JPS63228699A - Electronic parts mounter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting device, and in particular to an electronic component mounting device suitable for mounting chip-shaped electronic components onto an electronic circuit board using an adhesive. The present invention relates to a component mounting device.

[Prior Art] In the conventional technology of mounting an IC chip or the like (hereinafter referred to as an electronic component) without a lead wire on an electronic circuit board (hereinafter simply referred to as a board), for example, an electronic component described in Japanese Patent Application Laid-open No. 1988-196099 is used. The mounting device has an electronic component mounting section that supports the electronic component mounting section for transferring onto a first board, the first board and a second board provided with a certain gap from this board, and a mounting device for mounting the electronic components. a board supporting part that changes its relative position with respect to the electronic component mounting part; and a board supporting part that is provided at a distance from the electronic component mounting part that is the same as the relative relationship between the first board and the second board that face the electronic component mounting part. The adhesive applicator and…”
The device required an XY table that could hold two substrates at any given time.

Further, in ``Method and Apparatus for Applying Adhesive to Chip-type Leadless Electronic Components'' described in JP-A-59-43596, ``the retained adhesive is brought into contact with the back surface of the electronic component. ”, the coating member and the electronic component are moved relative to each other at least once in both the forward and reverse directions in a direction substantially parallel to the back surface, and A technique has been disclosed that allows a necessary and sufficient amount of adhesive to be deposited also on the side surfaces while avoiding the adhesive from being deposited on the electrodes. However, at this time, no consideration was given to the possibility that the electronic components may become misaligned due to parallel operations.

[Problems to be Solved by the Invention] Regarding the former, the above-mentioned prior art has the disadvantage that adhesive application and mounting of electronic components are performed on each board in parallel, so that the board is held and The XY table used for positioning must be large enough to hold two boards.
The device itself was large and expensive.

Furthermore, in the latter description, in order to apply adhesive to the back side of an electronic component, the structure is such that the adhesive adhered to a member that moves parallel to the electronic component surface is applied to the electronic component surface. Therefore, the adhesive becomes flat on the surface of the electronic component, so there is a risk that the surface to be applied will be insufficient.Furthermore,
Not enough consideration was given to the fact that when adhesive is applied, electronic components move under the influence of the forcing force of members operating through the adhesive, resulting in a lack of reliability in terms of adhesion accuracy.

The present invention has been made in order to solve the problems of the prior art described above, and provides an electronic component mounting device that can make the device itself compact, and can perform reliable adhesive application and efficient electronic component device. Its purpose is to provide.

Means for Solving Problems] In order to achieve the above object, the configuration of the electronic component mounting device according to the present invention is such that the electronic component mounting device receives the electronic component from the electronic component supply device, transfers it to a predetermined position on the board, In an electronic component mounting device having an electronic component transfer device for mounting, the electronic component is moved by the electronic component transfer device in order to fix the electronic component in a predetermined position on the substrate via an adhesive. a means for positioning the substrate between the substrate; and a means for positioning the electronic component in the predetermined position on at least one of the surface of the positioned substrate at a predetermined position to which the electronic component is to be bonded, or the bonding surface of the electronic component. This device is equipped with an adhesive applicator that applies an adhesive immediately before it is installed in a position, and a control means that controls the timing of applying the adhesive.

It should be noted that the above technical means utilizes the following idea.

In conventional adhesive application equipment, adhesive in a liquid state is applied to the board or electronic component surface, and the adhesive strength of the adhesive on the board or electronic component surface is determined based on the adhesive strength of the adhesive on the board or electronic component surface in the applied state at that time. This method was used to complete the adhesive application process by cutting off the adhesive that was connected to the base.

In the present invention, instead of using such a method, the adhesive is ejected in the form of fine particles or droplets, and is applied by spraying onto the surface of the substrate or electronic component.

In this way, by means of spraying adhesive, it becomes possible to apply adhesive to the board immediately before mounting the electronic component on the board, both physically and speed-wise, which makes it possible to There is no need to hold two boards as in conventional technology.

