JP3736439B2 - Work clamping device for wire bonding - Google Patents

Work clamping device for wire bonding Download PDF

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JP3736439B2
JP3736439B2 JP2001359967A JP2001359967A JP3736439B2 JP 3736439 B2 JP3736439 B2 JP 3736439B2 JP 2001359967 A JP2001359967 A JP 2001359967A JP 2001359967 A JP2001359967 A JP 2001359967A JP 3736439 B2 JP3736439 B2 JP 3736439B2
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workpiece
work
wire bonding
chip
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JP2003163233A (en
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幸一 御手洗
崇人 勝浦
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、基板にＩＣチップが固定されたワークにワイヤボンディングするために、ワークをクランプする装置に関する。特に、ＩＣチップ上面のワイヤボンディング点の高さが異なる２種類以上のワークのいずれをもクランプすることができる装置に関する。
【０００２】
【従来の技術】
特開昭５６−７６５４４号公報に、基板に固定されたＩＣチップの上面にワイヤボンディングするために、基板をクランプする装置が示されており、クランプ装置の全体を上下動させることによって、ワーク種類によらないで、ワイヤボンディング点の高さを一定に調整する技術が開示されている。この技術では、超音波発信器と超音波受信器を用いてＩＣチップの上面の高さを検出し、その検出結果によってクランプ装置の全体を上下動させ、その結果としてＩＣチップ上面のワイヤボンディング点の高さが一定の高さに調整されるようにする。
【０００３】
【発明が解決しようとする課題】
従来の技術では、超音波発信器と超音波受信器を用いてＩＣチップの上面の高さを検出することから、ワーククランプ装置を含むワイヤボンディング装置の製造コストが高くなる。またワイヤボンディング装置の維持管理に工数を要し、故障する場合もある。
本発明は、より単純な構成によって、ワークの種類によらないでワイヤボンディング点の高さが一定の高さに維持されるように、複数種類のワークをクランプすることができるワーククランプ装置を実現することを目的とする。
【０００４】
【課題を解決するための手段】
本発明では、ワークの種類ごとに基板の形状が異なることから、それを利用することによって、ＩＣチップの上面の高さを検出しなくても、ＩＣチップ上面のワイヤボンディング点の高さを一定に維持できるという事象を利用する。
本発明のワーククランプ装置は、ワイヤボンディングするために、ＩＣチップが固定された基板をクランプする装置であり、複数種類が存在するワークから選択される任意種類のワークをクランプすることができる。基板上面からＩＣチップ上面までの高さは、ワーク種類毎に異なっている。
このクランプ装置は、基板上面に当接する上面押えマスクと、ワークを載置して上昇するテーブルとを有する。上面押えマスクの下面は、少なくともその中央部の下面レベルとその両サイド部の下面レベルが異なるレベルに形成されている。夫々の下面レベルは、夫々の下面レベルに当接した基板上のＩＣチップ上面でのワイヤボンディング点の高さをワーク種類によらないで一定の高さに維持するように設定されている。
【０００５】
このクランプ装置によると、ＩＣチップのボンディング面の高さを検出する必要がなく、超音波発信器や超音波受信器やその信号処理装置等が必要とされず、ワーククランプ装置を安価に製造することができる。またワーククランプ装置の維持管理に工数を要さず、装置が故障する可能性は極めて低い。
