JPH10163408A - Manufacturing method for bga-type semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To separate a BGA(ball grid array) type semiconductor device with a positional accuracy without entering of the separated semiconductor device between punches, and simplifying a following step. SOLUTION: In this method, when an insulating film in which plural BGA type semiconductor devices are arranged at a predetermined distance is to be individually separated, it is separated under the condition of the semiconductor devices being sucked at a suction hole 6 provided at a stripper and being positioned. After the separation the separated semiconductor devices are held under the condition of being sucked and lifted at the time when a punch 1 is lifted from the separated position and when a product is to be taken out under a press mold, the suction is released.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a BGA type semiconductor device.

[0002]

2. Description of the Related Art In recent years, high integration and high integration of semiconductor devices have been demanded along with high performance and multifunctional electronic devices. A semiconductor chip having bonding pads on all four sides is mounted on an insulating film, and solder balls connected to the bonding pads and serving as electrical connection terminals with the outside are arranged in a grid in a so-called BGA (ball grid array). ) Has been proposed.

[0003] Incidentally, since this BGA type semiconductor device is formed based on one insulating film in which a plurality of wiring patterns are formed in a grid, after mounting a plurality of chips and further completing a resin sealing step, In addition, a cutting operation for forming individual products is performed by using a punching method.

As a conventional dividing method by the punching method, there is a method as shown in FIGS. However, the dividing method shown in FIG. 2 has a problem that it is not possible to secure a sufficient strength of the cutting edge portion W of the punch 1 and it is difficult to shape the punch 1 itself. In the other dividing method shown in FIG. 3, the semiconductor device 2 is
The semiconductor device 2 must be turned over again so that the solder ball 3 side is lower when the tray is stored, since the semiconductor device 2 is cut off with the formation surface facing upward and the resin sealing portion 4 facing downward. There is a problem that the number of processes increases.

[0005]

Therefore, as a method for solving the above-mentioned problem, a cutting method using a punch having a shape as shown in FIG. For this reason, there has been a problem that the dividing position is shifted at the time of dividing, or the divided semiconductor device 2 enters between the punches 1 as shown in FIG.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and when an insulating film provided with a plurality of BGA type semiconductor devices by punching is cut to be taken out into individual BGA type semiconductor devices, the insulating film is shifted to a cutting position. It is an object of the present invention to provide a method of manufacturing a BGA type semiconductor device in which the semiconductor device does not occur or the divided semiconductor device does not enter between the punches, and the post-process can be simplified.

[0007]

The gist of the present invention to achieve the above object is to provide a semiconductor device having a semiconductor chip and a wiring pattern, and a plurality of solders connected to the wiring pattern and protruding and electrically connecting to the outside. A method of manufacturing a BGA type semiconductor device comprising an insulating film having balls, connecting the wiring pattern to a bonding pad of the semiconductor chip, and sealing a surface side of the semiconductor chip with a resin. When the insulating film, in which a plurality of semiconductor devices are arranged at predetermined intervals, is individually cut by a punching method using a press die, the semiconductor device is sucked and positioned by suction holes provided in a stripper. When the punch rises from the cutting position after the cutting, the separated semiconductor device is lifted and held while being sucked. And, when taking out the product downward of the press die, characterized in that solving the adsorption.

Further, the semiconductor device adsorbed on the stripper is dropped on the product take-out plate by releasing the suction force.

Further, the semiconductor device dropped into the product take-out plate is further dropped into the tray and stored by opening a shutter of the product take-out plate.

[0010]

According to the present invention, when the semiconductor device is individually cut from the insulating film by the punching method, the semiconductor device is fixed and positioned by the suction hole provided in the stripper. The inserted semiconductor device does not enter between the punches.

