JPH10598A - Die device and part feeder using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform punching works for electronic parts at short time intervals by providing a top die having a suction hole formed, which suckingly holds electronic parts punched out in a punching part in the bottom face of the punching part. SOLUTION: A carrier tape 26 is fed to a prescribed position in a die opened state where a top die 13 of a die device 11 is raised. Before the top die 13 punches out TCP from the carrier tape 26 and the top die 13 starts to be lowered, a suction pump 24 is operated by a controller 25 so that a suction force is generated in the suction hole 23 of a punching part 22 of the top die 13. The TCP punched out from the carrier tape 26 is sucked and held by the bottom face of the punching part 22 of the top die 13 entered in a punching hole of the bottom die 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold apparatus for punching electronic components from a carrier and a component supply apparatus using the mold apparatus.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device, there is a process of mounting a TCP (Tape Carrier Package) as an electronic component on a glass substrate constituting a liquid crystal cell. In this mounting step, an electronic component is punched out of a resin tape carrier by a mold device, and the electronic component is supplied to a mount head provided in an index unit. Is temporarily bonded to the substrate via an anisotropic conductive film.

FIG. 4 shows a conventional structure. In the figure, reference numeral 1 denotes a mold device. This mold apparatus 1 has a lower mold 2 and an upper mold 3. The lower mold 2 is driven in the horizontal direction, and the upper mold 3 is driven in the vertical direction.

A carrier tape 4 is supplied between the lower mold 2 and the upper mold 3. Semiconductor chips mounted at a predetermined interval are packaged on the carrier tape 4, and the upper die 3 is driven in a descending direction.
The mounted portion of the semiconductor chip is punched. This is TCP5 as an electronic component.

[0005] T which is punched by the lowering of the upper mold 3
CP5 is held in the lower mold 2. After the punching, when the lower mold 2 moves below the pickup nozzle 6, the pickup nozzle 6 descends and sucks and holds the TCP 5 held by the lower mold 2.

Then, the pickup nozzle 6 rises, is driven in a horizontal direction to a position above the transfer stage 7, and then moves down to transfer the suction-held TCP 5 to the transfer stage.
Hand over to G7.

The delivery stage 7 to which the TCP 5 is supplied is mounted on a mount head 9 provided in the index unit 8.
Move down. Next, the mount head 9 descends, adsorbs the TCP 5 placed on the delivery stage 7, and rises.

When the mount head 9 sucks the TCP 5, the index unit 8 is intermittently driven at a predetermined angle. When the mount head 9 holding the TCP 5 by suction is opposed to the glass substrate at a mounting position (not shown), the mount head 9 is lowered to temporarily press the TCP 5 onto the glass substrate.

By the way, in such a configuration, the TCP 5 punched from the carrier tape 4 is used as the mold device 1.
The lower die 2 is horizontally driven to a predetermined position and delivered to the pickup nozzle 6.

Therefore, the lower die 2 moves to a predetermined position, delivers the punched TCP 5 to the pickup nozzle 6, and then returns to the original position below the upper die 3 by the above-described die apparatus 1. Because punching cannot be performed,
The cycle time was long, and there was a limit to the reduction.

In addition, the punched TCP5 is the lower mold 2
In order to transfer the TCP 5 to the mount head 9, a transfer stage 7 is required.
In other words, the mount head 9 is configured to adsorb and hold the TCP 5 on its lower end surface and mount it on the glass substrate.

Therefore, the TCP 5 sucked and held at the lower end surface of the pickup nozzle 6 from the upper surface of the lower mold 2 is
In order to adsorb the lower end surface of the mount head 9, the delivery stage 7 is necessary. Therefore,
The required configuration of the delivery stage 7 complicates the configuration and control.

[0013]

As described above, conventionally, an electronic component punched by a die apparatus is held in a lower die, and the lower die is moved to deliver the electronic component. Therefore, the next punching could not be performed until the lower mold returned to the original position. For this reason, there is a case where it is not possible to sufficiently reduce the time required for punching out the electronic component by the mold apparatus and then supplying the electronic component to the index unit in the next process.

The present invention has been made in view of the above circumstances, and has as its object to provide a die apparatus capable of performing an electronic component punching operation at a short time interval and a component supply apparatus using the die apparatus. Is to provide.

[0015]

According to the first aspect of the present invention, there is provided a mold apparatus for punching an electronic component from a carrier.
A lower mold having a punched hole, and the carrier is supplied to the upper surface side, and is inserted into the punched hole by being driven toward the lower mold provided above the lower mold, from the carrier. An upper die having a punching portion for punching the electronic component, and an upper die having a suction hole formed on a lower end surface of the punching portion for sucking and holding the electronic component punched by the punching portion. .

