JP3157249B2 - Semiconductor device package and mounting method - Google Patents

Abstract

PURPOSE:To prevent enlargement of a printed board at the time of final packaging, and restrain the cost increase of the printed board. CONSTITUTION:A square device hole 6 is formed at the central part of a base film 2. Inner leads 8a protrude in the device hole 6 and are bent upward, with which a small-sized IC chip 16 is so connected that the surface faces downward. On the outside of the device hole 6, four device holes 10 are formed so as to surround the device hole 6. Inner leads 12a protrude in the device holes 10 and are bent downward. A large-sized IC chip 16 is so connected with the inner leads 12a that the surface faces upward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device mounting body and mounting method thereof TAB method using te Pukyaria.

[0002]

2. Description of the Related Art In recent years, semiconductor devices (hereinafter referred to as ICs) have been developed.
Have been diversified in specifications. If the IC1 chip is provided with various functions to cope with the diversification of specifications, the IC chip inevitably becomes large, and accordingly, the yield decreases. On the other hand, IC
There is also a strong need for miniaturization. Therefore, an IC having a certain function alone is used as one chip, and an IC having another function is provided.
Is used alone to maintain the yield in the IC manufacturing process at a high level, and a plurality of IC chips are mounted at the mounting stage.

[0003] The current mainstream IC mounting method is also called SMT (surface mounting), and the IC is surface mounted on a printed board such as a glass epoxy board. In this case, since the IC chip is arranged on the plane of the printed circuit board, the printed circuit board is large and large, and the cost is high. TAB (Tape Automated Bondi)
ng) method is used. In the TAB system, generally IC
A tape carrier according to the chip is manufactured, and only one IC chip is mounted on one tape carrier.

In order that a common tape carrier can be used for IC chips having different chip sizes, inner lead groups for a plurality of IC chips are provided, and inner leads corresponding to the IC chips to be mounted are provided. There is an example in which tape carriers are shared by using a group (see Japanese Patent Application Laid-Open No. 3-85752). Even in this tape carrier, only one IC chip is mounted on one tape carrier.

[0005]

In the conventional mounting of IC chips, the IC chips can be arranged only on the plane of the printed circuit board, so that the printed circuit board is large and large. Therefore, a first object of the present invention is to provide a mounting body using a tape carrier that prevents the printed circuit board from becoming too large at the time of final mounting and prevents the printed circuit board from increasing in cost.
To provide. A second object of the present invention is to provide a mounting method using the tape carrier.

[0006]

In the tape carrier used in the present invention , at least one area for one IC chip defined by a device hole from which an inner lead connected to the IC chip protrudes has a different size. One IC
It overlaps with the chip area. In the mounting method of the present invention, the inner leads in the overlapping area of the tape carrier are bent in opposite directions to the base film surface (forming step), and first, the corresponding IC chip is inner-bonded to the inner leads for the small chips. , you inner bonding in the direction etc. chip surface which is pushed opposite to the then the small chip IC chips corresponding thereto to the inner leads for a large tip. After mounting the IC chip on Te Pukyaria, by connecting the outer lead of the tape carrier on a printed circuit board,
An IC chip is mounted on a printed circuit board. In the mounting body of the present invention, the inner leads in the overlapping area of the tape carrier are bent in directions opposite to each other with respect to the base film surface, and respective IC chips are mounted in each area. When mounted on the tape carrier, the small chip and the large chip face each other in the overlapping area.

[0007]

1 and 2 show an IC package according to an embodiment. 1 is a plan view, FIG. 2A is a perspective view, and FIG. 2B is a cross-sectional view taken along a line BB in FIG. In FIG. 1, a base film 2 extends vertically, and holes 4 for feeding a tape carrier are formed on both sides thereof. A quadrangular device hole 6 for mounting a small-sized IC chip is formed in the center of the base film 2, and an inner lead 8 a of a small chip lead 8 protrudes from the device hole 6. Outside the device hole 6, four device holes 10 for mounting a large-sized IC chip are formed so as to surround the device hole 6, and the device hole 10 is provided with a lead 12 for a large-sized IC chip. The inner lead 12a protrudes. Further outside the device hole 10, four cutting holes 14 are provided for mounting the IC chip on the tape carrier and then cutting and mounting the IC chip on a printed circuit board. Reference numeral 12 denotes an outer lead connected to the printed circuit board.

