JPS6466998A - Automatic component mounting machine - Google Patents
Automatic component mounting machineInfo
- Publication number
- JPS6466998A JPS6466998A JP62224253A JP22425387A JPS6466998A JP S6466998 A JPS6466998 A JP S6466998A JP 62224253 A JP62224253 A JP 62224253A JP 22425387 A JP22425387 A JP 22425387A JP S6466998 A JPS6466998 A JP S6466998A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- component
- roller
- attraction
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To assure satisfactory bonding strength without dispersion thereof by effecting bonding after moving an attraction holder with a component attracted thereto, forcing the same to pass through application surface flattening means thereover, and applying an adhesive uniformly on the surface of the component to be bonded. CONSTITUTION:With a control unit operated, an attraction holder 4 moves to a parts supply part and further moves to a vessel 1 after attracting a component 9. The attraction holder 4 is lowered, stopped at the height where the parts 9 invades in an adhesive 10 by about 1mm, and thereafter lifted again and stopped. Although the adhesive 10 contained in the vessel 1 keeps the upper surface at a constant level, the application state 10a of the adhesive is not uniform owing to the dispersion of the viscosity of the adhesive 10. To make uniform the application state 10a, the attraction holder 4 is moved and allowed to pass through a roller 6 such that the roller 6 is forced and rotated to make contact with the parts adhesive, thereby making uniform the adhesive application surface 10b. Designated at 8 is a doctor blade for smoothing the surface of the roller 6. Thereafter, the attraction holder 4 is moved to a substrate and lowered to mount the component 9 on a CSI package surface on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62224253A JPS6466998A (en) | 1987-09-08 | 1987-09-08 | Automatic component mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62224253A JPS6466998A (en) | 1987-09-08 | 1987-09-08 | Automatic component mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6466998A true JPS6466998A (en) | 1989-03-13 |
Family
ID=16810881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62224253A Pending JPS6466998A (en) | 1987-09-08 | 1987-09-08 | Automatic component mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466998A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5348611A (en) * | 1992-05-20 | 1994-09-20 | General Signal Corporation | Die paste transfer system and method |
| US5547537A (en) * | 1992-05-20 | 1996-08-20 | Kulicke & Soffa, Investments, Inc. | Ceramic carrier transport for die attach equipment |
| EP0798764A2 (en) | 1996-03-28 | 1997-10-01 | Nec Corporation | Hollow package manufacturing method and apparatus |
-
1987
- 1987-09-08 JP JP62224253A patent/JPS6466998A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5348611A (en) * | 1992-05-20 | 1994-09-20 | General Signal Corporation | Die paste transfer system and method |
| US5423927A (en) * | 1992-05-20 | 1995-06-13 | Kulicke & Soffa Industries, Inc. | Die paste transfer system and method |
| US5547537A (en) * | 1992-05-20 | 1996-08-20 | Kulicke & Soffa, Investments, Inc. | Ceramic carrier transport for die attach equipment |
| EP0798764A2 (en) | 1996-03-28 | 1997-10-01 | Nec Corporation | Hollow package manufacturing method and apparatus |
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