JPH03184638A - Method and apparatus for automatic punching - Google Patents

Abstract

PURPOSE:To accurately and efficiently work a substrate by setting a sensor mark on the working substrate positioning the working substrate on a matching table in accordance with the sensor mark and moving it by a prescribed stroke to be punched. CONSTITUTION:A circuit pattern part of which is a sensor mark or the circuit pattern and the working substrate having the sensor mark are mounted on the matching table 11 of a matching part 10 and sucked by it and matched in accordance with the sensor mark. Then, after matching is completed, the working substrate is sucked to a carrier table 41, transmitted to a punching part 20 and punched. Thereafter, a punched substrate is discharged and the next matched working base plate is transmitted into the punching part 20.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method and apparatus for forming guide holes in a substrate, such as guide holes for pin lamination of a multilayer substrate.

2. Description of the Related Art For example, manufacturing a multilayer board using a bottle lamination method includes the following steps.

(,) Manufacture of the board for each layer: Guide holes are formed in the copper-clad laminate, and then the circuit pattern film is aligned using the guide holes as a reference, and then the circuit is printed on the board by exposure method, etching method, etc. form a pattern.

(b) Alignment 2 Alignment is performed by inserting the prepreg and the guide holes of the substrates of each layer alternately into the guide bins protruding from the jig plate.

(c) Pressure and Finishing 2 The group of substrates after the alignment described above is laminated by applying pressure, and then the laminated substrates are removed from the jig plate and finishing is performed to remove adhesive and the like adhering to the end surfaces.

As is clear from the above, the guide hole serves as a reference for forming the circuit pattern on each board and aligning the boards, and its processing positional accuracy and dimensional accuracy are extremely important. For this reason, conventionally, for processing this type of guide hole, a processing machine such as an NC drill that can control the processing position and perform processing with high precision has been used.

Problems to be Solved by the Invention However, even with an NC drill, some processing errors are unavoidable, and when the guide hole of the board is inserted into the guide bin, chips may be generated and the board may be distorted. there were.

In addition, the alignment of the circuit pattern film with reference to the guide hole is performed visually while magnifying it using a projector, etc., but in this case, misalignment is unavoidable, and the work is difficult. required a lot of time.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention adopts high-precision punching for processing the guide holes, and furthermore, during the processing, a part of the mark on the circuit pattern film or a separate mark is added to the film. The mark is used as a sensor mark to determine the processing position of the guide hole, and alignment and
The subsequent processing was automated.

That is, the first aspect of the present invention is an automated punching method, which includes a sensor mark for positioning a guide hole formed together with a circuit pattern on a substrate to be processed;
Or use part of the circuit pattern as a sensor mark,
The substrate to be processed is placed on the alignment table of the alignment section and predetermined alignment is performed based on the sensor mark, and then the aligned workpiece is sucked onto a carrier table that can reciprocate by a predetermined stroke, and the punching section After being transported, punching is performed.

Further, the invention @2 of the present invention is a punching device for carrying out the method of the first invention, in which an alignment part and a punching part are arranged apart from each other, and an alignment table and a punching table thereof are arranged separately. A groove is formed in the part, and at least a
h ^ -p ,, +talk *ff l+ IJL
陀 KO1 candy ↓ π し、a+= A carrier table with a length that reaches between both tables and has a suction plate is inserted between the grooves, and the carrier table is connected to a reversible movable drive source to perform both alignment and punching. The carrier and the table, and either or both of the alignment and punching tables are combined with a height changer to adjust the carrier table relative to the upper surface of both tables. The upper surface can be switched to three relative levels: flat, protruding, and recessed.

