JPS54138371A - Solder supplying method - Google Patents

Solder supplying method

Info

Publication number
JPS54138371A
JPS54138371A JP4710478A JP4710478A JPS54138371A JP S54138371 A JPS54138371 A JP S54138371A JP 4710478 A JP4710478 A JP 4710478A JP 4710478 A JP4710478 A JP 4710478A JP S54138371 A JPS54138371 A JP S54138371A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
solder
layer
tape
side
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4710478A
Other versions
JPS5846388B2 (en )
Inventor
Seiichi Takemura
Original Assignee
Nec Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/2901Shape
    • H01L2224/29011Shape comprising apertures or cavities
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

PURPOSE: To ensure the supply of solder, by forming the solder layer at one side of long tape of heat-proof, pressing and running the solder layer on the plane to be soldered by taking back the solder layer, and melting a part of solder and replacing it on this plane.
CONSTITUTION: At one side of the long tape 12 of heat-proof such as polyimide and stainless steel, solder layer is coated and it is wound on the tape supply spool 13 so that the layer is placed outside. In this case, on the way of winding, the solder supplied material 16 placed on the heat block 17 is provided under the lower side of the tape 12 and the depression rod 15 consisting of punch is provided at the upper side. After this, the tape 12 is fed intermittently, and the solder layer is pressed on the member 16 with the depression rod 15 while temporary stopping. Since the member 16 is heated with the heat block 17, the solder layer is molten and it moves on the surface of the member 16 apart from the tape 12.
COPYRIGHT: (C)1979,JPO&Japio
JP4710478A 1978-04-19 1978-04-19 Expired JPS5846388B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4710478A JPS5846388B2 (en) 1978-04-19 1978-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4710478A JPS5846388B2 (en) 1978-04-19 1978-04-19

Publications (2)

Publication Number Publication Date
JPS54138371A true true JPS54138371A (en) 1979-10-26
JPS5846388B2 JPS5846388B2 (en) 1983-10-15

Family

ID=12765860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4710478A Expired JPS5846388B2 (en) 1978-04-19 1978-04-19

Country Status (1)

Country Link
JP (1) JPS5846388B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5725299A (en) * 1980-06-09 1982-02-10 Raychem Corp Solder feeder
JPS5857730A (en) * 1981-09-30 1983-04-06 Nissha Printing Co Ltd Manufacture of semiconductor package
JPS58222530A (en) * 1982-06-18 1983-12-24 Hitachi Chem Co Ltd Bonding method for pellet
JPS6094390U (en) * 1983-12-05 1985-06-27
JPS62136829A (en) * 1985-12-10 1987-06-19 Sharp Corp Die bonding method for optical semiconductor element
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US4906823A (en) * 1987-06-05 1990-03-06 Hitachi, Ltd. Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
WO2002045897A1 (en) * 2000-12-04 2002-06-13 Daikoku Electric Wire Co., Ltd. Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
WO2011104229A1 (en) * 2010-02-23 2011-09-01 Jenoptik Laser Gmbh Method for applying soft solder to a mounting surface of a component

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330386B2 (en) * 1983-12-16 1991-04-30
JPS62172497U (en) * 1986-04-23 1987-11-02

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5725299A (en) * 1980-06-09 1982-02-10 Raychem Corp Solder feeder
JPH0137240B2 (en) * 1980-06-09 1989-08-04 Raychem Corp
JPS5857730A (en) * 1981-09-30 1983-04-06 Nissha Printing Co Ltd Manufacture of semiconductor package
JPH0249013B2 (en) * 1981-09-30 1990-10-26 Nippon Shashin Insatsu Kk
JPS58222530A (en) * 1982-06-18 1983-12-24 Hitachi Chem Co Ltd Bonding method for pellet
JPS6094390U (en) * 1983-12-05 1985-06-27
JPS62136829A (en) * 1985-12-10 1987-06-19 Sharp Corp Die bonding method for optical semiconductor element
US4906823A (en) * 1987-06-05 1990-03-06 Hitachi, Ltd. Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
WO2002045897A1 (en) * 2000-12-04 2002-06-13 Daikoku Electric Wire Co., Ltd. Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal
WO2011104229A1 (en) * 2010-02-23 2011-09-01 Jenoptik Laser Gmbh Method for applying soft solder to a mounting surface of a component
CN102741004A (en) * 2010-02-23 2012-10-17 业纳激光有限公司 Method for applying soft solder to a mounting surface of a component
US8745858B2 (en) 2010-02-23 2014-06-10 JEONPTIK Laser GmbH Method for applying soft solder to a mounting surface of a component
CN102741004B (en) * 2010-02-23 2015-12-16 业纳激光有限公司 A method for applying solder to the upper surface of the mounting member and its system

Also Published As

Publication number Publication date Type
JP1212917C (en) grant
JPS5846388B2 (en) 1983-10-15 grant

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