JPS5435140A - Etching solution of copper - Google Patents
Etching solution of copperInfo
- Publication number
- JPS5435140A JPS5435140A JP10131477A JP10131477A JPS5435140A JP S5435140 A JPS5435140 A JP S5435140A JP 10131477 A JP10131477 A JP 10131477A JP 10131477 A JP10131477 A JP 10131477A JP S5435140 A JPS5435140 A JP S5435140A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- etching solution
- ammonia
- hydrogen peroxide
- solution containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE: To selectively etch only copper in laminated plate composed of copper and another metal, by using water solution containing a fixed amount of ammonia and hydrogen peroxide.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10131477A JPS5435140A (en) | 1977-08-23 | 1977-08-23 | Etching solution of copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10131477A JPS5435140A (en) | 1977-08-23 | 1977-08-23 | Etching solution of copper |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5435140A true JPS5435140A (en) | 1979-03-15 |
Family
ID=14297343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10131477A Pending JPS5435140A (en) | 1977-08-23 | 1977-08-23 | Etching solution of copper |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5435140A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009013491A (en) * | 2007-07-09 | 2009-01-22 | Meltex Inc | Protection pattern forming method of hyperfine metallic processed product |
WO2009066750A1 (en) * | 2007-11-22 | 2009-05-28 | Idemitsu Kosan Co., Ltd. | Etching solution composition |
JP2010255063A (en) * | 2009-04-27 | 2010-11-11 | Mitsubishi Materials Corp | Etching solution for structure observation of copper or copper alloy, etching method and structure observation method |
RU2548547C1 (en) * | 2014-02-11 | 2015-04-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Чувашский государственный университет имени И.И. Ульянова" | Method of purifying metal surfaces from copper sediments |
-
1977
- 1977-08-23 JP JP10131477A patent/JPS5435140A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009013491A (en) * | 2007-07-09 | 2009-01-22 | Meltex Inc | Protection pattern forming method of hyperfine metallic processed product |
WO2009066750A1 (en) * | 2007-11-22 | 2009-05-28 | Idemitsu Kosan Co., Ltd. | Etching solution composition |
JPWO2009066750A1 (en) * | 2007-11-22 | 2011-04-07 | 出光興産株式会社 | Etching solution composition |
JP5642967B2 (en) * | 2007-11-22 | 2014-12-17 | 関東化学株式会社 | Etching solution composition |
JP2010255063A (en) * | 2009-04-27 | 2010-11-11 | Mitsubishi Materials Corp | Etching solution for structure observation of copper or copper alloy, etching method and structure observation method |
RU2548547C1 (en) * | 2014-02-11 | 2015-04-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Чувашский государственный университет имени И.И. Ульянова" | Method of purifying metal surfaces from copper sediments |
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