JPS6419688A - Method of soldering lead to printed wiring board - Google Patents

Method of soldering lead to printed wiring board

Info

Publication number
JPS6419688A
JPS6419688A JP17416387A JP17416387A JPS6419688A JP S6419688 A JPS6419688 A JP S6419688A JP 17416387 A JP17416387 A JP 17416387A JP 17416387 A JP17416387 A JP 17416387A JP S6419688 A JPS6419688 A JP S6419688A
Authority
JP
Japan
Prior art keywords
area
lead
solder
insertion hole
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17416387A
Other languages
Japanese (ja)
Inventor
Shigekatsu Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP17416387A priority Critical patent/JPS6419688A/en
Publication of JPS6419688A publication Critical patent/JPS6419688A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform solder joining securely and improve product reliability through solder joining by melting cream solder in the area range of a conductor pattern exposed around lead insertion holes and in the range extending to the surface of a protective coating layer. CONSTITUTION:Cream solder is applied in the area range of a conductive pattern 2 exposed in the circumferential area of a lead insertion hole 4 and in the range extending partially beyond the exposed area of the conductive pattern up to the surface of a protective layer 3. Inserting a lead 5 under this condition into the lead insertion hole 4, the cream solder is heated and melted to perform solder joining. The cream solder applied over the protective coating layer beyond the conductive pattern area later separates from the protective coating layer as a result of heating and melting in a re-flow process and, being helped with the surface tension of the molten solder itself, is drawn toward the lead insertion hole where the conductive pattern and lead of higher wetting property exist and supplied to that area. This makes it possible to completely fill the gap between the lead insertion hole and the lead with the molten solder and to prevent pinholes in that area from being produced.
JP17416387A 1987-07-13 1987-07-13 Method of soldering lead to printed wiring board Pending JPS6419688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17416387A JPS6419688A (en) 1987-07-13 1987-07-13 Method of soldering lead to printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17416387A JPS6419688A (en) 1987-07-13 1987-07-13 Method of soldering lead to printed wiring board

Publications (1)

Publication Number Publication Date
JPS6419688A true JPS6419688A (en) 1989-01-23

Family

ID=15973800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17416387A Pending JPS6419688A (en) 1987-07-13 1987-07-13 Method of soldering lead to printed wiring board

Country Status (1)

Country Link
JP (1) JPS6419688A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245439B1 (en) 1994-08-09 2001-06-12 Kabushiki Kaisha Toyoyta Chuo Kenkyusho composite material and method for the manufacture
JP2012100251A (en) * 2010-10-08 2012-05-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with thermostat, and method for manufacturing the same
WO2020000345A1 (en) * 2018-06-29 2020-01-02 深圳市孚泰电子材料技术有限公司 Bottom plate of electronic device, and inductor and transformer having bottom plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245439B1 (en) 1994-08-09 2001-06-12 Kabushiki Kaisha Toyoyta Chuo Kenkyusho composite material and method for the manufacture
JP2012100251A (en) * 2010-10-08 2012-05-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with thermostat, and method for manufacturing the same
WO2020000345A1 (en) * 2018-06-29 2020-01-02 深圳市孚泰电子材料技术有限公司 Bottom plate of electronic device, and inductor and transformer having bottom plate

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