In addition, the electronic components are adsorbed by the electronic component transfer device from the electronic component supply device, moved to the electronic component mounting position, and adhered to the surface of the electronic component before being mounted at the predetermined position on the board. It is also possible to spray the agent.

In this case, the force that causes misalignment between the electronic component transfer device that holds the electronic components and the electronic components is almost nil compared to the conventional technology, and the electronic components can be accurately placed on the board. This allows it to be installed on the

[Function] The function of the above technical means, that is, the operating procedure of the electronic component mounting device will be explained.

The electronic components are sequentially supplied from the electronic component supply device according to instructions. The sequentially supplied electronic components are intermittently and sequentially transferred from the electronic component suction position to the electronic component mounting position by the electronic component transfer device in synchronization with the order in which the electronic components are supplied.

On the other hand, in order to position the board at a predetermined position, the XY table positions the board before the electronic component is mounted on the board by the electronic component transfer device.

First, a case in which adhesive is sprayed onto a substrate will be described.

Immediately after the XY table is operated and the predetermined electronic component mounting position on the board and the mounting position of the electronic component transfer device are aligned on the normal line, in other words, the electronic component is placed on the board. Immediately before being placed in place, an adhesive applicator is activated to spray adhesive onto the substrate. After the adhesive is sprayed onto the board, electronic components are mounted onto the board from an electronic component transfer device.

By performing this operation continuously, it is possible to efficiently mount electronic components onto the board, and continuous work can be performed by holding only one board on the XY table.

Also, when applying adhesive to the surface of electronic components.

While the electronic component transfer device picks up the electronic components from the electronic component suction position and sequentially and intermittently supplies the electronic components to the electronic component mounting position, adhesive is sprayed onto the electronic component surface. The adhesive is
Since the adhesive is sprayed without contacting the electronic parts, the work of applying the adhesive to the electronic parts is completed without applying excessive force to the electronic parts.

[Embodiments] Each embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

FIG. 1 is a schematic configuration diagram showing the basic configuration of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 to 5 are schematic explanatory diagrams of its adhesive application head. , 3 are explanatory diagrams for applying adhesive onto a board, Figures 4 and 5 are explanatory diagrams for applying adhesive to an electronic component surface, and Figure 6 is an electronic component with the basic configuration shown in Figure 1. It is a perspective view of a mounting device.

First, the configuration of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 6.

In the figure, 1 is an electronic component supply device, and this electronic component supply device 1 includes an electronic component supply section 1a on a dividing table lb.
The electronic components arranged in the electronic components are supplied to the electronic component transfer device in accordance with, for example, an NC data command or a computer command.

Various electronic components may be arranged randomly or systematically, and specific ones are supplied according to instructions. Its operation is such that the electronic component is supplied to the electronic component suction position by a drive motor (not shown) via a known moving means such as a ball screw, rack, or pinion.

2 is an electronic component transfer device, and this electronic component transfer device 2 is
It consists of a transfer mechanism 2a made of known rotation means such as a rotary index table, and a mounting head 2b for vacuum-chucking electronic components, moving them, and mounting them on a board. A plurality of mounting heads 2b (8 in FIG. 1) hang down at equal intervals on the circumference of the turntable of the transfer mechanism 2a, and their positions are shifted by a constant angle by the operation of the transfer mechanism 2a. It is.

3 is an XY table made of known means for positioning the board 4, and 5 (5') is an adhesive for spraying and applying adhesive to a predetermined position on the board 4 on which the electronic component 11 is to be attached. It is a coating device, and this adhesive coating device!
The adhesive application head 5 (5') will be described later with reference to FIGS. 2 to 5.

6 is an electronic component 11 supplied from the electronic component supply section 1a.
The electronic component suction position at which the electronic component should be suctioned to the mounting head 2b of the electronic component transfer device 2 is shown. Further, 7 indicates an electronic component mounting position where the electronic component 11 transferred by the mounting head 2b is to be mounted at a predetermined position on the board 4.

Reference numeral 12 shown in FIG. 6 is a board carrying-in section for feeding the board 4 into the XY table 3, and 13 is a board carrying-out section for carrying out the board 4A which has been positioned on the XY table 3 and has the electronic component 11 mounted thereon.