According to a second aspect of the present invention, there is provided a component supply apparatus for mounting an electronic component punched from a carrier on a substrate by a mount head, the lower die having a punched hole and supplying the carrier to an upper surface side. And a punched portion that is provided above the lower die and is driven toward the lower die to be inserted into the punched hole and punches out the electronic component from the carrier, and is punched out by the punched portion. A mold apparatus having an upper mold having a suction hole for sucking and holding an electronic component at a lower end surface of the punching portion; and the mold apparatus reciprocally driven between the mold apparatus and the mount head. And a delivery means for receiving an electronic component which is punched out and held by the punching portion of the upper mold and supplies it to the mount head. That.

According to a third aspect of the present invention, in the first or second aspect of the present invention, a suction source for generating a suction force is connected to the suction hole of the upper mold, and the upper metal is connected to the suction source. A control means for generating a suction force in the suction hole before driving the mold to punch out the electronic component from the carrier is connected.

According to the first aspect of the present invention, the electronic component punched from the carrier is sucked and held at the lower end surface of the punched portion of the upper die that has entered the punched hole of the lower die. The electronic component sucked and held on the end face can be received from the punched hole without moving the lower mold.

According to the second aspect of the present invention, the electronic component punched out of the carrier is sucked and held at the lower end surface of the punched portion of the upper die that has entered the punched hole of the lower die, and is delivered to the punched hole. By inserting the means, the electronic component can be received at the upper end face of the delivery means. Thereby, the electronic component can be delivered from the upper end face of the delivery means to the lower end face of the mount head.

According to the third aspect of the present invention, in the first or second aspect of the present invention, the suction hole of the punching portion of the upper die is used to generate a suction force before punching the electronic component from the carrier. The removed electronic component can be reliably sucked and held by the punched portion.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 3 shows a component supply device according to the present invention. The component supply device includes a mold device 11. The mold apparatus 11 includes a lower mold 12 and the lower mold 1.
2 and an upper mold 13 opposed to the upper mold 13. The lower mold 12 is mounted on the upper surface of a base plate 14 of a press in which the mold apparatus 11 is incorporated.

As shown in FIG. 1 and FIG.
A punched hole 16 is formed at the center of the hole. The punched hole 16 is formed between the lower mold 12 and the base plate 14.
And is continuous with the dropout hole 17 formed. That is, the punched hole 16 is inserted into the punched hole 17
Communicates with the lower surface of the base plate 14 via

The upper mold 13 is attached to the lower surface of a movable body 21 which is vertically driven by a drive mechanism (not shown) of the press device. A punching portion 22 that projects into the punching hole 16 of the lower die 12 is formed in the center of the lower end surface of the upper die 13.

A suction hole 23 is formed in the upper mold 13. One end of the suction hole 23 is opened at the lower end surface of the punching portion 22, and the other end is provided with a suction pump 24 as a suction source.
Are connected via a flexible tube (not shown). The suction pump 24 is electrically connected to a control device 25 as control means, and is driven and controlled by the control device 25.

In this embodiment, before the upper mold 13 is driven downward to punch out the TCP 27 as an electronic component from the carrier tape 26 supplied to the upper surface side of the lower mold 12, the control device 25 By the suction pump 24
Is activated.

Therefore, the TCP 27 is punched out of the carrier tape 26 by the lower die 12 and the upper die 13 after a suction force is generated in the suction hole 23. Punching portion 22 of mold 13
Will be held by suction. That is, TCP 27
The lower end surface of the punching portion 22 of the upper die 13 that has entered the punching hole 16 of the lower die 12 is adsorbed and held.

A plurality of positioning pins 31 project from the lower end surface of the upper mold 13 and a stripper 32.
Are elastically displaceable by a spring 33. The stripper 32 has a first through hole 34 through which the positioning pin 31 is slidably inserted, and a second through hole 35 through which the punched portion 22 is slidably inserted.

When the upper mold 13 descends, the positioning pins 31 enter the positioning holes 36 formed in the upper surface of the lower mold 12 to form the lower mold 12 and the upper mold 13.
Is positioned.

An index unit 42 that is intermittently driven to rotate by a predetermined angle, in this embodiment, 90 degrees, by a drive source 41 is provided on the side of the mold apparatus 11. The index unit 42 is provided with four guides 43 at 90-degree intervals, and a mount head 44 is attached to each guide 43 so as to be vertically slidable.

A mounting plate 45 is provided horizontally on the upper end surface of each guide 43, and a driving cylinder 46 is provided on the mounting plate 45 with its axis perpendicular. This drive cylinder 4
The sixth rod 46a is connected to the mount head 44. Therefore, when the drive cylinder 46 operates, the mount head 44 is driven up and down along the guide 43.

The mount head 44 has a suction hole (not shown) opened at the lower end thereof.
The suction hole is also connected to a suction pump (not shown), and a suction force is generated by operating the suction pump.

