JPS5545548A - Excess solder removing method by using tape - Google Patents
Excess solder removing method by using tapeInfo
- Publication number
- JPS5545548A JPS5545548A JP11820778A JP11820778A JPS5545548A JP S5545548 A JPS5545548 A JP S5545548A JP 11820778 A JP11820778 A JP 11820778A JP 11820778 A JP11820778 A JP 11820778A JP S5545548 A JPS5545548 A JP S5545548A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- solder
- product
- soldering
- inclination angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To obtain a uniform solder surface free from solder icicles easily and at low cost, by downward inclining the end part of soldered surface coated with a tape member of an easily solderable metal to perform dip soldering, and then removing the tape member.
CONSTITUTION: A tape of a metal having affinity for solder, e.g., a copper tape 3 of about 100μ in thickness is glued to one end of a product 2, and is passed to the upper part of a dipping solder bath 1 by means of a conveying device 6 having an inclination angle α so as to set the tape 3 downward, and the soldering surface 4 is made to contact with a solder flow 10. When the product 2 is automatically conveyed by the conveying device 6 and soldering is finished, solder pool and icicle 7 may occur in the lowest part side of the product 2 due to the inclination angle α. That is, since excess solder occurs only in the lower side of the tape 3, a uniform solder surface 4 only may be obtained when the tape 3 is removed from the product 2 after completion of soldering.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11820778A JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11820778A JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5545548A true JPS5545548A (en) | 1980-03-31 |
JPS6219261B2 JPS6219261B2 (en) | 1987-04-27 |
Family
ID=14730842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11820778A Granted JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5545548A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5518165A (en) * | 1990-11-13 | 1996-05-21 | Compaq Computer Corporation | Soldering techniques employing a snap bar |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207930122U (en) * | 2018-01-19 | 2018-10-02 | 深圳市海目星激光智能装备股份有限公司 | A kind of flexible pressure tin point device |
-
1978
- 1978-09-25 JP JP11820778A patent/JPS5545548A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5518165A (en) * | 1990-11-13 | 1996-05-21 | Compaq Computer Corporation | Soldering techniques employing a snap bar |
Also Published As
Publication number | Publication date |
---|---|
JPS6219261B2 (en) | 1987-04-27 |
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