【０００６】
本発明のクランプ装置は、テーブル上にワークを送り込む装置と組合せて利用することが有用であり、その場合には、その送り込み位置をワーク種類毎に切換える装置と組合せて用いる。
この場合、ワーク種類ごとに、ワークをその種類のための当接形状に対応した位置に置くことができ、テーブルを上昇させることによって、各ワークはそれぞれの種類のための当接当接形状に当接してワークの高さが固定される。
【０００７】
【発明の実施の形態】
以下に説明する実施例の主要な特徴を最初に整理する。
（形態１）上面押えマスクの中央部を薄くし、薄くした部分で小型基板の上面を押える一方、上面押えマスクの両サイドの厚い部分で大型基板の上面を押える。
（形態２）ワークの進行方向に短いワークについては、ワーク送り込み装置を大きなストロークで往復動させる。
【０００８】
【実施例】
最初に本実施例のクランプ装置でクランプする２種類のワークを説明する。図１の（Ａ）は第１種類のワーク１ａの平面図を示し、図１の（Ｃ）はそのＣ方向からの側面図を示す。第１種類のワーク１ａは、薄い大型基板２ａの上面に４個のＩＣチップ４ａが固定されている。第１種類のワーク１ａは、ＩＣチップ４ａの上面にワイヤボンディングする必要がある。図１の（Ｂ）は第２種類のワーク１ｂの平面図を示し、図１の（Ｄ）はＤ−Ｄ線断面図を示す。第２種類のワーク１ｂは、厚い小型基板２ｂの上面に３個の凹所３が形成され、各凹所３内に１個のＩＣチップ４ｂが固定されている。第２種類のワーク１ｂは、ＩＣチップ４ｂの上面にワイヤボンディングする必要がある。図１（Ｃ）と図１（Ｄ）を比較すると明らかに、第１種類のワーク１ａと第２種類のワーク１ｂでは、ワーク底面からワイヤボンディング点までの高さが異なり、ワーク底面を同一レベルでクランプすると、ＩＣチップ４ａ、４ｂのワイヤボンディング点の高さが異なってくる。
【０００９】
ＩＣチップのワイヤボンディング面をカメラで撮影しながらワイヤボンディングしていく場合、ワーク種類ごとにワイヤボンディング点の高さが異なっていると、ワイヤボンディングするワーク種類が代るたびに、カメラの焦点高さを調整する必要がある。これに伴ってピクセルレートの確認作業が必要とされ、さらには、ワイヤボンディングのためのキャピラリ（ヘッド）が垂直に移動せず、円弧に沿って移動することから、ワイヤボンディング高さが変化すると、キャピラリとＩＣチップの接触点位置（水平面内位置）まで変化することになることを補償しなければならない。また、キャピラリの先端が片当りを起こし、ボンディング不良を発生しやすくなってしまう。ワイヤボンディングの高さが異なる複数種類のワークを次々に製造する場合には、上記の調整作業に時間を要することから生産効率が極端に悪化する。
【００１０】
この実施例の装置では、図１の（Ｇ）と（Ｈ）に示すように、ワーク種類にかかわらずに、ワイヤボンディングするＩＣチップ４ａ、４ｂの上面の高さが一致するように（図示の場合にはレベル２０で揃っている）ワーク１ａ、１ｂをクランプする。
【００１１】
クランプ装置は、ワーク１ａ、１ｂのいずれかを載置して上昇するテーブル１４と、テーブル１４とともに上昇するワーク１ａ、１ｂの上面に当接する上面押えマスク１０で構成される。上面押えマスク１０は、右側マスク１０Ｒと左側マスク１０Ｌとで構成されている。
後記するように、第１種類のワーク１ａは、テーブル１４上の図１（Ｅ）に示される位置に送り込まれる。第２種類のワーク１ｂは、テーブル１４上の図１（Ｆ）に示される位置に送り込まれる。
【００１２】
上面押えマスク１０Ｒ、１０Ｌの図面左右方向の中央部では、下面レベルが高い。第２種類のワーク１ｂが図１（Ｆ）の位置で上昇すると、第２種類のワーク１ｂの小型基板２ｂは、上面押えマスク１０Ｒ、１０Ｌの中央部のレベルが高い下面に当接して上下方向にクランプされ、第２種類のワーク１ｂの高さが固定される。この状態が図１（Ｈ）に示される。第２種類のワーク１ｂのワイヤボンディング面（ＩＣチップ４ｂの上面）はレベル２０に位置決めされる。
上面押えマスク１０Ｒ、１０Ｌの図面左右方向の両サイド部では、下面レベルが低い。第１種類のワーク１ａが図１（Ｅ）の位置で上昇すると、第１種類のワーク１ａの大型基板２ａは、上面押えマスク１０Ｒ、１０Ｌの両サイド部のレベルが低い下面に当接して上下方向にクランプされ、第１種類のワーク１ａの高さが固定される。この状態が図１（Ｇ）に示される。第１種類のワーク１ａのワイヤボンディング面（ＩＣチップ４ａの上面）もレベル２０に位置決めされる。
