arbitrarily fold making to adopt, twisted carrys out the mobile electronic devices such as manufacturing intelligence mobile phone, notebook computer becomes possibility.In addition, flexible circuit board also has boundless application prospect in the field such as multifunction, organic photovoltaic special battery, organic sensor, wearable electronic, flexible memory, health care, intelligent article, intelligent yarn fabric of electronic device.
Double-faced flexible wiring board general in prior art is all between two sandwich circuits, be provided with insulating barrier, by via by two-layer connection.Under normal circumstances, client needs to be the flexible circuit board adopting single-face hollowed-out during the product of two sides pressure welding, but the flexible circuit board of this single-face hollowed-out of the prior art can not make double-deck circuit.
Summary of the invention:
The object of this invention is to provide a kind of hollow type double-faced flexible printed circuit board, its production technology is simple, and design science is workable, achieves the combination of hollowed-out board and double sided board, can meet the demand of client.
In order to solve the problem existing for background technology, the present invention is by the following technical solutions: its production technology is:
1, double sided board is made: basalis, line layer, glue-line and insulating cover are cascading, and the insulating cover side of substrate has the opening running through insulating cover and glue-line, exposes line layer;
2, hole:
Registration holes: the corner being positioned at double sided board, wherein the lower left corner is that all the other 3 angles, 2 holes (hole, direction) are 1 hole, totally 5 holes.Limit use is sought for during boring in this five hole, is also that cover Pin hole and the direction identification of exposure and AOI is used;
Broken needle inspection opening: above the hole, direction being positioned at the lower left corner, be last hole that each aperture drill point bores, causing when there being broken needle when Lou boring, namely can reduce this aperture;
Cut sections for microscopic examination hole: 1.0mm hole, subdrilling corner, rim charge position in plate, as the foundation cutting off test piece, then in inside to bore with this item number minimum-value aperture four holes as copper facing after cut sections for microscopic examination use.
3, copper facing: after boring, can conduct electricity with carbon dust attachment in hole wall Insulated positions in black holes mode, on hole wall, the object that hole copper reaches upper and lower line conduction is formed again in copper facing mode, its mode of operation is: first make hole wall positively charged with the agent of whole hole, the carbon dust of electronegative particulate is made to be attached to surface through black holes, with microetch, the carbon dust on copper face is peeled off again, wall Insulated positions of only boxing out has one deck carbon dust, after copper facing, forms hole copper;
4, press mold and exposure:
Dry film: the medium being an opposing etching liquid, by exposure by image transfer, has the position of exposure to stay and copper face can be protected in time etching not corroded formation circuit by etching solution after development;
Egative film: egative film is a transparent film, the exposure film used is a negative film, sees black part and is divided into do not wanted position, and transparent part is the position that will stay; Egative film has medicine face and non-medicine face, light scattering when medicine face mistake can cause exposure, and causes during image transfer and cannot reach desired feature sizes, causes yield to reduce, therefore should be noted that;
5, develop, etch and stripping:
Basalis after press mold/exposure, stays to protect copper face not carved by etching liquid corrosion by the place on line dry film that must retain through development, forms circuit and divested by dry film through stripping, then carry out line maintenance and cleaning-drying, form required circuit after etching;
6, microetch: be a surface treatment station, carries out slight etching to be removed by oxide etch by micro-corrosion liquid by copper face, the upper anti-oxidation of antioxidant;
7, coverlay is suppressed:
At the surface of basalis compacting layer of surface coverlay, just exposing solder joint window, simultaneously by the circuit of line layer attaching one deck copper bar coverlay, copper bar being carried out high temperature compacting, plated with nickel layer gold on the solder joint exposed, by product cleaning-drying;
8, reinforcing: stick stiffening plate in plugging position, then high-temperature laminating;
9, zinc-plated lead, horizontal tin-spraying: carry out surface treatment with the plumbous finger for CVL position of opening of electrotinning, Pad; Carry out surface treatment with horizontal tin-spraying for the finger of CVL position of opening, Pad, first remove after moisture content that basalis inhales goes up scaling powder again through baking and spray tin, washing, oven dry again;
10, printing and baking: are generally all printing words, silver is starched normally anti-welding as protection use for shielding with republishing after the printing of silver slurry;
11, product inspection: production board carries out electrical measurement, generally only surveys Open/Short/ insulation impedance, if finished product has resistance/capacitance, must test with ICT, during whole plate electrical measurement, divide into Complete test and only survey short circuit.
