JPH05226412A - Outer lead bonding method and device therefor - Google Patents

Abstract

PURPOSE:To position the outer lead of a TAB part at a mounting position in a highly precise manner. CONSTITUTION:The bottom force 1, having a lead forming surface 1a in the inner part of a punched-out hole 5a, and a recessed part 2a, where a chip part 7a will be housed on the lower end part, are provided. The lower end part is inserted into the punched-out hole 5a, a TAB tape 6 is punched out, the first top force 2, on which a TAB part 7 and its outer lead 7 will be formed, and a recessed part 4a, where the TAB part 7 will be housed on the lower end part, are provided. At the same time, the second top-force 3, having a lead-forming part 3a with which the outer lead 7b is pressed to the lead-forming surface 1a, and an adsorbing means 4, which adsorbs the TAB part 7 and having the aperture 4c of an air inlet port on the recessed part of the second top force 3, are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer lead bonding technique in a process of mounting an electronic component on a circuit board, and more particularly to a TAB (Tape Automated).
Bonding) An outer lead bonding method and apparatus for forming and bonding outer leads of a component.

[0002]

2. Description of the Related Art In a mounting process of mounting a chip component such as an IC or an LSI on an electronic device, a TAB technique has recently been adopted in which a TAB package is formed and outer leads are bonded to a circuit board.

In the TAB package, usually, an inner lead is formed on a TAB tape which is a film carrier tape, a chip component having bumps on the inner lead is inner lead bonded, and an outer lead is formed on the other end. Then, after molding the chip component, the outer lead is formed and the outer lead is cut by punching to form a TAB component. This TAB component is mounted by outer lead bonding to a printed circuit board of an electronic device.

As an example of an apparatus used for this outer lead bonding, an outer lead bonding apparatus shown in FIGS. 4 and 5 is known.

In FIG. 4, reference numeral 9 is a lower mold having a substantially trapezoidal cross section, and the taper surface is a lead forming surface 9a.
The lower die 9 is loosely inserted into the punching hole 10a of the guide member 10. It should be noted that this guide member 10 is capable of projecting and retracting in the upper part of the lower mold 9 and is also movable in the horizontal direction.

Reference numeral 11 is an upper die, and a chip part 7 is provided at the end.
A lead forming portion 11a which forms a recess 11b having a diameter substantially larger than the outer diameter of a and contacts the lead forming surface 9a of the lower mold 9.
Is provided. The upper mold 11 is fixed to a movable table and is vertically moved by a cylinder.

Reference numeral 12 is a suction nozzle having an opening of an intake hole formed on the lower end surface thereof, which is configured to suck the cut-formed TAB component 7 and move it to the mounting position.

Now, a method for performing outer lead bonding by the outer lead bonding apparatus will be described.

First, the upper die 11 is opened and the guide member 10 is moved above the lower die 9 to form a punched hole in the lower die 9, and the chip component 7a is formed on the upper surface of the guide member 10.
The TAB tape 6 attached with is fed. Next, when the upper die 11 is moved downward and inserted into the punching hole, the upper die 11
The TAB tape 6 is punched out by the end portion of. At this time, as shown in FIG. 5, the TAB component 7 and its outer lead 7
b is formed, and the chip component 7a is accommodated in the recess 11b and is pressed against the lower mold 9. Then, the lead forming portion 11a of the upper die 11 abuts on the lead forming surface 9a of the lower die 9 with the outer lead 7b interposed therebetween, and the outer lead 7b
b is formed.

Subsequently, the upper die 11 is opened and the guide member 10 is opened.
Is lowered to expose the TAB component 7 from the lower mold 9.
Then, the lower die 9 is moved to the suction nozzle 12 side and positioned immediately below, and the TAB component 7 is sucked by the suction nozzle 12 and transferred to the printed circuit board side. Thereafter, the outer leads 7b of the TAB component 7 are placed on the printed board, and the solder is irradiated with laser light to melt and bond.

[0011]

In the conventional outer lead bonding described above, after the outer lead 7b is cut and formed, the lower die 9 is moved to the suction nozzle 12 side and the TAB component 7 is removed from the lower die 9 by suction. Since it is taken out, the TAB part 7 may be displaced from the lower mold 9 during this movement. Further, when the molds are exchanged according to the type of the TAB component 7, the centers of the lower mold 9 and the suction nozzle 12 may be misaligned, resulting in improper alignment between the two 9 and 12. Even if such a positional deviation is slight, the suction position and the mounting position of the TAB component 7 are different from each other. Therefore, when the outer lead is soldered to the connecting portion of the printed circuit board, the outer lead which is not connected can be formed. Was left.

