SU1225725A1 - Method of mechanized soldering with heated tool - Google Patents

Description

The invention relates to the field of soldering, specifically to mechanized soldering of the assembly of electronic equipment using a heated tool, and can be used in the radio industry:; capturing the manufacture of computer technology, instrument engineering.

The purpose of the invention is to improve the quality of paired compounds.

The short-term micro-arc electrical discharge, which occurs when the soldering head rises in the moments of detachment of the pallet tip from the spa, locally heats the icicle, which melts and settles, forming a rounded fillet, which improves the appearance of the spa, reduces its height; allows for protective varnishing in order to increase the reliability of soldering knots in harsh operating conditions of products. The discharge current density in the range of 15–20 A / mm in the area of the ociio-- icicles determines the quality of their content. At a higher current density, solder droplets are sprayed from icicles, which, if they fall on the paired circuit, can damage it. At lower densities of current, the icicles do not completely melt and the jaw of the full length remains at the junction, degrading its outer surface.:. lacurability; Moreover, the quality of the icing on the icicles is determined precisely by the discharge current density correlated to the base area of the icicles, and not by the intensity of the arc current, which depends on the size of the spa. Practically, the area of the base of the icicles is equal to the area of the swarms of the contact of the blade sting covered with lipoi with the sunken part at the moment of their separation.

The proposed method can be implemented in the following manner when mechanized soldering on a semiautomatic device of the Araks-3 type PEVTLK wire with a diameter of 0.06 mm to the pin of the contact pad mounted on the board, the cross-sectional area: pin 0.18 MI-I. The tip of the semi-automatic solder head (5 m. At) through a choke, a potentiometer, aivmepMBTp and a switch is connected to one pole of a source of a constant voltage SOBj to the other pole of which a soldered pin is connected.

g and; 1O; , -1nigm on licro wire. 1u-; (; iiioMc о {h makes adjustment:; -.: l michrora row, throttle increase - f f dt: ttel 1ost microdischarge to

About 51-0.3 MKS, the switch serves for the voltage required for the required voltage (: -::.

M k;}; chik pa goen razogrovastnn to lowers} ia ..

the i-iero lod is supplied by the coordinate table strm; while receiving the dose prr: in, heats the pin for 2 s, after which it rises, carrying along part of lirips S frozen,: - I feel over

pin and Bi-OV-- icicles- Simultaneously with the beginning of the first half of the first seasoning of the pine tree, 1; a circuit breaker and i; a as the end; ; a call is given relative to T Rj ibiiO; 11t :: p "When raising the guy

i: the moment of its separation from cocvjibKi-i

Eoznikas; T mnogoduguy e.chektricheskiy discharge, warming the icicle, the collar spawns and settles ka (and the hole. The current is discharged; and set with

using a heatpimeter according to yy. : 15-20 A / mm in the area of OSG :: 0, an icicle that, in this case, is equal to the cross section of the cross section, at lower densities; and; the left side of the hole is eliminated 1, with a large 1HIH, the butt pin overheats, on:; l.Gyu are solder.

ccg: experimental e dannla, bye: sh: rj; ioDi-: e zaz lsi:; awn quality soldering

about; :.;: c) arc current and, are given

in Goble1 :: K „

I ac1 -: -, yes 1st way poz-:; “);::: (-t vxiTpainiTb icicles in the process

her MGG: use additional: -; of operations and safeguarding of the essential / slingsharing of the floating head (for example, rcpj cf :: abzheli by its mechanisms of jetting, aloe or suction of solder,

1NU;;: ... | YH1: Baths of a scorched product, etc.) - Cutting icicles improves the external view of the joint, allows iiOHiviCHTb to be dense in boards for each CST-1x} { :; with follow-up wiring, no breaks when attaching wires of junctions, provides a layer of moisture-like lacquering by smoothing the surface of the iiocTH junctions

1,120

285t5

120

285 ± 5

120

285 ± 5

120

28515

240

285i5

240

285t5

240

28545

8,240

285 ± 5

120

28515

Compiled by V. Belinkiy Editor I. Nikolaichuk Tehred L.Oleinik Proofreader T. Kolb

 order 2023/12

Circulation 1001

VNIIPI USSR State Committee

Inventions n discoveries 113035, Moscow, Zh-35, Raushsk nab. 4/5

Production and printing company, Uzhgorod, st. Project 4

Fksp Ha all pin x icicles with

slightly dulled tops

 On all pins of icicles with

blunted tops, icicles decreased in height

 There are no icicles, but there are naples on the ends of the pins.

 There are no icicles, at the ends of some pins there are insignificant solders

 There are no icicles, there are no flows on the ends

 Icicles and flooding no, on

some roughness is observed on some ends

 There are no icicles, butt ends

have a rough surface

 There are no icicles, the roughness of the ends of the pins is strong, some ends have a dark surface

 There are no icicles, at the ends there is a slight melting of the pin material, there is a splash of solder on the board

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Claims (1)

METHOD OF MECHANIZED SOLDING BY A HEATED TOOL, in which the solder is placed in the connection zone and heated by the tip of the tool with the subsequent removal of the solder icicles at the moment of separation of the tip from the soldered part, characterized in that, in order to improve the quality of the soldered joints, the removal of solder icicles is carried out by excitation of an electric arc with a current density of 15-20 A / mm between the tip of the tool and the soldered part. 225725