JPH0752740B2 - Bonding method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a bonding method for an inner lead bonder, an outer lead bonder, a bump bonder, etc., and particularly to an IC or a substrate (hereinafter Generically referred to as IC) and a bonding method for gag bonding (simultaneous multi-point bonding) of a plurality of bumps or a plurality of bumps alone.

[Prior Art] As a conventional gag bonding method, for example, Japanese Patent Laid-Open No.
The ones disclosed in Japanese Patent Laid-Open No. 11664 and Japanese Patent Laid-Open No. 54-11667 are known. In this method, as shown in FIGS. 3 and 4, after aligning the leads 3 formed on the tape 2 which is intermittently transferred along the guide plate 1 and the IC 5 which is sequentially fed by the sample table 4, The bond tool 6 is lowered and the sample table 4 is raised to bond the bumps 5a of the IC 5 to the leads 3. After bonding, the bond tool 6 rises and the sample table 4 descends, then the tape 2 is transferred and the next lead 3 part is positioned at the bonding position, and the sample table 4 is sent to bond the next IC5. It is placed in the position and bonded by performing the above-mentioned operation.

In the above-mentioned conventional method, bonding is performed by always moving the bond tool 6 up and down at a fixed position.

[Problems to be Solved by the Invention] In the above-described conventional technique, the bond tool 6 and the sample (lead 3 and
Since the contact point with IC5) is always at the same position and a fixed part of the bond tool 6 is constantly in pressure contact with the sample, there is a problem that the wear part is limited and the life of the bond tool 6 is short.

An object of the present invention is to provide a bonding method that can significantly improve the life of a bond tool.

[Means for Solving the Problems] The above object is achieved by changing the relative position between the bond tool and the sample side every time or every plural times, and changing the pressure contact surface between the bond tool and the sample for gag bonding. .

[Operation] Bonding is performed by changing the position where the bond tool comes into contact with the sample every time or every plural times, so that wear can be made uniform and the life of the bond tool is significantly improved.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. The same or corresponding members as those in FIGS. 3 and 4 are designated by the same reference numerals for description. After the lead 3 and the IC 5 are aligned with each other, the bond tool 6 descends as shown by a solid line 6A, and the sample table 4 rises to bond the plurality of bumps 5a of the IC 5 to the plurality of leads 3. After bonding,
The bond tool 6 rises and the sample table 4 descends. Next, the tape 2 is transferred to position the next lead 3 at the bonding position, and the sample table 4 is sent to position the next IC 5 at the bonding position. The above operation is the same as the conventional one.

Next, before the bond tool 6 descends, or at the same time as the bond tool 6 descends, the bond tool 6 is moved horizontally by the XY table (not shown) as shown by the alternate long and short dash line 6B and descends, and the sample table 4 rises. The bump 5a is bonded to the lead 3. After that, the bond tool 6 is raised and the sample stage 4 is lowered similarly to the above-described operation. The bonding between the lead 3 and the IC 5 is performed by moving the bond tool 6 in the horizontal direction indicated by the chain double-dashed line 6C. After that, the bond tool 6 is changed in position in the order of 6A, 6B, and 6C, and bonding is performed.

In this way, the bonding tool 6 is bonded by changing the position of contact with the sample every time or every plural times, so that wear can be made uniform and the life of the bond tool 6 is significantly improved.

Although the position of the bond tool 6 is changed every time in the above embodiment, it may be changed every plural times. Although the position of the bond tool 6 is changed, the position of the bond tool 6 is constant, and the XY table supporting the tape 2 and the XY table supporting the sample table 4 are driven to move the bond tool 6 to the sample side. You may shift with respect to.

[Effects of the Invention] As is clear from the above description, according to the present invention, the position where the bond tool comes into contact with the sample is changed every time or every plural times to perform bonding, so that the wear can be made uniform and the bond tool The life is greatly improved.

[Brief description of drawings]

1 (a) and (b) are front views showing the operation of one embodiment of the present invention, FIG. 2 is a plan view showing the contact position between the sample and the bond tool, and FIGS. 3 (a) and (b) are FIG. 4 is a front view showing the operation of the conventional example, and FIG. 4 is a plan view showing the contact position between the sample and the bond tool. 2: Tape, 3: Lead, 5a: Bump, 6: Bond tool, 6A, 6B, 6C: Bond tool contact position on the sample.

Claims (1)

[Claims] 1. A bonding method in which a plurality of leads and a plurality of bumps formed on a tape are pressed against each other with a bond tool to perform gag bonding, and the relative position between the bond tool and the sample side is changed every time or every plural times. Bonding method characterized by changing the pressure contact surface between the bond tool and the sample to perform gag bonding.