JPH06283894A - Device for mounting electronic part - Google Patents

Abstract

PURPOSE:To simplify an operation process when a surface mount type electronic part is mounted a printed wiring board, etc., and to acquire a device for mounting an electronic part whose mounting reliability is improved. CONSTITUTION:An electronic part is attracted by vacuum of an attraction nozzle 12 and a pair of jaws 16 are arranged at both sides of the attraction nozzle 12. When an electronic part attracted by the attraction nozzle 12 is brought into contact with the jaws 16, adhesive is discharged from an adhesive supply needle 18 supported by the jaw 16 and is applied to the mounting surface of an electronic part. Then, the electronic part is mounted on a printed wiring board by the attraction nozzle 12. Thereby, both carrying of an electronic part and application of adhesive can be performed simultaneously and a mounting process can be simplified. Furthermore, since adhesive, etc., is applied, the generation of troubles caused by mispositioning can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting surface mounting type electronic components on a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a chip resistor,
When mounting surface-mounted electronic components (hereinafter simply referred to as electronic components) such as chip capacitors and surface-mounted semiconductor devices, a conductive adhesive or solder paste is previously placed on the printed wiring board at the planned electronic component mounting position. (Hereinafter referred to as adhesive, etc.)
After applying, the electronic component is placed on top of it and adhered. In this case, depending on the type of adhesive or the like, the electronic component may be temporarily fixed and then irradiated with ultraviolet rays or infrared rays to be finally fixed (Japanese Patent Laid-Open No. 2-288393).
Issue). There is also a method in which an electronic component to be mounted is applied with an adhesive or the like in advance, and the electronic component is mounted on a printed wiring board for adhesion (Japanese Patent Laid-Open No. 64-69092). Further, there is also one in which a two-component mixed type adhesive is applied to each of the electronic component and the printed wiring board (Japanese Patent Laid-Open No. 63-21895).
Issue).

[0003]

In such conventional mounting of electronic components, in any case, it is necessary to apply an adhesive or the like to the electronic components or the printed wiring board in advance before the mounting process of the electronic components. There is. For this reason, it is necessary to perform two types of processes, which are an adhesive application process and a component mounting process, for electronic components and printed wiring boards, which complicates the work process. In addition, when the method of applying the adhesive to the printed wiring board is applied to the automatic mounting method of electronic parts in recent years, the adhesion failure of the electronic parts is caused by a slight displacement between the electronic parts and the printed wiring board. Is likely to occur, and there is a risk of mounting defects such as standing up and movement of electronic components. To address this, it is necessary to apply an adhesive or the like to an unnecessarily large area of the printed wiring board in anticipation of positional displacement, which may cause an increase in weight or a circuit short circuit due to the excess adhesive.

On the other hand, in the method of applying the adhesive to the electronic component, it is extremely difficult to apply the adhesive to the fine electronic component, and the handling of the electronic component after applying the adhesive is troublesome. In particular, even for electronic components such as chip resistors and chip capacitors whose front and back surfaces are indistinguishable, it is necessary to distinguish the front and back surfaces and mount them on a printed wiring board after applying adhesive, which complicates the work. It will be. An object of the present invention is to provide an electronic component mounting apparatus that simplifies the working process and improves the reliability of mounting electronic components.

[0005]

According to the present invention, a suction means for sucking an electronic component to be surface-mounted and conveying it to a mounting position of a printed wiring board and a mounting surface of the electronic component sucked by the suction means are opposed to each other. And a coating means for coating an adhesive or the like on the mounting surface of the electronic component that is positioned and adsorbed. Further, the suction means and the coating means are configured to be driven by a driving means which is reciprocally moved between a supply stage for preparing electronic components and a mounting table on which a printed wiring board is mounted. For example, a suction nozzle that vacuum-sucks an electronic component, a pair of jaws that are in contact with both side surfaces of the sucked electronic component, and a pair of jaws that are provided on these jaws and that are positioned facing the mounting surface of the sucked electronic component. An adhesive supply needle for applying an adhesive or the like to the mounting surface is provided.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is an overall configuration diagram showing a schematic configuration of an embodiment of an electronic component mounting apparatus of the present invention. In the figure, 1 is an electronic component such as a chip resistor, a chip capacitor, or a surface mount semiconductor device, and 2 is a printed wiring board on which the electronic component 1 is mounted. The electronic component 1 is conveyed to the component supply stage 3 by a supply device (not shown), and the posture and direction are adjusted so that the mounting surface faces downward. In this case, either of the front and back surfaces may be turned downward in an electronic component in which the front and back surfaces are not distinguished. The printed wiring board 2 is fixed in a state of being positioned at a predetermined position on the mounting table 4. The electronic component mounting mechanism unit 5 is mounted on the tip of a drive arm 6 supported by the apparatus fixing unit, and is reciprocally moved between the component supply stage 3 and the mounting table 4 by the drive arm 6 and also the stage. And moved up and down on the table.