【００１３】
図５（Ａ）は第１種類のワーク１ａをクランプしたときの拡大平面図を示し、図６（Ａ）はそのＶＩ−ＶＩ線断面を示す。上面押えマスクの紙面左右方向にあるアーム部の下面３０Ａは中央部の下面３０Ｂよりも低い。図６（Ａ）に示すように、基板２ａの表面よりも高い位置にワイヤボンディング面がある第１種類のワーク１ａについては、レベルの低いアーム部の下面３０Ａで基板２ａの表面をクランプする。
図５（Ｂ）は第２種類のワーク１ｂをクランプしたときの拡大平面図を示し、図６（Ｂ）はそのＶＩ−ＶＩ線断面を示す。上面押えマスクの左右方向での中央部の下面３０Ｂは両サイドにあるアームの下面３０Ａよりも高い。図６（Ｂ）に示すように、基板２ｂの表面よりも低い位置にワイヤボンディング面がある第２種類のワーク１ｂについては、レベルの高い中央部の下面３０Ｂで基板２ｂの表面をクランプする。
下面３０Ａと下面３０Ｂのレベル差は、図６（Ａ）のワイヤボンディング面（ＩＣチップ４ａの上面）のレベルと、図６（Ｂ）でのワイヤボンディング面（ＩＣチップ４ｂの上面）のレベルが等しくなる関係に設定されている。
【００１４】
図７に示されているように、上面押えマスクの下面は、ワークの進行方向に向けてテーパ面３２となっている。このテーパ面３２は、ワークを押えマスク下に送り込む際のさそい込みである。
【００１５】
上記から明らかに、上面押えマスクの下面３０Ａはワーク１ａには当接してワーク１ｂには当接しない。上面押えマスクの下面３０Ｂはワーク１ｂには当接してワーク１ａには当接しない。上面押えマスク１０Ｒ，１０Ｌの下面には、各種類のワーク上面に当接するワーク種類毎に固有の当接形状３０Ａ、３０Ｂが形成されている。
またワーク種類毎に固有の当接形状３０Ａ、３０Ｂの高さは、ワイヤボンディング点の高さをワーク種類１ａ、１ｂによらないで一定の高さに維持するように設定されている。
【００１６】
次に、第１種類のワーク１ａを図１（Ｅ）と図５（Ａ）に示す位置、即ち、下面３０Ｂには当接しないで下面３０Ａに当接する位置に送り込み、第２種類のワーク１ｂを図１（Ｆ）と図５（Ｂ）に示す位置、即ち、下面３０Ａには当接しないで下面３０Ｂに当接する位置に送り込むワーク送り込み装置を説明する。
図２に示すように、テーブル１４の左右にはワーク搬送路が伸びており、ワークがその上面上を移動可能になっている。ワーク搬送路の側方に、ワークを送る爪２４が設置されており、爪２４は図示しないパルスモータによって左右方向に往復動する。また、爪２４は垂直方向に上下動し、その上下位置もモータあるいはエアシリンダによって切換えられる。
爪２４は、３本の送りアームを備えている。図４（Ａ）に示すように、第１のアーム２４ａの先端から第２のアーム２４ｂの先端までの距離はＬであり、第２のアーム２４ｂの先端から第３のアーム２４ｃの先端までの距離はｌである。
【００１７】
図２と、図４（Ａ）〜（Ｄ）に示すように、第１種類のワーク１ａを送るときは、爪２４がＬのストロークで往復動する。爪２４は右に進むときには下降しており、ワーク搬送路上のワークを押し進める。爪２４は上昇して左に戻るためにワークと干渉することがなく、ワークを押し戻すことはない。
図２（Ａ）から（Ｄ）は、爪２４がＬのストロークで往復動することによって第１種類のワーク１ａが送られる様子を示し、図１（Ｅ）と図５（Ａ）に示す位置に送り出されることが理解される。
図３と、図４（Ｅ）〜（Ｈ）に示すように、第２種類のワーク１ｂを送るときは、爪２４がＬ＋Ａのストロークで往復動する。このときに、第２種類のワーク１ｂが送られる様子が図３（Ａ）から（Ｄ）に示されており、第２種類のワーク１ｂが図１（Ｆ）と図５（Ｂ）に示す位置に送り出されることが理解される。
【００１８】
図４は、第１種類のワーク１ａが送られる様子と、第２種類のワーク１ｂが送られる様子を対比して示すものであり、第１種類のワーク１ａの左端５ａに比して第２種類のワーク１ｂの左端５ｂが距離Ａだけ右方向に進んだ位置に送り出されることが確認される。
【００１９】
