JPH01183827A - Method and device for applying paste in die bonder - Google Patents

Method and device for applying paste in die bonder

Info

Publication number
JPH01183827A
JPH01183827A JP896388A JP896388A JPH01183827A JP H01183827 A JPH01183827 A JP H01183827A JP 896388 A JP896388 A JP 896388A JP 896388 A JP896388 A JP 896388A JP H01183827 A JPH01183827 A JP H01183827A
Authority
JP
Japan
Prior art keywords
paste
transfer pad
underside
recessed
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP896388A
Other languages
Japanese (ja)
Other versions
JPH0793336B2 (en
Inventor
Toru Takamura
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP63008963A priority Critical patent/JPH0793336B2/en
Publication of JPH01183827A publication Critical patent/JPH01183827A/en
Publication of JPH0793336B2 publication Critical patent/JPH0793336B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

PURPOSE: To keep a coating thickness and shape of paste constant at all times by a method wherein a recessed trench is filled with paste, a transfer pad is contact-pressed to the paste in the recessed section, the paste is attached onto the underside of the transfer pad, and the paste is applied to a bonding section.
CONSTITUTION: When a table 1 and a blade 2 are displaced relatively under the state in which the blade 2 is installed to a section upper than the base of a recessed section 1b in the table 1 by fixed height, the recessed section 1b is filled with paste 7 in specified thickness at all times. Since the paste 7 is attached onto the underside of a transfer pad 5, the paste 7 takes a constant shape by the form of the underside of the transfer pad 5. Paste 7a adhering on the underside of the transfer pad 5 is transferred to a lead frame 6, etc. Accordingly, the paste having fixed thickness and a fixed shape is applied onto the lead frame 6, etc.
COPYRIGHT: (C)1989,JPO&Japio
JP63008963A 1988-01-18 1988-01-18 Paste application device in die bonder Expired - Lifetime JPH0793336B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63008963A JPH0793336B2 (en) 1988-01-18 1988-01-18 Paste application device in die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63008963A JPH0793336B2 (en) 1988-01-18 1988-01-18 Paste application device in die bonder

Publications (2)

Publication Number Publication Date
JPH01183827A true JPH01183827A (en) 1989-07-21
JPH0793336B2 JPH0793336B2 (en) 1995-10-09

Family

ID=11707329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63008963A Expired - Lifetime JPH0793336B2 (en) 1988-01-18 1988-01-18 Paste application device in die bonder

Country Status (1)

Country Link
JP (1) JPH0793336B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223063A (en) * 2001-01-24 2002-08-09 Juki Corp Flux holding device for electronic component mounting machine
JP2005347775A (en) * 2005-08-23 2005-12-15 Juki Corp Electronic component mounting apparatus and mounting method
KR20110047152A (en) 2009-10-29 2011-05-06 캐논 머시너리 가부시키가이샤 Coating device and coating method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031376U (en) * 1983-08-10 1985-03-02
JPS6048166A (en) * 1983-08-29 1985-03-15 Fujitsu Ltd Adhesive agent coating device
JPS61107733A (en) * 1984-10-31 1986-05-26 New Japan Radio Co Ltd Adhesive supplying apparatus
JPS6327027A (en) * 1986-07-18 1988-02-04 Mitsubishi Electric Corp Resin bonding apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031376U (en) * 1983-08-10 1985-03-02
JPS6048166A (en) * 1983-08-29 1985-03-15 Fujitsu Ltd Adhesive agent coating device
JPS61107733A (en) * 1984-10-31 1986-05-26 New Japan Radio Co Ltd Adhesive supplying apparatus
JPS6327027A (en) * 1986-07-18 1988-02-04 Mitsubishi Electric Corp Resin bonding apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223063A (en) * 2001-01-24 2002-08-09 Juki Corp Flux holding device for electronic component mounting machine
JP4636700B2 (en) * 2001-01-24 2011-02-23 Juki株式会社 Flux holding device for electronic component mounting machine
JP2005347775A (en) * 2005-08-23 2005-12-15 Juki Corp Electronic component mounting apparatus and mounting method
KR20110047152A (en) 2009-10-29 2011-05-06 캐논 머시너리 가부시키가이샤 Coating device and coating method

Also Published As

Publication number Publication date
JPH0793336B2 (en) 1995-10-09

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