FIG. 2 is a diagram showing the details of the electronic component mounting mechanism portion 5, in which the stem 1 is provided at the tip of the drive arm 6.
1 is suspended downward, and the suction nozzle 12 is inserted and supported by the stem 11 in a state of protruding downward. The suction nozzle 12 is formed in the shape of a hollow pipe, is supported so as to be vertically movable with respect to the stem 11, and a vacuum tube 13 is connected to the base end portion thereof. The vacuum tube 13 is connected to a vacuum source (not shown) via an opening / closing valve 14. In addition, a first solenoid means 15 is provided in a part of the stem 11 which is opposed to a part of the suction nozzle 12 in the length direction, and by controlling the energization direction to the first solenoid means 15, It is possible to drive the suction nozzle 12 so as to protrude downward or retract upward by magnetic force.

A pair of jaws 16 are arranged on both left and right sides of the stem 11 so as to sandwich the suction nozzle 12, and are pivotally supported by the stem 11 at a fulcrum X at their base end portions. Then, the second solenoid means 17 is provided on both side portions of the stem 11 facing the base end portion of the jaw 16, and by turning on and off the power supply to the second solenoid means 17, the jaw 16 is generated by the magnetic force. Can be swung around the fulcrum X to open and close the tip of each jaw 16 on both sides of the suction nozzle 12. Further, an adhesive supply needle 18 is integrally provided on each jaw 16, and the tip of each supply needle 18 is located below the tip of each jaw 16. An adhesive supply tube 19 is connected to each supply needle 18, and is connected to an adhesive supply source (not shown) via an opening / closing valve 20. Note that here, a conductive adhesive is used as the adhesive.

The mounting operation of electronic components in this mounting apparatus will be described with reference to FIG. First, after the electronic component mounting mechanism 5 is lowered to a predetermined height by the drive arm 6 on the electronic component supply stage 3, the first solenoid means 15 is energized in one direction as shown in FIG. 3A. To lower the suction nozzle 12 to the upper surface of the electronic component 1
Touch the tip of the. Then, the opening / closing valve 14 is opened to communicate with the vacuum source, and the suction nozzle 12 sucks the electronic component 1 under vacuum.

Next, as shown in FIG. 3 (b), the suction nozzle 12 is moved upward by passing through the first solenoid means 14 in the opposite direction, and then the second solenoid means 17 is energized to move the jaws 16 of both jaws 16 together. Operate in the direction to close the tip, and remove both jaws 16
The tip end of is contacted with both side surfaces of the electronic component 1. At this time, by sandwiching both side surfaces of the electronic component 1 by the jaws 16, it becomes possible to orient the electronic component 1 in a predetermined direction. Then, at the same time when the jaws 16 come into contact with each other,
The tip of the adhesive supply needle 18 is positioned to face the lower surface of the electronic component 1. Immediately thereafter, when the opening / closing valve 20 is opened and the adhesive A is discharged from the adhesive supply needle 18, the adhesive A is applied to both sides of the lower surface of the electronic component 1, that is, the lower surface of the electrode portion of the electronic component 1. During this operation, the drive arm 6 moves the electronic component mounting mechanism 5 upward on the supply stage 3, horizontally moves to a position directly above the printed wiring board 2 on the mounting table 4, and lowers to a predetermined height. To be done.

After that, as shown in FIG.
Is released from the contact state with the electronic component 1, and then the suction nozzle 12 is lowered by energizing the first solenoid means 15 in one direction, so that the electronic component 1 is placed at a predetermined position on the printed wiring board 2. Press. As a result, the electronic component 1 is mounted on the printed wiring board 2 at a predetermined position by the adhesive A. After that, the vacuum suction by the suction nozzle 12 is released,
The drive arm 6 moves the electronic component mounting mechanism 5 upward,
Further, the returning operation is performed toward the initial operation shown in FIG.

