CN108174517A - Full-automatic PCB substrate processing system - Google Patents
Full-automatic PCB substrate processing system Download PDFInfo
- Publication number
- CN108174517A CN108174517A CN201810007542.XA CN201810007542A CN108174517A CN 108174517 A CN108174517 A CN 108174517A CN 201810007542 A CN201810007542 A CN 201810007542A CN 108174517 A CN108174517 A CN 108174517A
- Authority
- CN
- China
- Prior art keywords
- pcb substrate
- processing system
- control module
- full
- manipulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 238000000465 moulding Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000007688 edging Methods 0.000 claims abstract description 4
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000007872 degassing Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The present invention relates to a kind of full-automatic PCB substrate processing system, including：Molding machine, PCB substrate is cut into preset shape；Hole punched device, in the predeterminated position punching of PCB substrate；Manipulator and the first control module, first control module is controlling the manipulator will be on molding machine and the PCB substrate that processes is moved on the hole punched device；Carrying platform is set to the side of the hole punched device；Second control module, to control the manipulator will be on the hole punched device and the PCB substrate that processes moves to the carrying platform；Third control module, for the PCB substrate being located on the carrying platform to be controlled to move to the molding machine, the molding machine carries out edging processing to the PCB substrate.Above-mentioned full-automatic PCB substrate processing system 100 makes PCB substrate be automatically processed on the work table of different types, reduces human cost, also avoids the problem of plate face scuffing of PCB substrate.
Description
Technical field
The present invention relates to automation control area, more particularly to a kind of full-automatic PCB substrate processing system.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic unit, be electronic component supporter, be electronic component electrical connection carrier.
In the manufacturing process of PCB substrate, need that PCB substrate is carried out to cut molding, it is also necessary to PCB circuit board according to
It is scheduled requirement carry out jet-bedding, traditional PCB circuit board cut and jet-bedding during, staff need in independent sanction
Cut and PCB circuit board cut on machine, it is to be cut cut after the completion of, staff needs to carry out down PCB substrate from guillotine
PCB substrate then, is carried out jet-bedding, drilling etc. by plate on perforating press.Due in the above-mentioned course of work, needing staff's frequency
Numerous ground upper and lower plates increase the human cost of staff, and the scuffing of plate face is easily caused to PCB substrate.
Invention content
Based on this, it is necessary to for due to needing staff's continually upper and lower plates, human cost be caused to increase, PCB bases
The problem of plate face of plate scratches, provides a kind of processing system of the full-automatic PCB substrate without the frequent upper and lower plates of staff.
A kind of full-automatic PCB substrate processing system, including：
Molding machine, PCB substrate is cut into preset shape；
Hole punched device, in the predeterminated position punching of PCB substrate；
Manipulator and the first control module, first control module is controlling the manipulator that will be located at molding machine
The PCB substrate for going up and processing is moved on the hole punched device；
Carrying platform is set to the side of the hole punched device；
Second control module, to control the manipulator will be on the hole punched device and the PCB substrate that processes
Move to the carrying platform；
Third control module, it is described for the PCB substrate being located on the carrying platform to be controlled to move to the molding machine
Molding machine carries out edging processing to the PCB substrate.
In a wherein preferred embodiment, the side of the carrying platform has adjustable baffle plate, to according to institute
The size of the PCB substrate of carrying adjusts the position of the adjustable baffle plate.
In a wherein preferred embodiment, the carrying platform is square structure.
In a wherein preferred embodiment, the manipulator has placement unit, lifting unit and horizontal displacement list
Member, the placement unit is to capture target PCB substrate, and the lifting unit is making the PCB substrate being crawled in vertical side
To movement, the horizontal displacement unit is moving in the horizontal direction the PCB substrate being crawled.
In a wherein preferred embodiment, the manipulator further includes steering unit, to control the PCB being crawled
Substrate turns to.
In a wherein preferred embodiment, the manipulator drives work by hydraulic way.
In a wherein preferred embodiment, the manipulator is by going cylinder to drive.
In a wherein preferred embodiment, first control module, the second control module or third control module
With institute's microcontroller processing chip.