A circuit pattern having a part as a sensor mark, or a substrate to be processed having the shape of a circuit pattern and a sensor mark is placed on an alignment table in an alignment section and adsorbed there, and alignment based on the sensor mark is performed there. Subsequently, the substrate to be processed after alignment is adsorbed onto a carrier and transported to the punching section in a state of protruding from the table, where it is transferred to the punching section where it is placed in the parry I-standing position t4↓.
ν+, /, -e54~. A-31 After returning to 7-A, the punched substrate to be processed is discharged from the punching section, and the next aligned substrate to be processed is carried into the punching section by the carrier. Thereafter, the above-described punching, ejection, and alignment are repeated.

Embodiment In FIG. 1, an alignment section 1 is provided upstream of the punching section 20.
The punching device is constructed by arranging the punching section 0 and the carrying-out section 30 on the downstream side.

The alignment table of the alignment unit 10 is arranged in the direction of flow of the substrate to be processed (
It consists of suction discs 11 and 12 arranged at intervals in a direction perpendicular to the lower right to upper left in the figure, and the suction discs 1
1.12 is connected below to an alignment machine 13 that controls movement in two horizontal directions and in a rotational direction on a horizontal plane based on the output of an image processing unit described later. Suction board 11
．． A sensor for detecting marks on the substrate to be processed, consisting of a CCD camera 14 and 15, is arranged opposite to the upper surface of the image processing unit 12, and its output is introduced into an image processing unit 16. The image processing unit 16 is mainly composed of computing elements, and calculates the center position of the mark according to the output of each pixel sent from the CCD camera 14.15, and the center position of the mark is determined by the C'CD camera 14.15. A compensation signal is sent to the control circuit of the matching device 13 so as to be located on a predetermined pixel of the matching device 13.

17a and 17b, 18a and 18b are a Y stopper and a Y button, and an X stopper and an X button, respectively, for rough positioning of the substrate to be processed. The plate-shaped Y stopper 17a is fixed at a predetermined position on the one suction plate 12 in parallel to the flow direction of the substrate to be processed (hereinafter, this direction is referred to as the X direction), and the pin-shaped Y stopper 7b is fixed to the other suction plate 12. It is inserted into a groove bored in the suction disc 11 in a direction perpendicular to the X direction (hereinafter, this direction is referred to as the Y direction), and both 17a and 17b are opposed to each other.

Similarly, two pin-shaped X stoppers 18a are fixed to the inside of the suction disc 11.12 at predetermined positions in the X direction, protruding slightly from the top surface of the suction disc, and a pin-shaped X stopper 18b is arranged opposite thereto. has been done.

In the punching section 20, first and second punching tables 21 and 22 (however, 22 is not shown) are arranged at intervals in the Y direction, similar to the alignment table, and Idpos) 23a to 23d are provided at the four corners of the outer base of the table 21, 22, and a vertically movable frame 24 is slidably fitted to the upper part thereof. In FIG. 2 showing a cross section of the punching part 20 in the direction of arrows A-A and FIG. 3 showing a plan view in the direction of arrow B-B of FIG. are female molds 25a, 25b, 25 separated by a predetermined distance (dimension between guide holes of the substrate to be processed), respectively.
c, 25d are fixed, and male molds 26a to 26d (however, 26c, 26d
(not shown) are fixed. Also, frame body 2
A support plate 27 extending downward from the bottom surface of 4 is provided with a support plate 27 for preventing displacement or distortion of the substrate to be processed during punching, and is also provided on the same plane as the top surface of the female die. A sliding plate 28 is provided to enable processing of thin-walled substrates. Reference numerals 29a and 29b are hydraulic cylinders, the cylinder portions of which are fixed to the lower portions of the first and second tables 21, the piston portions passing through holes drilled in the cylinder tables 21 and protruding upward, and the tip portions movable up and down. It is fixed to the frame 24.

