JPS5582445A - Method of bonding semiconductor substrate - Google Patents

Method of bonding semiconductor substrate

Info

Publication number
JPS5582445A
JPS5582445A JP15662478A JP15662478A JPS5582445A JP S5582445 A JPS5582445 A JP S5582445A JP 15662478 A JP15662478 A JP 15662478A JP 15662478 A JP15662478 A JP 15662478A JP S5582445 A JPS5582445 A JP S5582445A
Authority
JP
Japan
Prior art keywords
solder
support
substrate support
molten solder
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15662478A
Other languages
Japanese (ja)
Other versions
JPS6226176B2 (en
Inventor
Hiroyuki Fujii
Moriyoshi Oota
Satoru Umehara
Kenichi Tateno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP15662478A priority Critical patent/JPS5582445A/en
Publication of JPS5582445A publication Critical patent/JPS5582445A/en
Publication of JPS6226176B2 publication Critical patent/JPS6226176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To surely bond a semiconductor substrate, by dropping molten solder onto a substrate support under an inert or reducing atmosphere and then applying uniform pressure to the solder to promote the wetting of the substrate support with the molten solder.
CONSTITUTION: A substrate support 11a' plated with nickel on the surface is placed on the base board of an electric furnace and conveyed into the cover 2 of the furnace. The temperature of the substrate support is raised accorcing as the support is moved forth. The temperature of the support becomes maximum when it comes to the position 11d' of a molten solder dropping unit 6. At that time, molten solder 7 is dropped to make a spherical solder layer. A peripheral guide ring 12 is moved down toward the position 11e' of th substrate support and a piston 13 fitted in the ring is also moved down to thrust the solder layer for about 0.1W0.5sec. As a result, the solder is spread well on the plated nickel which is hard to be wetted. Therefore, a semiconductor substrate 10 is bonded well to the support.
COPYRIGHT: (C)1980,JPO&Japio
JP15662478A 1978-12-18 1978-12-18 Method of bonding semiconductor substrate Granted JPS5582445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15662478A JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15662478A JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5582445A true JPS5582445A (en) 1980-06-21
JPS6226176B2 JPS6226176B2 (en) 1987-06-08

Family

ID=15631764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15662478A Granted JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5582445A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191045U (en) * 1981-05-28 1982-12-03

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209456A (en) * 1987-02-23 1988-08-31 Meiwa Seisakusho:Kk Explosion-proof type motor provided with stator consisting of permanent magnet
JPS6440248U (en) * 1987-09-03 1989-03-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191045U (en) * 1981-05-28 1982-12-03
JPS6334269Y2 (en) * 1981-05-28 1988-09-12

Also Published As

Publication number Publication date
JPS6226176B2 (en) 1987-06-08

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