Above-mentioned full-automatic PCB substrate processing system utilizes the first control module, the second control module and third control module
Cooperative mechanical hand makes PCB substrate be automatically processed on the work table of different types, reduces human cost, also avoids
The problem of plate face of PCB substrate scratches,
Description of the drawings
Fig. 1 is the module diagram of the full-automatic PCB substrate processing system in a preferred embodiment of the invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in Figure 1, a kind of full-automatic PCB substrate processing system 100 is disclosed in a preferred embodiment of the invention, it should
Full-automatic PCB substrate processing system 100 includes molding machine 110, hole punched device 120, manipulator 130, the first control module
140th, carrying platform 150, the second control module 160 and third control module 170.
Above-mentioned molding machine 110 by PCB substrate mainly cutting into preset shape.Specifically, the molding machine 110 1
As there is cutter head and work top, staff only needs above-mentioned PCB substrate being placed on work top, the molding machine 170
Can the PCB substrate cut into preset shape.In present embodiment, which will be located at workbench using cutter head
PCB substrate on face cuts into former shaped half.
Above-mentioned hole punched device 120 is used primarily in predeterminated position punching in PCB substrate, jet-bedding etc..Specifically, which fills
Putting 120 generally has drill bit and work top, and PCB substrate is placed on work top, which can utilize and bore
Head bores hole or the slot of preset shape in the predeterminated position of PCB substrate.In present embodiment, which utilizes drill bit will
The predeterminated position of PCB substrate on work top bores the slot of strip.
Above-mentioned manipulator 130 is controlled by above-mentioned first control module 140, specifically, above-mentioned first control module 140 to
Control above-mentioned manipulator 130 by above-mentioned molding machine 110 and complete processing PCB substrate move to above-mentioned hole punched device
On 120.
In detail, above-mentioned manipulator 130 has placement unit, lifting unit and horizontal displacement unit, above-mentioned crawl list
Member is to capture target PCB substrate, and above-mentioned lifting unit is to make the PCB substrate being crawled be moved in vertical direction, above-mentioned water
Flat displacement unit is moving in the horizontal direction the PCB substrate being crawled.
In addition to the above, which can also include steering unit to above-mentioned manipulator 130, to control quilt
The PCB substrate of crawl turns to.
Above-mentioned manipulator 130 drives work by hydraulic way.Above-mentioned robot work can also be driven by cylinder, this
Invention is not construed as limiting this.
Above-mentioned first control module 140 is controlling the manipulator 130 will be on molding machine and the PCB that processes
Substrate is moved on the hole punched device.
Above-mentioned carrying platform 150 is set to the side of the hole punched device 120, and second control module 160 is controlling
The manipulator 130 will be on the hole punched device 120 and the PCB substrate that processes is moved on the carrying platform 150.
The side of above-mentioned carrying platform 150 has adjustable baffle plate, and the controllable register is to according to the PCB substrate carried
Size, adjust the position of the adjustable baffle plate.In present embodiment, above-mentioned carrying platform 150 is square structure.
Above-mentioned third control module 170 fills for the PCB substrate being located on the carrying platform to be controlled to move to the molding
It puts on 110, the molding machine 110 carries out edging processing to the PCB substrate.
First control module, the second control module or third control module have institute's microcontroller processing chip.
Above-mentioned full-automatic PCB substrate processing system 100 utilizes the first control module, the second control module and third control mould
Block cooperative mechanical hand makes PCB substrate be automatically processed on the work table of different types, reduces human cost, also keeps away
The problem of having exempted from the plate face scuffing of PCB substrate,
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of full-automatic PCB substrate processing system, which is characterized in that including：
Molding machine, PCB substrate is cut into preset shape；
Hole punched device, in the predeterminated position punching of PCB substrate；
Manipulator and the first control module, first control module to control the manipulator will be located at molding machine on simultaneously
The PCB substrate processed is moved on the hole punched device；
Carrying platform is set to the side of the hole punched device；
Second control module, to control the manipulator will be on the hole punched device and the PCB substrate that processes moves to
The carrying platform；
Third control module, for the PCB substrate being located on the carrying platform to be controlled to move to the molding machine, the molding
Device carries out edging processing to the PCB substrate.
