JPS579874A - Etching solution for nickel - Google Patents

Etching solution for nickel

Info

Publication number
JPS579874A
JPS579874A JP8171780A JP8171780A JPS579874A JP S579874 A JPS579874 A JP S579874A JP 8171780 A JP8171780 A JP 8171780A JP 8171780 A JP8171780 A JP 8171780A JP S579874 A JPS579874 A JP S579874A
Authority
JP
Japan
Prior art keywords
soln
etching
org
nickel
sulfuric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8171780A
Other languages
Japanese (ja)
Other versions
JPS5749631B2 (en
Inventor
Kazuhiko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8171780A priority Critical patent/JPS579874A/en
Publication of JPS579874A publication Critical patent/JPS579874A/en
Publication of JPS5749631B2 publication Critical patent/JPS5749631B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To maintain the power for selectively etching Ni over a long term by properly blending sulfuric acid, an aqueous hydrogen peroxide soln., an org. sulfur compound and an aromatic nitro compound. CONSTITUTION:This etching soln. for nickel consists of 26-91ml/l sulfuric acid, 16-56ml/l aqueous hydrogen peroxide soln., 0.98-98g/l aromatic nitro compound, 0.02-2g/l org. sulfur compound and the balance water. When the soln. is used to selectively etch Ni among >=2 kinds of metals including Ni, it can etch Ni independently of the purity of Ni. Accordingly, the etching soln. can be utilized effectively in the manufacture of a printed wiring plate having a through hole and a circuit pattern, etc.
JP8171780A 1980-06-17 1980-06-17 Etching solution for nickel Granted JPS579874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8171780A JPS579874A (en) 1980-06-17 1980-06-17 Etching solution for nickel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8171780A JPS579874A (en) 1980-06-17 1980-06-17 Etching solution for nickel

Publications (2)

Publication Number Publication Date
JPS579874A true JPS579874A (en) 1982-01-19
JPS5749631B2 JPS5749631B2 (en) 1982-10-22

Family

ID=13754153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8171780A Granted JPS579874A (en) 1980-06-17 1980-06-17 Etching solution for nickel

Country Status (1)

Country Link
JP (1) JPS579874A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2520374A1 (en) * 1982-01-22 1983-07-29 Enthone COMPOSITIONS AND METHOD FOR THE SELECTIVE CHEMICAL REMOVAL OF HARD SURFACE COATINGS OF SUPERALLOY SUBSTRATES
JPS6438107A (en) * 1987-07-31 1989-02-08 Kanzaki Paper Mfg Co Ltd Defoaming device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2520374A1 (en) * 1982-01-22 1983-07-29 Enthone COMPOSITIONS AND METHOD FOR THE SELECTIVE CHEMICAL REMOVAL OF HARD SURFACE COATINGS OF SUPERALLOY SUBSTRATES
JPS6438107A (en) * 1987-07-31 1989-02-08 Kanzaki Paper Mfg Co Ltd Defoaming device

Also Published As

Publication number Publication date
JPS5749631B2 (en) 1982-10-22

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