The mold unit 11 and the index unit 4
2, a table 51 is provided.
1 is provided with a movable body 53 reciprocally driven by a drive source 52. The movable body 53 is provided with a Z drive source 54. The Z driving source 54 is provided with a pickup nozzle 55, and the pickup nozzle 55 is driven by the Z driving source 54 in a vertical direction (vertical direction) orthogonal to the moving direction (horizontal direction) of the movable body 53. Has become.

The pickup nozzle 55 has an upper end surface formed on a suction surface 55a, and a suction force (not shown) is generated on the suction surface 55a. As a result, the pickup nozzle 55 causes the TCP 27 held by the suction portion 22 of the upper mold 13 to be held by the suction surface 55a as described later.
And the TCP 27 is transferred to the mount head 44.
Can be passed to A position where the TCP 27 is transferred to the mount head 44 of the index unit 42 is set as a transfer position.

The T transferred to the mount head 44
CP27 is a glass substrate 61 of the liquid crystal cell at a mounting position which is circumferentially separated from the transfer position by a predetermined angle.
Is temporarily crimped.

In the mounting position, the glass substrate 6
1, a mounting table 62 is provided. The mounting table 62 is driven in the X and Y directions (horizontal direction) by an X table 63 and a Y table 64, and reaches the mounting position.
The glass substrate 61 is positioned below. With the glass substrate 61 positioned, the mount head 44
Is lowered, so that the TC 27 sucked and held by the mount head 44 is temporarily bonded to the glass substrate 61 via an anisotropic conductive film (not shown).

Next, the operation of the component supply device having the above configuration will be described. When the carrier tape 26 is sent to a predetermined position with the upper mold 13 of the mold apparatus 11 raised as shown in FIG. 1, the upper mold 1 is moved as shown in FIG.
3 descends and punches out the TCP 27 from the carrier tape 26.

Before the upper die 13 punches the TCP 27 from the carrier tape 26, in this embodiment, the upper die 13
Before the pressure starts to descend, the suction pump 24 is operated by the control device 25 to generate a suction force in the suction hole 23 of the punching portion 22 of the upper mold 13. Therefore, the TCP 27 punched from the carrier tape 26 is the lower mold 1
The upper die 13 is sucked and held by the lower end face of the punched portion 22 that has entered the second punched hole 16.

When the upper mold 13 has been lowered, the pickup nozzle 55 waiting below the punching hole 16
Is driven in the ascending direction, and the TCP 27 held on the lower end surface of the punched portion 22 is attached to the upper end surface of the TCP 27 by the suction surface 55a.
Abut. At that time, the suction pump 24 stops and the suction force of the suction hole 23 disappears. Instead, the TCP 27 is suction-held by the suction surface 55a of the pickup nozzle 55 where the suction force is generated.

When the pickup nozzle 55 sucks the TCP 27, the pickup nozzle 55 is driven in the downward direction to get out of the dropout hole 17 of the base plate 14, and is then driven in the horizontal direction to move the index unit 42 as shown by a chain line in FIG.
Move below the mount head 44.

When the upper mold 13 transfers the TCP 27 to the pickup nozzle 55, the upper mold 13 is driven in the upward direction. When the upper mold 13 is raised to a predetermined position, the carrier tape 26 is fed by a predetermined size. Then, when the suction pump 24 is operated to generate a suction force in the suction hole 23 of the upper mold 13, the upper mold 13 is driven in the downward direction to punch out the TCP 27 from the carrier tape 26, and this TCP 27 In a state of being held by suction at the lower end surface of the punching section 22.

On the other hand, when the pickup nozzle 55 reaches below the mount head 44, the mount head 44 is driven by the drive cylinder 46 in the downward direction.
The TCP 27 sucked and held by the suction surface 55a at the upper end of the pickup nozzle 55 is received at the lower end surface.

When the pickup nozzle 55 adsorbs the TCP 27 and moves up, the index unit 42 is driven to rotate by 90 degrees. At the same time, the pick-up nozzle 55 returns below the dropout hole 17 of the lower die 12 of the die apparatus 11, and then rises into the punched hole 16 to move the upper die 1.
TCP2 held by suction at the lower end surface of the punching portion 22 of No. 3
After receiving No. 7, the cycle of descending and moving in the direction of the index unit 42 and transferring the TCP 27 to the mount head 44 is repeated.

From the pickup nozzle 55 to TCP2
When the mount head 44 that has received 7 has reached the mounting position, the mount head 44 is driven in the downward direction to temporarily press the TCP 27 onto the glass substrate 61 held on the mounting table 62.

According to the component supply device having such a configuration,
Since the TCP 27 punched out of the carrier tape 26 by the die unit 11 is held by suction at the lower end surface of the punched portion 22 of the upper die 13, if the TCP 27 is delivered to the pickup nozzle 55, the die unit 11 can immediately perform the next punching step.