8 is an adhesive application head of the adhesive application device 5, and this adhesive application head 8 is fixedly arranged near the electronic component mounting position 7. FIG. 2 shows the adhesive application head 8.
This shows a state in which the adhesive 9 is sprayed and applied to a predetermined electronic component mounting position on the board 4.

In FIG. 3, adhesive application heads 10 of the number corresponding to the mounting heads 2b of the electronic component transfer device 2 are fixedly arranged on the transfer mechanism 2a, and adhesive 9 is sprayed onto predetermined positions on the board 4. It shows the applied state.

Here, the adhesive application head 1o stores adhesive in a liquid state in the head main body 10a, pressurizes the piston 10b by applying air pressure or the like shown by the arrow for a short time, and applies the adhesive from the small diameter nozzle 10c. It squirts out and sprays onto the board. In particular, it is desirable that the adhesive be made into fine particles using an inkjet method or that the adhesive be liquefied into a predetermined size and then sprayed.

It goes without saying that the adhesive application head 8 also has the same mechanism as the adhesive application head 10, although not shown. Further, FIG. 4 shows a state in which adhesive 9' is sprayed and applied to the adhesive surface of electronic component 11 by adhesive application head 8'.

Similarly, FIG. 5 shows the mounting head 2 of the electronic component transfer device 2.
Nozzle 1 of adhesive application head 10' provided corresponding to b
0c' shows the state in which the adhesive 9' is sprayed onto the adhesive surface of the electronic component 11.

Hereinafter, the operation of the electronic component mounting apparatus configured as described above will be explained with reference to each figure.

The electronic components 11 randomly arranged on the division table 1b of the electronic component supply device 1 are supplied from the electronic component supply section 1a according to instructions from a control means such as a microcomputer.
The electronic components are moved laterally and supplied to the electronic component supply unit [6] according to the component type. The electronic components 11 supplied from the electronic component supply section 1a are vacuum-adsorbed by the mounting head 2b of the electronic component transfer device 2, and are transferred into a plurality of electronic components (8 in FIG. 1) by the operation of the transfer mechanism 2a consisting of a rotary index table mechanism. electronic components 11 for each arrangement of the mounting heads 2b at equal circumferential angles
Electronic component mounting position 7 is sequentially and intermittently synchronized with the supply order of
It will be transferred to.

On the other hand, the substrate 4 is transported by a conveyor (not shown) or the like, and placed on the XY table 3 from the substrate loading section 12 . Then, the board 4 is moved and positioned by the XY table 3 in order to mount the electronic component 11 at a predetermined position on the board 4, and the predetermined position on the board 4 is placed in an electronic component transfer bag. i! 2 on the normal line of the electronic component mounting position 7. That is,
While the transfer mechanism 2a of the electronic component transfer device 2 moves the electronic component 11 that the mounting head 2b has attracted,
The Y table 3 positions the substrate 4 at a predetermined position.

When applying adhesive onto the board 4, immediately after the XY table 3 positions the board 4 at a predetermined position, the electronic component 11 held by the mounting head 2b is lowered and mounted at the predetermined position. Immediately before bonding, adhesive is sprayed onto the surface of the substrate 4 at a predetermined position on which the electronic component is to be bonded, by the adhesive coating head 8 (see FIG. 2) of the adhesive coating device 15.

The adhesive applicator 5 is arranged near the electronic component mounting device 7 as shown in FIG. Equipped with

As another embodiment, as shown in FIG. 3, the electronic component transfer device 2 has a structure in which the number of adhesive application heads 10 corresponds to the number of electronic component mounting heads 2b. The adhesive 9 is sprayed and applied to the mounting position.

After the adhesive is applied onto the substrate 4, the electronic component 11 held in the mounting head 2b of the W1 electronic component transfer device 2 is placed at a predetermined position on the substrate 4, that is, the adhesive is applied to the electronic component supply section ff1i7. Electronic component 1 to the position where 9 was applied
1 will be installed.

