JPS54138371A - Solder supplying method - Google Patents
Solder supplying methodInfo
- Publication number
- JPS54138371A JPS54138371A JP4710478A JP4710478A JPS54138371A JP S54138371 A JPS54138371 A JP S54138371A JP 4710478 A JP4710478 A JP 4710478A JP 4710478 A JP4710478 A JP 4710478A JP S54138371 A JPS54138371 A JP S54138371A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- solder
- solder layer
- layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29011—Shape comprising apertures or cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Abstract
PURPOSE: To ensure the supply of solder, by forming the solder layer at one side of long tape of heat-proof, pressing and running the solder layer on the plane to be soldered by taking back the solder layer, and melting a part of solder and replacing it on this plane.
CONSTITUTION: At one side of the long tape 12 of heat-proof such as polyimide and stainless steel, solder layer is coated and it is wound on the tape supply spool 13 so that the layer is placed outside. In this case, on the way of winding, the solder supplied material 16 placed on the heat block 17 is provided under the lower side of the tape 12 and the depression rod 15 consisting of punch is provided at the upper side. After this, the tape 12 is fed intermittently, and the solder layer is pressed on the member 16 with the depression rod 15 while temporary stopping. Since the member 16 is heated with the heat block 17, the solder layer is molten and it moves on the surface of the member 16 apart from the tape 12.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4710478A JPS5846388B2 (en) | 1978-04-19 | 1978-04-19 | Solder supply method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4710478A JPS5846388B2 (en) | 1978-04-19 | 1978-04-19 | Solder supply method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54138371A true JPS54138371A (en) | 1979-10-26 |
JPS5846388B2 JPS5846388B2 (en) | 1983-10-15 |
Family
ID=12765860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4710478A Expired JPS5846388B2 (en) | 1978-04-19 | 1978-04-19 | Solder supply method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5846388B2 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5725299A (en) * | 1980-06-09 | 1982-02-10 | Raychem Corp | Solder feeder |
JPS5857730A (en) * | 1981-09-30 | 1983-04-06 | Nissha Printing Co Ltd | Manufacture of semiconductor package |
JPS58222530A (en) * | 1982-06-18 | 1983-12-24 | Hitachi Ltd | Bonding method for pellet |
JPS6094390U (en) * | 1983-12-05 | 1985-06-27 | 安藤 稔 | Band-shaped solder for solder welding machine |
JPS62136829A (en) * | 1985-12-10 | 1987-06-19 | Sharp Corp | Die bonding method for optical semiconductor element |
US4832255A (en) * | 1988-07-25 | 1989-05-23 | International Business Machines Corporation | Precision solder transfer method and means |
US4906823A (en) * | 1987-06-05 | 1990-03-06 | Hitachi, Ltd. | Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same |
US5197655A (en) * | 1992-06-05 | 1993-03-30 | International Business Machines Corporation | Fine pitch solder application |
WO1996029730A1 (en) * | 1994-12-26 | 1996-09-26 | Hitachi Chemical Company, Ltd. | Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device |
US6099678A (en) * | 1995-12-26 | 2000-08-08 | Hitachi Chemical Company Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
WO2002045897A1 (en) * | 2000-12-04 | 2002-06-13 | Daikoku Electric Wire Co., Ltd. | Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal |
US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
WO2011104229A1 (en) * | 2010-02-23 | 2011-09-01 | Jenoptik Laser Gmbh | Method for applying soft solder to a mounting surface of a component |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60129071A (en) * | 1983-12-16 | 1985-07-10 | エムテックスマツムラ株式会社 | Mah-jongg pie arranging apparatus of automatic mah-jongg table |
JPS62172497U (en) * | 1986-04-23 | 1987-11-02 |
-
1978
- 1978-04-19 JP JP4710478A patent/JPS5846388B2/en not_active Expired
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0137240B2 (en) * | 1980-06-09 | 1989-08-04 | Raychem Corp | |
JPS5725299A (en) * | 1980-06-09 | 1982-02-10 | Raychem Corp | Solder feeder |
JPS5857730A (en) * | 1981-09-30 | 1983-04-06 | Nissha Printing Co Ltd | Manufacture of semiconductor package |
JPH0249013B2 (en) * | 1981-09-30 | 1990-10-26 | Nippon Shashin Insatsu Kk | |
JPS58222530A (en) * | 1982-06-18 | 1983-12-24 | Hitachi Ltd | Bonding method for pellet |
JPS6094390U (en) * | 1983-12-05 | 1985-06-27 | 安藤 稔 | Band-shaped solder for solder welding machine |
JPS62136829A (en) * | 1985-12-10 | 1987-06-19 | Sharp Corp | Die bonding method for optical semiconductor element |
US4906823A (en) * | 1987-06-05 | 1990-03-06 | Hitachi, Ltd. | Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same |
US4832255A (en) * | 1988-07-25 | 1989-05-23 | International Business Machines Corporation | Precision solder transfer method and means |
US5197655A (en) * | 1992-06-05 | 1993-03-30 | International Business Machines Corporation | Fine pitch solder application |
WO1996029730A1 (en) * | 1994-12-26 | 1996-09-26 | Hitachi Chemical Company, Ltd. | Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device |
KR100426298B1 (en) * | 1994-12-26 | 2004-04-08 | 히다치 가세고교 가부시끼가이샤 | Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device |
US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
US7057265B2 (en) | 1995-07-06 | 2006-06-06 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US7012320B2 (en) | 1995-07-06 | 2006-03-14 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US7078094B2 (en) | 1995-07-06 | 2006-07-18 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US7781896B2 (en) | 1995-07-06 | 2010-08-24 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
US6099678A (en) * | 1995-12-26 | 2000-08-08 | Hitachi Chemical Company Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
WO2002045897A1 (en) * | 2000-12-04 | 2002-06-13 | Daikoku Electric Wire Co., Ltd. | Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal |
WO2011104229A1 (en) * | 2010-02-23 | 2011-09-01 | Jenoptik Laser Gmbh | Method for applying soft solder to a mounting surface of a component |
CN102741004A (en) * | 2010-02-23 | 2012-10-17 | 业纳激光有限公司 | Method for applying soft solder to a mounting surface of a component |
US8745858B2 (en) | 2010-02-23 | 2014-06-10 | JEONPTIK Laser GmbH | Method for applying soft solder to a mounting surface of a component |
CN102741004B (en) * | 2010-02-23 | 2015-12-16 | 业纳激光有限公司 | For slicken solder being applied to method in the mounting surface of parts and system thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5846388B2 (en) | 1983-10-15 |
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