The present invention aims to solve the above problems.

[0013]

In the outer lead bonding apparatus of the present invention, in order to achieve the above object,
A lower die having a lead forming surface inside the punching hole and a recess for accommodating the chip component at the lower end are provided, and the lower end is inserted into the punching hole to punch out the TAB tape and the outer lead thereof. And a second upper mold having a recess for accommodating the TAB component at the lower end thereof and a lead molding portion for pressing the outer lead against the lead molding surface. The second upper mold is provided with a suction means for suctioning the TAB component, which has an opening for an intake hole in the recess.

Further, according to the outer lead bonding method of the present invention, the TAB tape on which the chip component is mounted is punched to form the TAB component and the outer lead, and then the TAB component is adsorbed by the adsorption nozzle when forming the outer lead. It is characterized by

[0015]

According to the present invention, when the first upper die is inserted into the punching hole of the lower die, the TAB tape having the chip component mounted thereon is punched to form the TAB component and the outer lead. Further, when the second upper mold is brought into contact with the lower mold with the outer lead sandwiched, the outer lead is formed by the lead molding surface and the lead molding portion.

At this time, the TAB component is sucked by the suction nozzle with the TAB component housed in the recess of the second upper mold. This suction position is the same as the outer lead forming position, and even if the suction nozzle is moved to the mounting position, no positional deviation occurs.
When mounting the B component, the outer lead can be positioned with high accuracy at a predetermined mounting position.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of an outer lead bonding apparatus.

The outer lead bonding apparatus comprises a lower die 1, a first upper die 2 and a second upper die 3, and a suction nozzle 4 is provided on the second upper die 3. TA
The B tape 5 is cut and formed to form the outer leads 7b of the TAB component 7.

In the TAB tape 6, a large number of punched holes are formed in the film carrier tape formed in the previous step, and ICs or LSIs are formed through bumps on inner leads extending inward from the punched holes. Chip parts such as 7a
Is connected.

As shown in FIG. 1, the lower mold 1 has a substantially trapezoidal cross section and a taper surface serving as a lead molding surface 1a. Then, a recess 1b having a diameter substantially larger than the outer diameter of the chip component 6a is formed on the upper surface so that the chip component 6a can be accommodated. The lower mold 1 is loosely inserted into the punching hole 5a of the guide member 5. The guide member 5 is
The lower mold 1 can be freely moved in and out of the upper part of the lower mold 1 and is mounted on a movable table. The movable table and the lower mold 1 are moved back and forth in the horizontal direction by a cylinder so as to reciprocate between the first upper mold 2 and the second upper mold 3.

The first upper mold 2 is for punching out the TAB tape 6, and has a recess 2a formed in the lower surface for accommodating the chip component 7a. The first upper mold 2 is fixed to the shaft of the cylinder, and is moved up and down by driving the cylinder to punch the TAB tape 6 and
The outer lead 7b of the AB component 7 is formed.

As shown in FIG. 2, the lower end of the second upper mold 3 is substantially concave, and the inner peripheral surface thereof is formed in the same shape as the lead molding surface 1a of the lower mold 1 to form a lead molding portion 3a. .. A hollow hole 3b for attaching the suction nozzle 4 is formed in the center of the second upper mold 3. The second upper mold 3 is also fixed to the shaft of the cylinder, moves up and down by driving the cylinder, and presses the end portion of the outer lead 7b cut by the punching to the lower mold 1 side to form. It is like this.

The suction nozzle 4 transfers the TAB component 7, and has a recess 4a on the lower surface thereof capable of accommodating the chip component 7a.
Is formed. In addition, the intake hole 4 is provided at the center of the recess 4a.
The opening 4c of b is provided. The intake hole 4b communicates with a vacuum device, and is configured to adsorb the TAB component 7 and hold it in the recess 4a when the vacuum device is operated.

Next, the outer lead bonding method will be described.

First, the lower mold 1 is attached to the lower side of the first upper mold 2.
Is moved, the first upper mold 2 is opened as shown in FIG. 1, and the guide member 5 of the lower mold 2 is moved upward to form the punching hole 5a. Then, the TAB tape 6 having the chip component 7a mounted thereon is fed between the guide member 5 and the first upper mold 2.