Next, when applying adhesive onto the surface of the electronic component 11, the mounting head 2b of the child component transfer device 2 intermittently and sequentially moves the adhesive from the electronic component suction device 6 to the electronic component mounting position 7.
The adhesive applicator 5' (see FIG. 1) is fixedly placed at an arbitrary position during the movement to the mounting head 2, and as shown in FIG.
Spray it onto the mounting surface of the electronic component 11 held at b.

In yet another embodiment, as shown in FIG. 5, the electronic component transfer device 2 has a structure in which the number of adhesive application heads 10' corresponds to the number of electronic component mounting heads 2b.
While the electronic component 11 is moved from the electronic component suction position 6 to the electronic component mounting device 7 while being held by the mounting head 2b, the adhesive 9' is applied to the electronic component through the nozzle 100' of the adhesive application head 10'. Spray on the adhesive surface of No.11.

In the above, the adhesive application head, especially its nozzle,
This method sprays adhesive onto the adhesive surface without contacting it.

As described above, the mounting head 2b sucks up the electronic component 11 by vacuum suction, makes a half turn and descends, and sprays the adhesive onto a predetermined position of the board 4 positioned on the XY table 3 through application. mount the electronic parts. These series of operations are performed repeatedly at high speed, and the interlocking between the electronic component transfer device 2 and the adhesive application bag [5 (5'') at this time is as follows.
This is performed at a reliable timing by a control means (not shown) such as a known interlocking mechanism in response to a control command from a microcomputer (not shown) or the like.

According to this embodiment, the adhesive application process can be inserted into the process of mounting electronic components onto a board without slowing down the process.

In addition, the electronic component mounting device itself has been made compact,
In addition, it is possible to eliminate anxiety factors such as the application force of the adhesive, the time the adhesive is left to stand, and the intrusion of dust into the bonded portion, which affect the accuracy of mounting electronic components.

Note that the electronic component transfer device in the above embodiment.

It goes without saying that the substrate positioning means, the adhesive coating device, etc. have standard configurations, and the shapes, mechanisms, etc. of each part are not limited to those in the embodiments.

[Effects of the Invention] As described above, according to the present invention, it is possible to provide an electronic component mounting device which is capable of making the device itself combatant, and which can perform reliable adhesive application and efficient electronic component mounting. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram showing the basic configuration of an electronic component mounting apparatus according to a positional embodiment of the present invention, and FIGS. 2 to 5 are
FIGS. 2 and 3 are schematic explanatory diagrams of the adhesive application head, and FIGS.
When applying adhesive onto a board, Figures 4 and 5 are explanatory diagrams when applying adhesive onto an electronic component surface, and Figure 6 is an explanatory diagram when applying adhesive onto an electronic component surface.
1 is a perspective view of an electronic component mounting apparatus having the basic configuration shown in the figure. 1... Electronic component supply device, 2... Electronic component transfer device. 2a... Transfer mechanism, 2b... Mounting head, 3...
XY table, 4... Board, 5.5'... Adhesive applicator, 6... Electronic component suction position, 7... Electronic component mounting position. 8.8'...Adhesive application head, 9,9'...Adhesive. 10.10'...Adhesive application head, 11...Electronic component.

Claims (1)

[Scope of Claims] 1. An electronic component mounting device having an electronic component transfer device for receiving electronic components from an electronic component supply device, transferring the electronic components to a predetermined position on a board, and mounting the electronic components as described above. means for positioning the substrate while the electronic component is being moved by the electronic component transfer device, and bonding the electronic component on the positioned substrate in order to fix the electronic component in a predetermined position on the substrate via an adhesive; an adhesive applicator for applying an adhesive to at least either a surface at a predetermined position to be attached or an adhesion surface of the electronic component immediately before the electronic component is mounted at the predetermined position; An electronic component mounting device characterized by comprising means for controlling the timing of coating. 2. In the device described in claim 1, the adhesive applicator is held in a non-contact position with respect to the surface of the electronic component to which adhesive is to be applied or the surface at a predetermined position on the board. An electronic component mounting device that has an adhesive application head that sprays and applies adhesive.