Referring again to FIG. 1, the unloading section 30 is arranged at intervals in the Y direction similar to the intervals between the suction disk 11.12 of the alignment table and the first and second tables 21.22 of the punching table, Unloading conveyor 31 that transports in the X direction
．． Consists of 32. The carrier 40 has the matching table 1
1.12, the carrier table 41 is interposed in the X direction between the first and second tables 21.22 of the punching table and the discharge conveyor 31.32, and has an imaged configuration. .42 is a length that reaches between the suction plate 11.12 of the alignment table and the first and second tables 21.22 of the punching table. In FIG. 4 showing a perspective view of the carrier 40 in the direction of arrow C-C, an integrated table 41.4 of the carrier 40 is shown.
2 communicates with a suction section (not shown), is placed on an idle rail 43, is coupled to a reversible drive source 44 (described later), and is movable on the guide rail 41 in the X direction. The reversible drive source 44 includes a motor 44a fixed to the guide rail 43, and a motor 44a fixed to its rotating shaft.
J44b, the guide rail 43 is separated by a predetermined distance (at least the distance between the alignment part 10 and the punching part 20) on the downstream side.
The J44c is rotatably supported by the pulley 4.
4b, 44c, an open-wound endless bell) 44d, a magnet 44e fixed to a part of the bell) 44cl and also fixed to the side end of the carrier table 42, and magnets 44e upstream and downstream of the magnet 44e. Stoppers 44F and 44g are disposed at predetermined positions, that is, separated by a distance between the idle hole processing position aligned in the alignment section 10 and the processing position in the punching section 20, and fixed to the guide rail 43.
The integrated carrier table 41, 42 is reversibly moved by a predetermined distance, and at the moving position, the magnet body 44e is attracted to the stopper 44f or 44g, thereby ensuring accurate movement to the stopper arrangement position. It has become so. 45 is a base disposed below the idle rail 43, and vertical guides 46a and 46b are provided between the base 45 and the guide rail 43, and the idle rail 43 can be moved vertically with respect to the base 45. is supported by. 47 and 48 are the first and second cylinders, respectively, which are intervened in opening the guide rail 43 and the base 45, and when the first and second cylinders 47 and 48 are not operating, and when only the first cylinder 47 is operating. , 2nd shilling 4
When only 8 is in operation, the upper surfaces of carrier tables 41 and 42 on guide rail 41 are recessed, horizontal, and protruding relative to the upper surface of alignment table 11.12 and the upper surface of sliding plate 28 on punching table 21, respectively. The stroke of the cylinder is selected.

Hereinafter, a series of operations of alignment, punching, and unloading by the above-mentioned apparatus will be explained.

First, in alignment, the first and second cylinders 47
．． 48 is inactive, and the carrier 40 is in the recessed state. In this state, the substrate to be processed is carried onto the alignment table 11.12, and first, the other end surface of the substrate is pressed against the Y stopper 18 by the extrusion of the Y button 17a, and then the end surface in the direction perpendicular to it is pressed by the extrusion of the X button 18a. It is pressed against the X stopper 18b and rough positioning is performed. Next, the substrate is placed on the suction plate 1 of the alignment table.
1.12, and a sensor mark (also a part of a circuit pattern) on the substrate is detected by a CCD camera 14.15. Then, the matching machine 13 is controlled based on the output of the CCD camera 14, 15, and as a result, -
A fine movement of the body alignment table 11.12 is performed, thereby finely positioning the substrate in a predetermined position. In this state, the first cylinder 47 is operated (FIG. 4) to bring the carrier table 41, 42 of the carrier 40 into a horizontal state with the suction plate 11, 12 of the alignment table, and then the aligned substrate is sucked onto the carrier table 41. Then, the suction of the suction plates 11 and 12 of the alignment table is released. Figure 5 (a)
is a modeled version of the horizontal state, and each element with the same number as in Fig. 1 is the same as that in Fig. 1, but Fig. 5 shows the modeled state. Illustrated. Further, the substrates are shown as A and B, where A is the one that has been aligned before the above-mentioned alignment step and punching has been completed in the punching section 20, and B is the one that has been aligned this time. are shown respectively.