Further, in step 1, described basalis is the substrate that PI material is made.
Further, in step 1, described insulating cover temperature be 180 DEG C, pressure is compressed on the bottom surface of basalis under being the condition of 120kg/cm2; Line layer is bonded on the insulating cover of basalis bottom surface by glue-line, suppresses and toasts half an hour, can form stable double sided board.
Further, in step 8, described stiffening plate is distributed in the both sides of finished product, is respectively steel disc stiffening plate and FR 4 stiffening plate.
Production technology of the present invention is simple, and design science is workable, achieves the combination of hollowed-out board and double sided board, can meet the demand of client.
Embodiment:
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
This embodiment is by the following technical solutions: its production technology is:
1, double sided board is made: basalis, line layer, glue-line and insulating cover are cascading, and the insulating cover side of substrate has the opening running through insulating cover and glue-line, exposes line layer;
2, hole:
Registration holes: the corner being positioned at double sided board, wherein the lower left corner is that all the other 3 angles, 2 holes (hole, direction) are 1 hole, totally 5 holes.Limit use is sought for during boring in this five hole, is also that cover Pin hole and the direction identification of exposure and AOI is used;
Broken needle inspection opening: above the hole, direction being positioned at the lower left corner, be last hole that each aperture drill point bores, causing when there being broken needle when Lou boring, namely can reduce this aperture;
Cut sections for microscopic examination hole: 1.0mm hole, subdrilling corner, rim charge position in plate, as the foundation cutting off test piece, then in inside to bore with this item number minimum-value aperture four holes as copper facing after cut sections for microscopic examination use.
3, copper facing: after boring, can conduct electricity with carbon dust attachment in hole wall Insulated positions in black holes mode, on hole wall, the object that hole copper reaches upper and lower line conduction is formed again in copper facing mode, its mode of operation is: first make hole wall positively charged with the agent of whole hole, the carbon dust of electronegative particulate is made to be attached to surface through black holes, with microetch, the carbon dust on copper face is peeled off again, wall Insulated positions of only boxing out has one deck carbon dust, after copper facing, forms hole copper;
4, press mold and exposure:
Dry film: the medium being an opposing etching liquid, by exposure by image transfer, has the position of exposure to stay and copper face can be protected in time etching not corroded formation circuit by etching solution after development;
Egative film: egative film is a transparent film, the exposure film used is a negative film, sees black part and is divided into do not wanted position, and transparent part is the position that will stay; Egative film has medicine face and non-medicine face, light scattering when medicine face mistake can cause exposure, and causes during image transfer and cannot reach desired feature sizes, causes yield to reduce, therefore should be noted that;
5, develop, etch and stripping:
Basalis after press mold/exposure, stays to protect copper face not carved by etching liquid corrosion by the place on line dry film that must retain through development, forms circuit and divested by dry film through stripping, then carry out line maintenance and cleaning-drying, form required circuit after etching;
6, microetch: be a surface treatment station, carries out slight etching to be removed by oxide etch by micro-corrosion liquid by copper face, the upper anti-oxidation of antioxidant;
7, coverlay is suppressed:
At the surface of basalis compacting layer of surface coverlay, just exposing solder joint window, simultaneously by the circuit of line layer attaching one deck copper bar coverlay, copper bar being carried out high temperature compacting, plated with nickel layer gold on the solder joint exposed, by product cleaning-drying;
8, reinforcing: stick stiffening plate in plugging position, then high-temperature laminating;
9, zinc-plated lead, horizontal tin-spraying: carry out surface treatment with the plumbous finger for CVL position of opening of electrotinning, Pad; Carry out surface treatment with horizontal tin-spraying for the finger of CVL position of opening, Pad, first remove after moisture content that basalis inhales goes up scaling powder again through baking and spray tin, washing, oven dry again;
10, printing and baking: are generally all printing words, silver is starched normally anti-welding as protection use for shielding with republishing after the printing of silver slurry;
11, product inspection: production board carries out electrical measurement, generally only surveys Open/Short/ insulation impedance, if finished product has resistance/capacitance, must test with ICT, during whole plate electrical measurement, divide into Complete test and only survey short circuit.