Next, when the first upper mold 2 is moved downward to the lower mold 5, the lower end is inserted into the punching hole 5a with the chip component 7a accommodated in the recess 2a, and the TAB tape 6 is formed.
Is punched out. At this time, the outer lead 7a of the TAB component 7 is formed, and the mold of the chip component 7a is placed in the recess 1b and placed on the lower mold 1.

Subsequently, the lower mold 1 is moved to a position right below the second upper mold 3. At this time, since the TAB component 7 is held in the punching hole 5a, no positional deviation occurs during movement. Then, when the second upper mold 3 is moved downward, the outer lead 7b is pressed by the lead forming portion 3a and pressed against the lead forming surface 1a to be formed. Here, when the vacuum device is operated, TA
When the B component 7 is sucked by the suction nozzle 4, the suction nozzle 4
The TAB component 7 is housed and held in the recess 4a.

After this, the second upper mold 3 is transferred to the printed board side, which is the next step. At this time, since the TAB component 7 is not displaced, the suction position and the mounting target position are the same. Therefore, the TAB component 7 is mounted on the printed circuit board.
When the outer leads 7b of the above are placed and, for example, solder is irradiated with laser light to melt and bond, the outer leads 7b
The problem of poor connection in b is avoided.

FIG. 3 is a schematic block diagram showing another embodiment.

The outer lead bonding apparatus of this embodiment is provided with a carrier tape 8 and its basic construction is substantially the same as that of the above embodiment.

The carrier tape 8 has a number of recesses 8a formed in the lengthwise direction, and the TAB components 7 before forming are accommodated in the recesses 8a.

For outer lead bonding, first, the TAB tape 6 is cut in the previous step, and then the TAB component 7 having the outer leads 7b is placed in the recess 8a of the carrier tape 8.

Next, the carrier tape 8 is attached to the lower mold 1.
Then, in this state, the TAB component 7 is taken out from the carrier tape 8 by moving it to the second upper mold 3 side.

After this, the second embodiment is the same as the above embodiment, and the second
The upper die 3 is moved downward and the lead forming portion 3a is used to move the TAB.
At the same time as the lead forming of the component 7, the suction nozzle 4
Adsorb with. As a result, high-accuracy positioning is possible as in the above case. In particular, there is an advantage that the first upper mold 2 can be omitted and the process can be simplified.

[0036]

As described above, according to the present invention, the outer lead of the TAB component is molded, and at the same time, the TAB component is sucked by the suction nozzle. Therefore, there is no displacement between the suction position and the mounting position of the TAB component. Therefore, it is possible to almost eliminate the positional deviation and the like which have occurred when the mold is replaced or when the mold is moved to the mounting position as in the related art.

Therefore, when the TAB component is mounted on the circuit board or the like, the outer lead can be positioned and connected at a predetermined mounting position with high precision, and the connection failure of the outer lead can be prevented.

[Brief description of drawings]

FIG. 1 is a sectional view of an outer lead bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an outer lead bonding method according to an embodiment of the present invention.

FIG. 3 is a sectional view showing another embodiment of the outer lead bonding apparatus.

FIG. 4 is a sectional view of a conventional outer lead bonding apparatus.

FIG. 5 is an explanatory diagram showing a conventional outer lead bonding method.

[Explanation of symbols]

 1 Lower Mold 1a Lead Molding Surface 2 First Upper Mold 3 Second Upper Mold 3a Lead Forming Part 4 Adsorption Means 6 TAB Tape 7 TAB Parts

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Satoshi Onakata 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Takahiko Murata, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. An outer lead bonding method characterized in that after a TAB tape on which a chip component is mounted is punched out to form a TAB component and its outer lead, when forming the outer lead, the TAB component is adsorbed by an adsorption nozzle. .. 2. A lower die having a lead forming surface inside the punching hole, and a recess for accommodating a chip component at the lower end, the lower end being inserted into the punching hole to punch the TAB tape. A first upper mold for forming a TAB component and its outer lead, a recess for accommodating the TAB component at the lower end, and a lead forming part for pressing the outer lead against the lead forming surface. The upper die and the second upper die have an opening for the intake hole in the recess,
An outer lead bonding apparatus having a suction means for sucking the TAB component.