KR920004037B1 - Painting method for printed circuit board - Google Patents

Abstract

A painting method for PCB (5) of thin copper plate, which includes etching process, coating process for lead-isolated layer (4), and symbol marking process in order, is characterized by (A) painting PCB (5), and (B) completely separating pattern (2) and pattern (2n) with non-flammable paint, which are combined with electronic elements, so that the painted layer (3) of 3mm thickness is formed around holes (1) to prevent shorting during lead welding.

Description

Painting method of printed circuit board

1 is a process diagram according to the present invention.

Figure 2 is an enlarged view of the pattern dense portion of the present invention.

3 is an assembly state road according to the present invention (a) is a state diagram before assembly of the PCB and the electronic device, (b) is a state diagram after assembly of the PCB and the electronic device.

* Explanation of symbols for main parts of the drawings

1: hole 2-20: pattern

4: lead separation layer 5: PCB board

The present invention relates to a method of painting a printed circuit board to prevent short phenomenon that occurs when the electronic device is connected to a printed printed board. Conventionally, when connecting various electronic devices to an in-circuit circuit, a solder with good conductivity and low melting temperature and solidification temperature is used. According to the skill of the operator in the soldering process, the molten lead is a nearby conductor. Not only did it flow badly into the copper foil surface, but it also caused unnecessary or short-circuits with the legs of other electronic devices. Therefore, the process of performing the above soldering process is automatically selected, but even in the automatic soldering process, molten lead may be buried in other electronic devices or conductors. In the present invention, since the structure is not clearly distinguished, the adjacent and particularly densely packed conductors are clearly distinguished as paints to protect the conductors and the conductors, and the molten lead flow is prevented as paint to improve the soldered state. In order to protect the circuit and the device by configuring the circuit board.

Therefore, the process of the present invention is performed in the manufacturing process of the printed circuit board is not cumbersome in the performance of the process, and the production is convenient, as described with reference to the accompanying drawings as follows. First, if the manufacturing process of the printed circuit board is examined by the process diagram of FIG. 1, the pattern is drawn and photographed, and then photographed again to go through the first process of printing the pattern by the PCB board.

The fourth step of examining the state of disconnection, short, bend, crushing, etc. after the second step of attaching the pattern to the copper foil surface and performing the corrosive work and the third step coming out of the second step, and the melting of lead A sixth step of applying a green lead separation layer to all face portions except the periphery of the patterns after the fifth step of lightly coating lead around the insertion hole of the pattern for good adhesion and the printing of the symbol mark Through a seven-step process, a printed circuit board for assembling various electronic devices is manufactured.

Looking at the printing state of the patterns in the printed circuit board it can be seen that the spacing between the patterns is very narrow. However, if the above pattern spacing is widened, short phenomenon occurring during soldering can be prevented, but if the spacing is widened, the area is enlarged, so it is required to widen the pattern spacing without widening the area. Therefore, it is to satisfy the requirement to widen the interval between the patterns while completely separating between the pattern and the pattern.

This pattern and the isolation of the pattern is the process of forming a green lead separation layer during the manufacturing process of the left circuit board.

That is, after performing the painting process of supplying the non-flammable paint to a certain height only in the place to be isolated after the sixth process, the seventh process is performed. To explain this painting process in more detail, we select the position to be painted in the printed circuit to manufacture and adjust the mechanical relationship so that the paint is supplied at a predetermined thickness at the selected position.

Therefore, the insa circuit board undergoing the manufacturing process causes the non-flammable paint to be temporarily supplied to the selected pattern portion by mechanical driving when passing through the painting process after the sixth process.

Therefore, a lead separation layer (4) is formed on the PCB surface (5) of the PCB board (5) through which holes (1) are drilled by attaching copper foil, and a paint having a thickness of about 0.3 mm on the lead separation layer (4) The layer 3 is formed to form a configuration in which the pattern and the pattern are isolated and the hole 1 of the pattern 2 is protected.

The above painting process is performed after the lead separation layer process because the chemical components of the paint are fused to each other to stabilize the adhesion of the paint, and are different from the components of the lead to arrange the adhesion of the metal.

In this way, when soldering is performed by assembling the electronic device into the hole 1 of the printed circuit, the molten lead solidifies as it gathers around the hole 1 of the pattern 2.

At this time, the molten lead is prevented from flowing to the top of the paint to contact the other place, and if the amount of melting is large, the surface tension phenomenon at the tip of the paint does not overflow as described above, so as not only protects the circuit configuration but also soldered state It looks good too.

In particular, lead solidifies only in the sympathy in the paint, so that the degree of robustness of the device is excellent. As described above, the present invention protects the structure of the circuit by dividing the pattern and the pattern of dense intervals by passing the painting process in the fabrication process, and prevents the short phenomenon due to the soldering operation by separating the pattern and the pattern. As it can eliminate the bad conditions that can occur in handling condition to the maximum, productivity is increased, and short circuit prevention function is provided on the board itself to provide reliability during assembly work, and lead saving effect and soldered state are in good shape. It is about painting a printed circuit board.

Claims (1)

In the PCB board (5) of the printed circuit which enters the symbol mark process through the corrosion process and the lead separation layer coating process in order to form the printed circuit with the copper foil surface, the painting process of the PCB board (5) after the lead separation layer coating process And forming a paint layer (3) around the hole (1) by separating the pattern (2) and the pattern (2n) coupled with the electronic device with a non-flammable paint.

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