この実施例の装置によると、ワイヤボンディングするワークの種類が切換わる場合には、爪２４のストロークだけを変えればよく、これによって、ワーク種類の切換えの前後を通じてワイヤボンディング面の高さは一定に維持される。ワーク種類の切換えに簡単に対応でき、少量多品種の生産性を高く維持することができる。
【００２０】
以上、本発明の具体例を詳細に説明したが、これらは例示にすぎず、特許請求の範囲を限定するものではない。特許請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。例えば、切換えて対応可能なワーク種類は２種に限られず、３種類以上を混合生産する場合にも適用することができる。
また、本明細書または図面に説明した技術要素は、単独であるいは各種の組み合わせによって技術的有用性を発揮するものであり、出願時請求項記載の組み合わせに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。
【００２１】
【発明の効果】
本発明のワーククランプ装置によると、例えば、第１種類のワークの大型基板は上面押えマスクの両サイド部のレベルが低い下面に当接して上下方向にクランプされ、第１種類のワークの高さが固定される。第２種類のワークの小型基板は上面押えマスクの中央部のレベルが高い下面に当接して上下方向にクランプされ、第２種類のワークの高さが固定される。上面押えマスクの中央部の下面と両サイド部の下面のレベル差は、第１種類のワークのワイヤボンディング面（ＩＣチップの上面）のレベルと、第２種類のワイヤボンディング面（ＩＣチップの上面）のレベルが等しくなる関係に設定されている。
ＩＣチップ上面でのワイヤボンディング点の高さを一定に維持するために、ワイヤボンディング面の高さを検出する必要もなければ、クランプ装置の高さを調整をする必要もない。クランプ装置の構成は非常に単純化され、安価に製造でき、維持管理の負荷もほとんどかからない。
それでいながら、少量多品種のワークに対して高効率でワイヤボンディングすることができ、生産効率を高く維持することを可能となる。
【図面の簡単な説明】
【図１】 （Ａ）は第１種類のワークの平面図。（Ｂ）は第２種類のワークの平面図。（Ｃ）は第１種類のワークのＣ方向側面図。（Ｄ）は第２種類のワークのＤ−Ｄ線断面図。（Ｅ）はクランプされた第１種類のワークを示す平面図。（Ｆ）はクランプされた第２種類のワークを示す平面図。（Ｇ）はクランプされた第１種類のワークを示すＧ―Ｇ線断面図。（Ｈ）はクランプされた第２種類のワークを示すＨ―Ｈ線断面図。
【図２】 （Ａ）〜（Ｄ）は第１種類のワークが送られる様子を示す平面図。
【図３】 （Ａ）〜（Ｄ）は第２種類のワークが送られる様子を示す平面図。
【図４】 第１種類のワークが送られる様子と、第２種類のワークが送られる様子を対比して示す図。
【図５】 （Ａ）はクランプされた第１種類のワークを示す拡大平面図。（Ｂ）はクランプされた第２種類のワークを示す拡大平面図。
【図６】 （Ａ）はクランプされた第１種類のワークを示す図５（Ａ）のＶＩ−ＶＩ線断面図。（Ｂ）はクランプされた第２種類のワークを示す図５（Ｂ）のＶＩ−ＶＩ線断面図。
【図７】 上面押えマスク１０Ｒを図５（Ａ）のＶＩＩ方向から見た側面図。
【符号の説明】
１ａ：第１種類ワーク １ｂ：第２種類ワーク
２ａ：第１種類ワークの基板 ２ｂ：第２種類ワークの基板
４ａ：第１種類ワークのＩＣチップ ４ｂ：第２種類ワークのＩＣチップ
１０Ｒ：上面押えマスク（右） １０Ｌ：上面押えマスク（左）
１４：テーブル
３０Ａ：第１種類ワークを押える底面 ３０Ｂ：第２種類ワークを押える底面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for clamping a workpiece for wire bonding to a workpiece having an IC chip fixed to a substrate. In particular, the present invention relates to an apparatus capable of clamping any of two or more kinds of workpieces having different wire bonding point heights on the upper surface of an IC chip.