Therefore, in this mounting apparatus, the electronic component 1 is carried from the supply stage 3 onto the printed wiring board 2 on the mounting table 4 and mounted at a predetermined position on the printed wiring board 2 at the same time. The operation of applying the adhesive A to a predetermined position on the lower surface of the electronic component 1 can be performed, and the process of applying the adhesive is simplified as compared with the conventional method in which the process of applying the adhesive is performed independently of the electronic component mounting process. Can be realized. Further, by applying the adhesive to the electronic component 1 side, there is no problem caused by the positional deviation between the printed wiring board 2 and the electronic component 1 during mounting. Furthermore, since the adhesive applied to the electronic component is at the same time as the mounting operation, the handling of the electronic component applied with the adhesive does not become troublesome.

The suction nozzle 1 in the above embodiment
It is possible to arbitrarily set a plurality of 2, jaws 16 and adhesive supply needles 18 as constituent elements of the same mechanism. For example, in an electronic component such as a flat package type semiconductor device in which electrodes are provided around the four sides of the package, the adhesive supply needles may be arranged around the four sides with respect to the suction nozzle. Good. The adhesive supply needle 18 does not necessarily have to be attached to the jaw 16, and may have a structure in which it is supported by the stem 11, for example, as long as the relative position with respect to the jaw can be secured.

[0014]

As described above, according to the present invention, the electronic component to be surface-mounted is sucked by the suction means, and after being conveyed to the mounting position of the printed wiring board, the position facing the mounting surface of the sucked electronic component. By applying the adhesive such as conductive adhesive or solder paste to the mounting surface of the electronic component by the applied coating means, the operation of carrying and mounting the electronic component and the operation of applying the adhesive to the electronic component can be performed at the same time. Therefore, it is possible to obtain an effect that the electronic component mounting process is simplified, high-quality mounting is possible, and the electronic component is not complicatedly handled. In particular, the suction means and the coating means are configured to be driven by the driving means that is reciprocally moved between the supply stage for preparing the electronic component and the mounting table on which the printed wiring board is mounted. It is possible to realize the automation of the supply and mounting on the printed wiring board. In addition, if an electronic component is vacuum-sucked by a suction nozzle and a pair of jaws are brought into contact with both side surfaces of the sucked electronic component, the adhesive supply needles provided on these jaws will cause the electronic component mounting surface to reach a predetermined position. Since the adhesive or the like can be applied to the portion, the electronic components can be sucked and conveyed and the adhesive or the like can be applied simultaneously and accurately.

[Brief description of drawings]

FIG. 1 is a diagram showing an overall configuration of an embodiment of the present invention.

FIG. 2 is a detailed front view of a mounting portion according to the present invention.

FIG. 3 is a diagram for explaining the operation of the device of the present invention.

[Explanation of symbols]

 1 Electronic Component 2 Printed Wiring Board 5 Electronic Component Mounting Mechanism 6 Drive Arm 11 Stem 12 Adsorption Nozzle 15 First Solenoid Means 16 Jaw 17 Second Solenoid Means 18 Adhesive Supply Needle A Adhesive

Claims (3)

[Claims] 1. Adsorption means for adsorbing an electronic component to be surface-mounted on a printed wiring board and conveying it to a mounting position of the printed wiring board, and a position opposed to a mounting surface of the electronic component adsorbed by the adsorption means, An electronic component mounting apparatus comprising: an applying unit that applies an adhesive such as a conductive adhesive or a solder paste to a mounting surface of the sucked electronic component. 2. The suction means and the coating means are configured to be driven by a driving means that reciprocates between a supply stage for preparing electronic components and a mounting table on which a printed wiring board is mounted. The electronic component mounting apparatus according to claim 1. 3. A suction nozzle for vacuum-sucking an electronic component,
A pair of jaws that come into contact with both sides of the sucked electronic component, and an adhesive supply that is provided on these jaws and faces the mounting surface of the sucked electronic component and that applies an adhesive or the like to the mounting surface. The electronic component mounting apparatus according to claim 1, further comprising a needle.