Now, the vertical moving frame 24 of the punching section 20 is raised from the horizontal state shown in FIG.
The motor 44a (FIG. 4) is operated to move the carrier table 41.42 forward a predetermined distance. At this time, the carrier table 41, 42 that has reached the vicinity of the predetermined stroke position is accurately moved by the predetermined stroke as a result of the magnetic body 44e integrated therewith being attracted by the stopper 44g. FIG. 5(b) shows the protruding state immediately after movement by a predetermined stroke, and the punched substrate A has reached the top of the unloading section 30 and the aligned substrate B
reaches the top of the sliding plate 28 of the punching section 20. In this position, the carrier table 41, 42 is again in a horizontal position, and in the punching section 20 the hydraulic cylinders 29a,
29b is activated and the vertically movable frame 24 is lowered to punch the substrate B (FIG. 2). Subsequently, after punching is completed, the suction is released and the carrier table 4
1.42 is brought into the depressed state as shown in FIG. 5(C) and is moved back by a predetermined stroke. At this time, the next substrate C has already been carried onto the alignment table 11.12, and the same alignment as described above is performed, and the substrate A left in the carry-out section 30 is carried out to the outside by the carry-out conveyor 31.32. Ru.

Thereafter, after the carrier tables 41 and 42 move back, they are brought back to the horizontal state shown in FIG. 5(a), and the series of operations described above is repeated. The series of operations is performed by a control section (not shown) based on the operation completion detection signal and time signal of each section.
It is executed automatically based on commands issued to each part.

Further, in the above embodiment, the carrier table 41.4
However, for example, the height of the carrier table 41, 42 is changed to two stages, the suction plate 11, 12 of the alignment table is provided with a two-stage height switching mechanism, and the punching unit 20 is provided with a two-stage height switching mechanism. In order to lift the board from below, for example, a pin or the like is provided that protrudes and recesses from the sliding plate 28, and by combining the two, there is a relative distance of 3.
Any known mechanism that can relatively change the height of three stages, such as one that allows a horizontal, protruding, and depressed state to be obtained, may be used.

Moreover, although the case where there are two matching tables, ie, the suction discs 11 and 12, is illustrated, only one of them may be used.

Further, the carrier is the idle rail 43, and its vertical mechanism is not limited to this. For example, in the former, a guiding unevenness in the X direction is provided between the carrier table, and in the latter, a known mechanism such as a cam is used as appropriate. Good too.

The effects of the invention are as described above, and the present invention defines sensor marks on the substrate to be processed, performs alignment based on the sensor marks, and performs highly accurate punching by moving the predetermined stroke by -k. The substrate can be processed accurately and efficiently.

4,

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a cross-sectional front view in the direction of arrow A-A in FIG. 1, and FIG.
A sectional plan view in the direction of arrows, FIG. 4 is a perspective view of the carrier, and FIG.
This figure is an explanatory diagram of the operation of the one shown in FIG. 10: Aligning section 20: Punching section 30: Carrying out section 40: Carrier

Claims (1)

[Claims] 1. A sensor mark for positioning a guide hole formed together with a circuit pattern on a substrate to be processed, or a part of the circuit pattern is used as a sensor mark, and the substrate to be processed is placed on an alignment table in an alignment section. Automatic punching in which the aligned workpiece is placed and aligned based on the sensor marks, and then the aligned workpiece is sucked onto a carrier table that can be reciprocated by a predetermined stroke, transported to the punching section, and then punched. Method. 2. The alignment part and the punching part are arranged apart from each other, a groove is formed in a part of the alignment table and the punching table, a suction disk is formed in at least the remaining part of the alignment table, and both grooves are formed between the grooves. A carrier table having a length reaching between the tables and having a suction disk is inserted, and the carrier table is connected to a reversible movement drive source so that it can freely reciprocate by a predetermined stroke corresponding to the distance between the two tables for alignment and punching. and table, and one or both of the alignment and punching tables can be combined with a height switcher to switch the top surface of the carrier table relative to the top surface of both tables to three relative levels: coplanar, protruding, and recessed. Automatic punching device that can be used freely.