[0002]
[Prior art]
Japanese Patent Application Laid-Open No. 56-76544 discloses a device for clamping a substrate for wire bonding to the upper surface of an IC chip fixed to the substrate. A technique for adjusting the height of the wire bonding point to a constant level is disclosed. In this technique, the height of the upper surface of the IC chip is detected using an ultrasonic transmitter and an ultrasonic receiver, and the entire clamping device is moved up and down according to the detection result. As a result, wire bonding points on the upper surface of the IC chip are detected. So that the height is adjusted to a certain height.
[0003]
[Problems to be solved by the invention]
In the conventional technique, since the height of the upper surface of the IC chip is detected using an ultrasonic transmitter and an ultrasonic receiver, the manufacturing cost of the wire bonding apparatus including the work clamp apparatus is increased. Also, man-hours are required for the maintenance and management of the wire bonding apparatus, and it may break down.
The present invention realizes a workpiece clamping device that can clamp a plurality of types of workpieces so that the height of the wire bonding point is maintained at a constant height regardless of the type of workpieces with a simpler configuration. The purpose is to do.
[0004]
[Means for Solving the Problems]
In the present invention, since the shape of the substrate differs depending on the type of workpiece, the height of the wire bonding point on the upper surface of the IC chip can be kept constant by using this, without detecting the height of the upper surface of the IC chip. Use the phenomenon that can be maintained.
The workpiece clamping device of the present invention is a device for clamping a substrate on which an IC chip is fixed for wire bonding, and can clamp any type of workpiece selected from a plurality of types of workpieces. The height from the upper surface of the substrate to the upper surface of the IC chip is different for each work type.
This clamping device has an upper surface pressing mask that comes into contact with the upper surface of the substrate , and a table on which a workpiece is placed and raised. The lower surface of the upper surface pressing mask is formed at a level where at least the lower surface level of the central portion and the lower surface levels of both side portions are different . Each lower surface level is set so that the height of the wire bonding point on the upper surface of the IC chip on the substrate in contact with each lower surface level is maintained at a constant height regardless of the work type .
[0005]
According to this clamping device, it is not necessary to detect the height of the bonding surface of the IC chip, and an ultrasonic transmitter, an ultrasonic receiver, and its signal processing device are not required, and the work clamping device is manufactured at low cost. be able to. Moreover, the maintenance of the work clamp device does not require man-hours, and the possibility of the device being damaged is extremely low.
[0006]
It is useful to use the clamping device of the present invention in combination with a device that feeds a workpiece onto a table. In that case, the clamping device is used in combination with a device that switches the feeding position for each workpiece type.
In this case, for each workpiece type, the workpiece can be placed at a position corresponding to the contact shape for that type, and by raising the table, each workpiece has a contact contact shape for each type. The height of the workpiece is fixed by contact.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The main features of the embodiments described below are first organized.
(Mode 1) The central portion of the upper surface pressing mask is thinned, and the upper surface of the small substrate is pressed by the thinned portion, while the upper surface of the large substrate is pressed by the thick portions on both sides of the upper surface pressing mask.
(Embodiment 2) For a work that is short in the moving direction of the work, the work feeding device is reciprocated with a large stroke.
