JPS566459A - Removing method of component carried on printed board - Google Patents

Removing method of component carried on printed board

Info

Publication number
JPS566459A
JPS566459A JP8017179A JP8017179A JPS566459A JP S566459 A JPS566459 A JP S566459A JP 8017179 A JP8017179 A JP 8017179A JP 8017179 A JP8017179 A JP 8017179A JP S566459 A JPS566459 A JP S566459A
Authority
JP
Japan
Prior art keywords
connecting portion
solder
printed board
lead wire
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8017179A
Other languages
Japanese (ja)
Other versions
JPS6129159B2 (en
Inventor
Kozo Kanda
Kanji Ishige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8017179A priority Critical patent/JPS566459A/en
Publication of JPS566459A publication Critical patent/JPS566459A/en
Publication of JPS6129159B2 publication Critical patent/JPS6129159B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Abstract

PURPOSE:To reduce the heat load of the connecting portion of a pad to a lead wire on a printed board and remove the component on the printed board by supplying solder to the connecting portion and heating the contacting portion of the connecting portion with the lead wire by a heating tool treated with preferably wetting property with solder on the surface. CONSTITUTION:A solder foil is formed at the connecting portion of a pad with a lead wire 3 on a printed board 1, a supply solder 10 of frame shape coinciding with the position of the lead wire 3 of a component 2 is formed, and is placed on the connecting portion. Then, a heating tool 7 treated with oxidation prevention is approached toward the component 2 from upside. When the heating portion 8 of the heating tool 7 is lowered to heat the connecting portion, the supply solder 10 is molten to fuse the solder of the pad at the lead wire 3. When the solder at the connecting portion is molten, an attracting tool 13 is simultaneously operated to remove the component 2 from the printed board 1.
JP8017179A 1979-06-27 1979-06-27 Removing method of component carried on printed board Granted JPS566459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8017179A JPS566459A (en) 1979-06-27 1979-06-27 Removing method of component carried on printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8017179A JPS566459A (en) 1979-06-27 1979-06-27 Removing method of component carried on printed board

Publications (2)

Publication Number Publication Date
JPS566459A true JPS566459A (en) 1981-01-23
JPS6129159B2 JPS6129159B2 (en) 1986-07-04

Family

ID=13710877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8017179A Granted JPS566459A (en) 1979-06-27 1979-06-27 Removing method of component carried on printed board

Country Status (1)

Country Link
JP (1) JPS566459A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108196A (en) * 1984-10-31 1986-05-26 シャープ株式会社 Element removing apparatus
JPS62172175U (en) * 1986-12-06 1987-10-31
US5172469A (en) * 1991-05-08 1992-12-22 Hughes Aircraft Company Advanced part removal and torque shear station
US5174016A (en) * 1991-04-25 1992-12-29 Toddco General, Inc. Chip removal apparatus and method of using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108196A (en) * 1984-10-31 1986-05-26 シャープ株式会社 Element removing apparatus
JPS62172175U (en) * 1986-12-06 1987-10-31
US5174016A (en) * 1991-04-25 1992-12-29 Toddco General, Inc. Chip removal apparatus and method of using same
US5172469A (en) * 1991-05-08 1992-12-22 Hughes Aircraft Company Advanced part removal and torque shear station

Also Published As

Publication number Publication date
JPS6129159B2 (en) 1986-07-04

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