Further, in step 1, described basalis is the substrate that PI material is made.
Further, in step 1, described insulating cover temperature be 180 DEG C, pressure is compressed on the bottom surface of basalis under being the condition of 120kg/cm2; Line layer is bonded on the insulating cover of basalis bottom surface by glue-line, suppresses and toasts half an hour, can form stable double sided board.
Further, in step 8, described stiffening plate is distributed in the both sides of finished product, is respectively steel disc stiffening plate and FR 4 stiffening plate.
This embodiment production technology is simple, and design science is workable, achieves the combination of hollowed-out board and double sided board, can meet the demand of client.
The above is only in order to illustrate technical scheme of the present invention and unrestricted, other amendment that those of ordinary skill in the art make technical scheme of the present invention or equivalently to replace, only otherwise depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (4)
1. hollow type double-faced flexible printed circuit board, is characterized in that its production technology is:
(1), double sided board is made: basalis, line layer, glue-line and insulating cover are cascading, and the insulating cover side of substrate has the opening running through insulating cover and glue-line, exposes line layer;
(2), hole:
Registration holes: the corner being positioned at double sided board, wherein the lower left corner is that all the other 3 angles, 2 holes (hole, direction) are 1 hole, totally 5 holes.Limit use is sought for during boring in this five hole, is also that cover Pin hole and the direction identification of exposure and AOI is used;
Broken needle inspection opening: above the hole, direction being positioned at the lower left corner, be last hole that each aperture drill point bores, causing when there being broken needle when Lou boring, namely can reduce this aperture;
Cut sections for microscopic examination hole: 1.0mm hole, subdrilling corner, rim charge position in plate, as the foundation cutting off test piece, then in inside to bore with this item number minimum-value aperture four holes as copper facing after cut sections for microscopic examination use;
(3), copper facing: after boring, can conduct electricity with carbon dust attachment in hole wall Insulated positions in black holes mode, on hole wall, the object that hole copper reaches upper and lower line conduction is formed again in copper facing mode, its mode of operation is: first make hole wall positively charged with the agent of whole hole, the carbon dust of electronegative particulate is made to be attached to surface through black holes, with microetch, the carbon dust on copper face is peeled off again, wall Insulated positions of only boxing out has one deck carbon dust, after copper facing, forms hole copper;
(4), press mold and exposure:
Dry film: the medium being an opposing etching liquid, by exposure by image transfer, has the position of exposure to stay and copper face can be protected in time etching not corroded formation circuit by etching solution after development;
Egative film: egative film is a transparent film, the exposure film used is a negative film, sees black part and is divided into do not wanted position, and transparent part is the position that will stay; Egative film has medicine face and non-medicine face, light scattering when medicine face mistake can cause exposure, and causes during image transfer and cannot reach desired feature sizes, causes yield to reduce, therefore should be noted that;
(5), develop, etch and stripping:
Basalis after press mold/exposure, stays to protect copper face not carved by etching liquid corrosion by the place on line dry film that must retain through development, forms circuit and divested by dry film through stripping, then carry out line maintenance and cleaning-drying, form required circuit after etching;
(6), microetch: be a surface treatment station, by micro-corrosion liquid, copper face carried out slight etching to be removed by oxide etch, then go up the anti-oxidation of antioxidant;
(7), coverlay is suppressed:
At the surface of basalis compacting layer of surface coverlay, just exposing solder joint window, simultaneously by the circuit of line layer attaching one deck copper bar coverlay, copper bar being carried out high temperature compacting, plated with nickel layer gold on the solder joint exposed, by product cleaning-drying;
(8), reinforcing: stick stiffening plate in plugging position, then high-temperature laminating;
(9), zinc-plated lead, horizontal tin-spraying: carry out surface treatment with the plumbous finger for CVL position of opening of electrotinning, Pad; Carry out surface treatment with horizontal tin-spraying for the finger of CVL position of opening, Pad, first remove after moisture content that basalis inhales goes up scaling powder again through baking and spray tin, washing, oven dry again;
(10), printing and baking: are generally all printing words, silver is starched normally anti-welding as protection use for shielding with republishing after the printing of silver slurry;
(11), product inspection: production board carries out electrical measurement, generally only surveys Open/Short/ insulation impedance, if finished product has resistance/capacitance, must test with ICT, during whole plate electrical measurement, divide into Complete test and only survey short circuit.