[0008]
【Example】
First, two types of workpieces to be clamped by the clamping device of this embodiment will be described. 1A shows a plan view of the first type of work 1a, and FIG. 1C shows a side view from the C direction. In the first type work 1a, four IC chips 4a are fixed on the upper surface of a thin large substrate 2a. The first type work 1a needs to be wire-bonded to the upper surface of the IC chip 4a. 1B is a plan view of the second type work 1b, and FIG. 1D is a cross-sectional view taken along the line DD. In the second type work 1b, three recesses 3 are formed on the upper surface of a thick small substrate 2b, and one IC chip 4b is fixed in each recess 3. The second type work 1b needs to be wire-bonded to the upper surface of the IC chip 4b. Clearly comparing FIG. 1 (C) and FIG. 1 (D), the first kind of work 1a and the second kind of work 1b have different heights from the work bottom surface to the wire bonding point, and the work bottom surface is at the same level. When clamped with, the heights of the wire bonding points of the IC chips 4a and 4b are different.
[0009]
When wire bonding is performed while photographing the wire bonding surface of the IC chip with a camera, if the height of the wire bonding point differs for each work type, the focal point of the camera will change each time the work type to be wire-bonded changes. It is necessary to adjust the thickness. Along with this, it is necessary to check the pixel rate. Furthermore, since the capillary (head) for wire bonding does not move vertically but moves along an arc, if the wire bonding height changes, It must be compensated for the change to the contact point position (position in the horizontal plane) between the capillary and the IC chip. In addition, the tip of the capillary is caused to come into contact with one another, which tends to cause bonding failure. When a plurality of types of workpieces having different wire bonding heights are manufactured one after another, the above-described adjustment work takes time, and thus production efficiency is extremely deteriorated.
[0010]
In the apparatus of this embodiment, as shown in FIGS. 1 (G) and (H), the heights of the upper surfaces of the IC chips 4a and 4b to be wire-bonded coincide with each other regardless of the work type (shown in the figure). In this case, the workpieces 1a and 1b are clamped at level 20.
[0011]
The clamping device includes a table 14 that moves up by placing any one of the workpieces 1a and 1b, and an upper surface presser mask 10 that comes into contact with the upper surfaces of the workpieces 1a and 1b that move up together with the table 14. The upper surface presser mask 10 includes a right mask 10R and a left mask 10L.
As will be described later, the first type of work 1a is fed to the position shown in FIG. The second type of work 1b is sent to the position shown in FIG.
[0012]
The lower surface level is high at the center of the upper surface pressing masks 10R, 10L in the horizontal direction of the drawing. When the second type work 1b is raised at the position shown in FIG. 1 (F), the small substrate 2b of the second type work 1b comes into contact with the lower surface having a high level at the center of the upper surface presser masks 10R and 10L and moves up and down. And the height of the second type work 1b is fixed. This state is shown in FIG. The wire bonding surface (the upper surface of the IC chip 4b) of the second type workpiece 1b is positioned at level 20.
The lower surface level is low at both side portions of the upper surface pressing masks 10R and 10L in the horizontal direction of the drawing. When the first type work 1a is lifted at the position shown in FIG. 1E, the large substrate 2a of the first type work 1a is brought into contact with the lower surfaces of the upper surface pressing masks 10R and 10L having lower levels and moved up and down. The height of the first type work 1a is fixed by clamping in the direction. This state is shown in FIG. The wire bonding surface (the upper surface of the IC chip 4a) of the first type workpiece 1a is also positioned at level 20.
[0013]
FIG. 5A shows an enlarged plan view when the first type work 1a is clamped, and FIG. 6A shows a cross section taken along the line VI-VI. The lower surface 30A of the arm portion in the left-right direction of the upper surface presser mask is lower than the lower surface 30B of the central portion. As shown in FIG. 6A, for the first type of work 1a having the wire bonding surface at a position higher than the surface of the substrate 2a, the surface of the substrate 2a is clamped by the lower surface 30A of the arm portion having a low level.
FIG. 5B shows an enlarged plan view when the second type work 1b is clamped, and FIG. 6B shows a cross section taken along the line VI-VI. The lower surface 30B of the center part in the left-right direction of the upper surface pressing mask is higher than the lower surfaces 30A of the arms on both sides. As shown in FIG. 6B, for the second type work 1b having the wire bonding surface at a position lower than the surface of the substrate 2b, the surface of the substrate 2b is clamped by the lower surface 30B of the central portion having a high level.