Further, by operating a suction force generated through a suction hole formed in the stripper, the divided semiconductor device can be adsorbed to the stripper and dropped if necessary. By moving the product take-out plate back and forth below the press die, the tray storage of the semiconductor device is greatly facilitated.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. The same parts as those in the conventional example are denoted by the same reference numerals. FIG. 1A is a view showing a punching method according to the present invention, in which an insulating film F having a semiconductor chip mounted on one side and sealed with a resin and the other side provided with solder balls as connection terminals is provided. Cut by punch 1. At this time, the semiconductor device 2 is sucked and fixed through the suction hole 6 provided in the stripper 5, so that the semiconductor device 2 to be divided is divided with high positional accuracy and does not enter between the punches 1. In addition, a suction device (not shown) is connected to the suction hole 6.

Next, as shown in FIG.
The separated semiconductor device 2 is lifted with the rise of the punch 1 while being adsorbed on the stripper 5, by the suction force B generated through the suction hole 6 provided in the above, and becomes a receiving tray as shown in FIG. The take-out plate 7 advances below the press die and is set on the lower surface side of the semiconductor device 2. Then, when the suction force B is released, the semiconductor device 2 removes the product removal plate 7 from the stripper 5.
To a predetermined position. Thereafter, the product take-out plate 7 on which the semiconductor device 2 is placed is set on the upper surface side of the tray 8, and the shutter portion S of the product take-out plate 7 on which the semiconductor device 2 is placed is opened in the horizontal direction. 8 and is stored in a falling position. In the present invention, the above-described operation is obtained, and the divided semiconductor device as in the related art can be easily stored in the tray without having to be inverted, so that an extra step is not required.

In this embodiment, the suction hole is formed at the center of the stripper. However, the present invention is not limited to this, and the suction hole may be formed at any contact surface of the semiconductor device. 2, 3, 4 depending on conditions such as the size of the device
You can select

[0015]

According to the present invention, as is apparent from the above description, since the semiconductor device is fixed by the stripper, the semiconductor device is divided with high positional accuracy and does not enter between the punches. Also, with the suction hole provided in the stripper,
The separated semiconductor device can be adsorbed, and the ability to store the semiconductor device in the tray can be significantly improved by operating the suction force.

[Brief description of the drawings]

FIG. 1 is a diagram showing a manufacturing process according to the present invention.

FIG. 2 shows a prior art punching method.

FIG. 3 is a diagram showing a punching method according to the prior art.

FIG. 3 is a diagram showing a punching method according to the prior art.

[Explanation of symbols]

 1, punch 2, semiconductor device 3, solder ball 4, resin sealing part 5, stripper 6, suction hole 7, product take-out plate

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[Procedure amendment]

[Submission date] January 23, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a diagram showing a manufacturing process according to the present invention.

FIG. 2 shows a prior art punching method.

FIG. 3 is a diagram showing a punching method according to the prior art.

FIG. 4 is a diagram showing a punching method according to the related art.

Claims (3)

[Claims] 1. An insulating film comprising: a semiconductor chip and a wiring pattern; and an insulating film including a plurality of solder balls connected to the wiring pattern and protruding to make electrical connection with the outside. In a method of manufacturing a BGA type semiconductor device in which the wiring pattern is connected to a bonding pad of a chip and a surface side of the semiconductor chip is resin-sealed, a plurality of the BGA type semiconductor devices are arranged at predetermined intervals. When the insulating film is individually cut by a punching method using a press die, the semiconductor device is cut while being positioned while being sucked and positioned by a suction hole provided in a stripper, and after the cut, the punch is moved from the cut position. When ascending, the separated semiconductor device is lifted and held while adsorbing the semiconductor device, and when the product is taken out below the press die,
A method of manufacturing a BGA type semiconductor device, wherein the adsorption is released. 2. The method for manufacturing a BGA type semiconductor device according to claim 1, wherein said semiconductor device sucked by said stripper drops and moves to a product take-out plate by releasing said suction force. 3. The BGA type device according to claim 1, wherein the semiconductor device dropped onto the product take-out plate is further dropped onto the tray and stored by opening a shutter of the product take-out plate. A method for manufacturing a semiconductor device.