2. hollow type double-faced flexible printed circuit board according to claim 1, is characterized in that, in step (1), described basalis is the substrate that PI material is made.
3. hollow type double-faced flexible printed circuit board according to claim 1, is characterized in that in step (1), described insulating cover temperature be 180 DEG C, pressure is compressed on the bottom surface of basalis under being the condition of 120kg/cm2; Line layer is bonded on the insulating cover of basalis bottom surface by glue-line, suppresses and toasts half an hour, can form stable double sided board.
4. hollow type double-faced flexible printed circuit board according to claim 1, is characterized in that, in step (8), described stiffening plate is distributed in the both sides of finished product, is respectively steel disc stiffening plate and FR 4 stiffening plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640551.4A CN104320916A (en) | 2014-11-14 | 2014-11-14 | Hollow-type double-sided flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640551.4A CN104320916A (en) | 2014-11-14 | 2014-11-14 | Hollow-type double-sided flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN104320916A true CN104320916A (en) | 2015-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410640551.4A Pending CN104320916A (en) | 2014-11-14 | 2014-11-14 | Hollow-type double-sided flexible printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163503A (en) * | 2015-08-31 | 2015-12-16 | 昆山龙朋精密电子有限公司 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
| CN109511228A (en) * | 2018-12-21 | 2019-03-22 | 苏州美吉纳纳米新材料科技有限公司 | Conditioner and preparation method thereof before a kind of selectivity PCB black holes |
| CN113973440A (en) * | 2021-10-28 | 2022-01-25 | 深圳市亿方电子有限公司 | Circuit board insulating layer treatment process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314229A (en) * | 2001-04-10 | 2002-10-25 | Sharp Corp | Method for manufacturing flexible printed circuit board |
| CN101553089A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Production technology of hollow-out double-sided flexible printed circuit board |
| CN102665372A (en) * | 2012-05-16 | 2012-09-12 | 上海埃富匹西电子有限公司 | Two-sided hollow flexible circuit board and manufacturing method thereof |
-
2014
- 2014-11-14 CN CN201410640551.4A patent/CN104320916A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314229A (en) * | 2001-04-10 | 2002-10-25 | Sharp Corp | Method for manufacturing flexible printed circuit board |
| CN101553089A (en) * | 2009-05-11 | 2009-10-07 | 昆山亿富达电子有限公司 | Production technology of hollow-out double-sided flexible printed circuit board |
| CN102665372A (en) * | 2012-05-16 | 2012-09-12 | 上海埃富匹西电子有限公司 | Two-sided hollow flexible circuit board and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163503A (en) * | 2015-08-31 | 2015-12-16 | 昆山龙朋精密电子有限公司 | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
| CN109511228A (en) * | 2018-12-21 | 2019-03-22 | 苏州美吉纳纳米新材料科技有限公司 | Conditioner and preparation method thereof before a kind of selectivity PCB black holes |
| CN109511228B (en) * | 2018-12-21 | 2020-12-04 | 苏州美吉纳纳米新材料科技有限公司 | Selective PCB (printed circuit board) pre-hole-blackening hole-finishing agent and preparation method thereof |
| CN113973440A (en) * | 2021-10-28 | 2022-01-25 | 深圳市亿方电子有限公司 | Circuit board insulating layer treatment process |
| CN113973440B (en) * | 2021-10-28 | 2024-05-03 | 深圳市亿方电子有限公司 | Circuit board insulating layer treatment process |
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Application publication date: 20150128 |