The level difference between the lower surface 30A and lower surface 30B has a level Wai unrefined bindings surface of FIG. 6 (A) (the upper surface of the IC chip 4a), Wai unrefined bindings surface in FIG. 6 (B) of (the upper surface of the IC chip 4b) The level is set to be equal.
[0014]
As shown in FIG. 7, the lower surface of the upper surface presser mask has a tapered surface 32 toward the workpiece traveling direction. The tapered surface 32 is a sway when the work is fed under the presser mask.
[0015]
Obviously from the above, the lower surface 30A of the upper surface presser mask contacts the workpiece 1a and does not contact the workpiece 1b. The lower surface 30B of the upper surface pressing mask abuts on the workpiece 1b and does not abut on the workpiece 1a. On the lower surfaces of the upper surface presser masks 10R and 10L, unique contact shapes 30A and 30B are formed for each type of workpiece that contacts the upper surface of each type of workpiece.
The height of the contact shapes 30A and 30B unique to each workpiece type is set so as to maintain the height of the wire bonding point at a constant height regardless of the workpiece types 1a and 1b.
[0016]
Next, the first type work 1a is fed to the position shown in FIGS. 1E and 5A, that is, the position contacting the lower surface 30A without contacting the lower surface 30B, and the second type work 1b. A workpiece feeding device that feeds the workpiece to the position shown in FIG. 1 (F) and FIG. 5 (B), that is, the position contacting the lower surface 30B without contacting the lower surface 30A will be described.
As shown in FIG. 2, work conveyance paths extend to the left and right of the table 14, and the work can move on the upper surface thereof. A claw 24 for feeding a workpiece is installed on the side of the workpiece conveyance path, and the claw 24 reciprocates in the left-right direction by a pulse motor (not shown). The claw 24 moves up and down in the vertical direction, and its vertical position is switched by a motor or an air cylinder.
The claw 24 includes three feeding arms. As shown in FIG. 4A, the distance from the tip of the first arm 24a to the tip of the second arm 24b is L, and from the tip of the second arm 24b to the tip of the third arm 24c. The distance is l.
[0017]
As shown in FIG. 2 and FIGS. 4A to 4D, when feeding the first type of work 1a, the claw 24 reciprocates with an L stroke. The claw 24 is lowered when proceeding to the right, and pushes the workpiece on the workpiece conveyance path. Since the nail | claw 24 raises and returns to the left, it does not interfere with a workpiece | work and does not push a workpiece | work back.
2 (A) to 2 (D) show how the first type of work 1a is fed by the reciprocating movement of the claw 24 with the stroke of L, and the positions shown in FIGS. 1 (E) and 5 (A). It is understood that
As shown in FIG. 3 and FIGS. 4E to 4H, when feeding the second type of work 1b, the claw 24 reciprocates with a stroke of L + A. 3A to 3D show how the second type of work 1b is sent at this time, and the second type of work 1b is shown in FIGS. 1F and 5B. It is understood that it is delivered to a position.
[0018]
FIG. 4 shows a state in which the first type of work 1a is sent and a state in which the second type of work 1b is sent in comparison with the second end 5a of the first type of work 1a. It is confirmed that the left end 5b of the type of work 1b is sent to a position advanced rightward by the distance A.
[0019]
According to the apparatus of this embodiment, when the type of workpiece to be wire-bonded is switched, it is only necessary to change the stroke of the claw 24, so that the height of the wire bonding surface is constant before and after the switching of the workpiece type. Maintained. It can easily cope with the switching of workpiece types, and can maintain a high productivity of a small variety of products.
[0020]
Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. For example, the types of workpieces that can be handled by switching are not limited to two types, and the present invention can also be applied to a case where three or more types are mixed and produced.
In addition, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.