In FIG. 2, the inner leads 8a for the small-sized IC chips are subjected to a forming process bent upward, and the inner leads 12a for the large-sized IC chips are bent in the opposite direction to the inner leads 8a. The formed forming process is performed. A small-sized IC chip 16 is connected to the inner lead 8a with the front surface (the surface on which the pad is formed) facing down, and the large-sized IC chip 18 is connected to the inner lead 8a with the front surface facing up. It is connected to the lead 12a. As shown in FIG. 2, the inner leads 8a and 12a
Are formed by being bent in opposite directions with the base film surface interposed therebetween so that the mounted IC chips 16 and 18 do not come into contact with each other, and one of the IC chips 16 and 18 is formed.
This is to prevent the C chip from contacting the inner lead for the other IC chip.

As shown in FIG. 1 and FIG.
Are connected to the inner leads 8a and 12a, the IC chips 16 and 18 are sealed with a resin, an electric test is performed, and then the base film 2 is cut at the position of the hole 14.
Connect the outer leads to the printed circuit board.

Next, a mounting method of the embodiment shown in FIGS. 1 and 2 will be described with reference to FIG. (A) The inner lead 8a protruding into the device hole 6 for the small-sized IC chip is subjected to a forming process in which the inner lead 8a is bent upward in FIG.
In order to perform a forming process for bending the 0 inner lead 12a downward, the fixed base 20 for the inner lead 8a is disposed on the upper side, and the movable punch 22 is disposed on the lower side. Further, the fixed base 24 for the large chip is arranged on the lower side, and the movable punch 26 for the large chip is arranged on the upper side. Movable punch 2
By moving 2 and 26 in the direction of the arrow, the inner lead 8a is bent upward and the inner lead 12a is bent.
Forming in which a is bent downward is performed.

FIG. 2B shows a state in which the inner leads 8a and 12a are formed. (C) The tape carrier is arranged so that the inner leads 8a are on the lower side, and the inner lead bonding is performed on the small-sized IC chip 16 with the surface on which the bonding pads are provided facing upward. At this time, the bonding tool used here has a conventional crimping surface having a square shape.

(D) The tape carrier is inverted so that the inner lead 12a for the large chip is on the lower side, and the large-sized IC chip 18 connected to the inner lead 12a is faced upward to perform inner lead bonding. At this time, since the small-sized IC chip 16 has already been bonded, a bonding tool having a shape avoiding the IC chip 16 is used as the bonding tool. As a result, the package in the state shown in FIGS. 1 and 2 is obtained.

As shown in the embodiments of FIGS. 1 and 2, the present invention has a structure in which one small-sized IC chip 16 and one large-sized IC chip 18 are mounted so as to face each other. For example, as shown in FIG. 4 , as shown in FIG. 4 , two small IC chips 16 a
And 16b may be inner-bonded so as to face each other to the respective inner leads formed in opposite directions to the surface of the base film 2 of the tape carrier.

[0014]

According to the present invention, since two or more IC chips are bonded to one area of the tape carrier in a state where the respective areas overlap each other, the area of the tape carrier can be small, and the cost of the tape carrier can be reduced. descend.
By mounting two or more chips in one area, a plurality of functions can be provided in the same area, and the size of a device equipped with an IC can be reduced. If a high-value-added, high-performance IC is to be manufactured on a single chip, the chip size will increase, the yield will decrease, the cost will increase, and the supply will be unstable. If implemented according to the invention, it is not necessary to forcibly integrate high-performance ICs into one chip,
Since it may be manufactured as a chip, advantages such as an improvement in manufacturing yield, a reduction in cost, and a stable supply are obtained.

[Brief description of the drawings]

FIG. 1 is a plan view showing a package according to an embodiment.

FIG. 2 is a view showing the same embodiment, (A) is a perspective view,
FIG. 2B is a cross-sectional view taken along a line BB in FIG. 1.

FIG. 3 is a process sectional view showing a mounting method of the embodiment of FIG. 1;

FIG. 4 is a cross-sectional view showing a package according to another embodiment.

[Explanation of symbols]

 2 Base film of tape carrier 6 Device hole for small chip 8a, 12a Inner lead 8 Device hole for large chip 16, 16a, 16b, 18 IC chip

Claims (2)

(57) [Claims] An area for one semiconductor device chip defined by a device hole from which an inner lead connected to the semiconductor device chip protrudes overlaps with at least one area for another semiconductor device chip having a different size. A semiconductor device package wherein inner leads in overlapping regions of the tape carrier are bent in opposite directions to a base film surface, and respective semiconductor device chips are mounted in each region. 2. A region for one semiconductor device chip defined by a device hole from which an inner lead connected to the semiconductor device chip protrudes overlaps with at least one region for another semiconductor device chip having a different size. Forming step of bending the inner leads in the overlapping region of the tape carrier in the opposite directions to the base film surface, inner bonding the corresponding semiconductor device chips to the inner leads for the small chips, and then forming the large chips A step of inner bonding the semiconductor device chip corresponding to the inner lead to a direction in which the chip surface faces the small chip.