2. full-automatic PCB substrate processing system according to claim 1, which is characterized in that the side of the carrying platform
With adjustable baffle plate, to the size according to the PCB substrate carried, the position of the adjustable baffle plate is adjusted.
3. full-automatic PCB substrate processing system according to claim 2, which is characterized in that the carrying platform is square
Structure.
4. full-automatic PCB substrate processing system according to claim 1, which is characterized in that the manipulator has crawl
Unit, lifting unit and horizontal displacement unit, the placement unit to capture target PCB substrate, the lifting unit to
The PCB substrate being crawled is made to be moved in vertical direction, the horizontal displacement unit is to the PCB substrate that makes to be crawled in level side
To movement.
5. full-automatic PCB substrate processing system according to claim 4, which is characterized in that the manipulator, which further includes, to be turned
To unit, the PCB substrate being crawled to be controlled to turn to.
6. full-automatic PCB substrate processing system according to claim 4, which is characterized in that the manipulator passes through hydraulic pressure
Mode drives work.
7. full-automatic PCB substrate processing system according to claim 4, which is characterized in that the manipulator passes through degassing
Cylinder drives.
8. full-automatic PCB substrate processing system according to claim 1, which is characterized in that first control module,
Two control modules or third control module have institute's microcontroller processing chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007542.XA CN108174517A (en) | 2018-01-04 | 2018-01-04 | Full-automatic PCB substrate processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007542.XA CN108174517A (en) | 2018-01-04 | 2018-01-04 | Full-automatic PCB substrate processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108174517A true CN108174517A (en) | 2018-06-15 |
Family
ID=62517465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810007542.XA Pending CN108174517A (en) | 2018-01-04 | 2018-01-04 | Full-automatic PCB substrate processing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108174517A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184638A (en) * | 1989-12-11 | 1991-08-12 | Ono Sokki Co Ltd | Method and apparatus for automatic punching |
| TWM254889U (en) * | 2004-03-19 | 2005-01-01 | Eiso Entpr Co Ltd | Structure of heat dissipation type circuit board |
| CN202540020U (en) * | 2012-02-08 | 2012-11-21 | 深圳市大族激光科技股份有限公司 | Mobile plate shaper loading device and PCB (Printed Circuit Board) drilling equipment |
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN106040534A (en) * | 2016-07-29 | 2016-10-26 | 意力(广州)电子科技有限公司 | Automatic glue sealing device with fully-automatic linear mechanical hand |
| CN106332475A (en) * | 2016-08-30 | 2017-01-11 | 江西景旺精密电路有限公司 | Manufacturing method for depth-control stepped metalized blind groove PCB |
| CN207869517U (en) * | 2018-01-04 | 2018-09-14 | 苏州统硕科技有限公司 | Full-automatic PCB substrate processing system |
-
2018
- 2018-01-04 CN CN201810007542.XA patent/CN108174517A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184638A (en) * | 1989-12-11 | 1991-08-12 | Ono Sokki Co Ltd | Method and apparatus for automatic punching |
| TWM254889U (en) * | 2004-03-19 | 2005-01-01 | Eiso Entpr Co Ltd | Structure of heat dissipation type circuit board |
| CN202540020U (en) * | 2012-02-08 | 2012-11-21 | 深圳市大族激光科技股份有限公司 | Mobile plate shaper loading device and PCB (Printed Circuit Board) drilling equipment |
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN106040534A (en) * | 2016-07-29 | 2016-10-26 | 意力(广州)电子科技有限公司 | Automatic glue sealing device with fully-automatic linear mechanical hand |
| CN106332475A (en) * | 2016-08-30 | 2017-01-11 | 江西景旺精密电路有限公司 | Manufacturing method for depth-control stepped metalized blind groove PCB |
| CN207869517U (en) * | 2018-01-04 | 2018-09-14 | 苏州统硕科技有限公司 | Full-automatic PCB substrate processing system |
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