[0021]
【The invention's effect】
According to the workpiece clamping device of the present invention, for example, the large substrate of the first type workpiece is clamped in the vertical direction by abutting against the lower surface of both side portions of the upper surface holding mask, and the height of the first type workpiece is increased. Is fixed. The small substrate of the second type work is brought into contact with the lower surface having a high level at the center of the upper surface pressing mask and is clamped in the vertical direction, and the height of the second type work is fixed. The level difference between the lower surface of the center portion of the upper surface pressing mask and the lower surfaces of both side portions is the level of the wire bonding surface (the upper surface of the IC chip) of the first type workpiece and the second type wire bonding surface (the upper surface of the IC chip). ) Level is set to be equal.
In order to keep the height of the wire bonding point on the upper surface of the IC chip constant, it is not necessary to detect the height of the wire bonding surface or to adjust the height of the clamping device. The configuration of the clamping device is very simple, can be manufactured at low cost, and does not require much maintenance.
Nevertheless, high-efficiency wire bonding can be performed on a small variety of workpieces, and production efficiency can be maintained high.
[Brief description of the drawings]
FIG. 1A is a plan view of a first type workpiece. (B) is a top view of a 2nd type workpiece. (C) is a C direction side view of the first type workpiece. (D) is the DD sectional view taken on the line of the 2nd kind of work. (E) is a top view which shows the clamped 1st type workpiece | work. (F) is a top view which shows the clamped 2nd type workpiece | work. (G) is a GG line sectional view showing the clamped first type work. (H) is the HH sectional view showing the 2nd type work clamped.
FIGS. 2A to 2D are plan views showing a state in which a first type of workpiece is sent.
FIGS. 3A to 3D are plan views showing a state in which a second type of workpiece is sent.
FIG. 4 is a diagram showing a state in which a first type of work is sent and a state in which a second type of work is sent.
FIG. 5A is an enlarged plan view showing a clamped first type workpiece. (B) is an enlarged plan view showing a clamped second type workpiece.
6A is a cross-sectional view taken along the line VI-VI of FIG. 5A showing the clamped first type workpiece. (B) is the VI-VI sectional view taken on the line of FIG. 5 (B) which shows the clamped 2nd type workpiece | work.
7 is a side view of the upper surface presser mask 10R as viewed from the direction VII in FIG. 5A. FIG.
[Explanation of symbols]
1a: First type work 1b: Second type work 2a: First type work substrate 2b: Second type work substrate 4a: First type work IC chip 4b: Second type work IC chip 10R: Upper surface presser Mask (right) 10L: Upper surface presser mask (left)
14: Table 30A: Bottom surface for pressing the first type workpiece 30B: Bottom surface for pressing the second type workpiece

Claims (2)

基板にＩＣチップが固定されているとともに基板上面からＩＣチップ上面までの高さが種類毎に異なる複数種類のワークの中から選択される任意種類のワークをクランプできる装置であり、基板上面に当接する上面押えマスクと、ワークを載置して上昇するテーブルとを有し、
その上面押えマスクの下面は、少なくともその中央部の下面レベルとその両サイド部の下面レベルが異なるレベルに形成されており、夫々の下面レベルは、夫々の下面レベルに当接した基板上のＩＣチップ上面でのワイヤボンディング点の高さをワークの種類によらないで一定の高さに維持するように設定されていることを特徴とする、ワイヤボンディングのためにワークをクランプする装置。An IC chip is fixed to the substrate and can clamp any type of workpiece selected from multiple types of workpieces with different heights from the substrate top surface to the IC chip top surface for each type. An upper surface pressing mask that comes into contact with the table and a table that rises by placing a workpiece;
The lower surface of the upper surface presser mask is formed so that at least the lower surface level of the central portion is different from the lower surface level of both side portions, and each lower surface level is an IC on the substrate in contact with each lower surface level. An apparatus for clamping a workpiece for wire bonding, wherein the height of the wire bonding point on the upper surface of the chip is set to be constant regardless of the type of workpiece. 上記テーブル上にワークを送り込む装置と、その送り込み位置をワーク種類毎に切換える装置が付加されていることを特徴とする請求項１のワーククランプ装置。  2. A work clamping apparatus according to claim 1, further comprising a device for feeding the workpiece onto the table and a device for switching the feeding position for each workpiece type.
JP2001359967A 2001-11-26 2001-11-26 Work clamping device for wire bonding Expired - Fee Related JP3736439B2 (en)

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