In other words, the mold device 11 can perform the next punching operation while the pickup nozzle 55 reciprocates between the mold device 11 and the index unit 42. Unlike the method in which the lower die 2 is moved to transfer the TCP 5, the next punching cannot be performed until the lower die 2 returns. Therefore, the cycle time can be shortened accordingly.

Further, the TCP 27 punched out of the carrier tape 26 is held by suction at the lower end face of the punched portion 22 of the upper mold 13, so that the upper end face becomes the suction face 55a.
The TCP 27 can be received from the punched portion 22 by the pickup nozzle 55 described above, and can be delivered to the lower end surface of the mount head 44 of the index unit 42.

That is, by moving the conventional lower mold 2 to T
As in the method of transferring the CP5 to the lower end surface of the mount head 9, the TCP5 held in the lower die 2 is transferred from the pickup nozzle 6 to the transfer stage 7, and is transferred from the transfer stage 7 to the mount head 9. You don't have to give it.

Therefore, according to the present invention, the delivery stage 7 used in the conventional method becomes unnecessary, so that the configuration of the component supply device can be simplified. In addition, since the delivery step by the delivery stage 7 is not required, the cycle time required for punching out the TCP 27 from the carrier tape 26 and delivering it to the mount head 44 can be shortened.

In the above-mentioned embodiment, the TCP punched out of the carrier tape is used as an electronic component. However, the present invention is not limited to this. Any electronic component punched out by a mold device may be used. It is needless to say that the present invention can be applied to a case where a semiconductor device as an electronic component is punched from the lead frame.

[0050]

As described above, according to the first aspect of the present invention, the electronic component punched from the carrier is sucked and held by the lower end face of the punched portion of the upper die that has entered the punched hole of the lower die. Accordingly, the electronic component sucked and held on the lower end surface of the punched portion can be received from the punched hole without moving the lower mold.

Therefore, by using the mold apparatus having the above structure, the punched electronic components can be delivered without interrupting the punching operation, so that the cycle time can be reduced.

According to the second aspect of the present invention, the electronic component punched out of the carrier is sucked and held at the lower end surface of the punched portion of the upper die that has entered the punched hole of the lower die, and is delivered to the punched hole. By inserting the means, the electronic component can be received at the upper end face of the delivery means.

Thus, the electronic component can be transferred from the upper end surface of the delivery means to the lower end surface of the mount head for mounting the electronic component. Since there is no need to provide a delivery stage between the delivery means and the mount head, not only can the configuration of the component supply device be simplified,
It is possible to reduce a cycle time from punching out and mounting electronic components from the carrier.

According to the third aspect of the present invention, in the first or second aspect of the present invention, the suction hole of the punching portion of the upper mold generates a suction force before punching the electronic component from the carrier. The removed electronic component can be reliably sucked and held by the punched portion.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a state in which an upper mold of a mold apparatus according to an embodiment of the present invention is opened.

FIG. 2 is a configuration diagram showing a state in which an upper mold of the mold apparatus is closed.

FIG. 3 is a schematic diagram of the entire configuration of the component supply device.

FIG. 4 is a schematic diagram of the entire configuration of a conventional component supply device.

[Explanation of symbols]

 11 mold apparatus, 12 lower mold, 13 upper mold, 16 punched hole, 22 punched part, 23 suction hole, 24 suction pump (suction source), 25 control device (control means) , 44 ... Mount head.

Claims (3)

[Claims] 1. A die apparatus for punching an electronic component from a carrier, comprising: a lower die having a punched hole, the upper side being supplied with the carrier; and a lower die provided above the lower die. Having a punching portion that is inserted into the punching hole by being driven toward and punches out the electronic component from the carrier,
A die having a suction hole formed at a lower end surface of the punched portion for sucking and holding the electronic component punched by the punched portion. 2. A component supply device for mounting an electronic component punched from a carrier on a substrate by a mount head, comprising: a lower die having a punched hole, the upper die being supplied with the carrier; and a lower die. And a punching portion which is inserted into the punching hole by being driven toward the lower mold and punches out the electronic component from the carrier, and wherein the electronic component punched by the punching portion is punched out. A mold having an upper mold having a suction hole formed on the lower end surface of the portion for suction and holding; and a reciprocating drive between the mold apparatus and the mount head, punched out by the mold apparatus, and And a delivery unit for receiving the electronic component sucked and held by the punching part of the mold and supplying the electronic component to the mount head. 3. A suction source for generating a suction force is connected to a suction hole of the upper mold, and the suction source is connected to the suction source before driving the upper mold to punch out an electronic component from the carrier. 3. The mold apparatus according to claim 1, wherein a control means for generating a suction force is connected to the hole.
Component supply device as described.