JPS57155379A - Etching agent for non-electrolytic nickel thin film - Google Patents

Etching agent for non-electrolytic nickel thin film

Info

Publication number
JPS57155379A
JPS57155379A JP3953381A JP3953381A JPS57155379A JP S57155379 A JPS57155379 A JP S57155379A JP 3953381 A JP3953381 A JP 3953381A JP 3953381 A JP3953381 A JP 3953381A JP S57155379 A JPS57155379 A JP S57155379A
Authority
JP
Japan
Prior art keywords
etching agent
acid
film
electrolytic
corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3953381A
Other languages
Japanese (ja)
Other versions
JPS6214035B2 (en
Inventor
Mitsuo Takano
Makoto Kusakabe
Eiji Usu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Peroxide Co Ltd
Original Assignee
Nippon Peroxide Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Peroxide Co Ltd filed Critical Nippon Peroxide Co Ltd
Priority to JP3953381A priority Critical patent/JPS57155379A/en
Publication of JPS57155379A publication Critical patent/JPS57155379A/en
Publication of JPS6214035B2 publication Critical patent/JPS6214035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain an etching agent having excellent selectivity for non-electrical Ni film, by making the specified compound to coexist in the etching agent composed of an acid, hydrogen peroxide and free chlorine ion. CONSTITUTION:It is an etching agent which can suppress possibly the corrosion of copper pattern and dissolves and removes only non-electrolytic Ni film selectively. According to its formulation the etching agent which contains 0.1-50wt% of an acid selected among sulfuric acid, nitric acid or phosphoric acid, 0.1- 50wt% of hydrogen peroxide and NaCl, HCl etc. corresponding to 2-20,000ppm as free chlorine ion is made contain tertiary amine, a compound containing polyoxyalkylene radical, the compound selected among the group composed of polyvinyl alcohol, polyvinyl ether, polyvinyl pyrrolidone and pyrrole at the concentration more than 0.5g/l . The corrosion of copper being suppressed strongly by using this etching agent at the temperature 5-60 deg.C, only the non-electrolytic Ni film is etched selectively.
JP3953381A 1981-03-20 1981-03-20 Etching agent for non-electrolytic nickel thin film Granted JPS57155379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3953381A JPS57155379A (en) 1981-03-20 1981-03-20 Etching agent for non-electrolytic nickel thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3953381A JPS57155379A (en) 1981-03-20 1981-03-20 Etching agent for non-electrolytic nickel thin film

Publications (2)

Publication Number Publication Date
JPS57155379A true JPS57155379A (en) 1982-09-25
JPS6214035B2 JPS6214035B2 (en) 1987-03-31

Family

ID=12555677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3953381A Granted JPS57155379A (en) 1981-03-20 1981-03-20 Etching agent for non-electrolytic nickel thin film

Country Status (1)

Country Link
JP (1) JPS57155379A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (en) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド Peeling material
JPS6050185A (en) * 1983-08-22 1985-03-19 ダ−ト・インダストリ−ス・インコ−ポレ−テツド Dissolution of metals with pyrrolidone
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
CN105862042A (en) * 2016-06-08 2016-08-17 广东工业大学 Nickel stripping solution and preparation method and application thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (en) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド Peeling material
JPS6334231B2 (en) * 1982-01-11 1988-07-08 Ensoon Inc
JPS6050185A (en) * 1983-08-22 1985-03-19 ダ−ト・インダストリ−ス・インコ−ポレ−テツド Dissolution of metals with pyrrolidone
JPH0429743B2 (en) * 1983-08-22 1992-05-19
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
CN105862042A (en) * 2016-06-08 2016-08-17 广东工业大学 Nickel stripping solution and preparation method and application thereof

Also Published As

Publication number Publication date
JPS6214035B2 (en) 1987-03-31

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