JPH07100147B2 - Adhesive coating device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an adhesive application device for applying an adhesive or the like.

2. Description of the Related Art A conventional adhesive applying device of this type has a structure as shown in FIG. That is, the printed board is sent to the XY table by the vertically movable board loading unit 1. Two dispensers 4a and 4b which are vertically slidable are attached to the arm 3 having two cylindrical shapes in the adhesive application section.
The dispenser 4a includes a small component 5 as shown in FIG. 3a.
2 nozzles with a small nozzle tube diameter for discharging a small amount of adhesive 6a are attached to the dispenser 4b.
As shown in FIG. 3b, two large nozzles with a large nozzle tube diameter for discharging a large amount of the adhesive 6b are attached to mount the large-sized component 7, and a dispenser can be selected according to the size and shape of the chip component. The arm 3 is rotated by the driving cylinder 8 so that the two dispensers 4a and 4b move along the groove 9a of the plate 9. The XY table 2 brings a predetermined position of the printed circuit board directly below the dispenser in the center of the plate 9, and the dispenser descends until the nozzle 10 comes into contact with the printed circuit board to discharge the adhesive from the nozzle 10. The printed circuit board on which the adhesive has been applied is sent out from the adhesive applying device by the board unloading unit 11 which can move up and down.

Problems to be Solved by the Invention However, in the above configuration, since the XY table moves in the direction parallel to the flow of the printed circuit board, the rails for loading and unloading the printed circuit board avoid interference with the XY table. For this reason, there has been a problem in that the size of the entire adhesive coating device has become very large because it is necessary to provide a dedicated substrate loading and unloading part having a drive for moving the rail up and down.

Further, in recent years, it has become necessary to provide a dedicated dispenser for minute chip parts, which has been increasing.

However, in the above configuration, if the number of dispensers attached to the arm is increased, it is impossible to select the dispenser with the driving cylinder, so that a motor or the like is required as a drive source for rotating the arm. Come on. Therefore, there is a problem that the adhesive application section becomes large in size and mechanically complicated.

In view of the above problems, the present invention does not require a dedicated substrate loading unit and substrate unloading unit, and the overall size is significantly reduced, and the adhesive application unit does not increase in size even when the number of dispensers is increased, An adhesive application device that is mechanically simple is provided.

Means for Solving the Problems In order to solve the above-mentioned problems, the adhesive application device of the present invention is provided with a table portion having a table capable of holding a printed circuit board and movable in one direction, and a direction in which the table moves. It is composed of an adhesive application unit having a plurality of vertically aligned dispensers and movable in the direction perpendicular to the moving direction of the table, and a control unit for moving the table to a predetermined position and selecting a predetermined dispenser to apply the adhesive. It has a configuration.

Action The action of the above means is as follows. That is, since the table moves only in the direction perpendicular to the flow of the substrate, it is not necessary to provide a vertically movable substrate loading and unloading portion to avoid interference with the table, and the overall size of the adhesive coating device is greatly reduced. It can be made very small.

Further, since the adhesive applying section does not require a drive source for selecting a plurality of dispensers even when the dispensers are aligned, the size of the adhesive can be prevented and the mechanism can be simplified.

Example Hereinafter, an adhesive applying device according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an adhesive application device according to an embodiment of the present invention. In FIG. 1, 12 is a dispenser guide, which has a structure capable of sliding vertically with respect to this dispenser guide.
Book dispensers 13a, 13b, 13c are attached.
The dispenser guide 12 is slidably attached to the body 14, and a ball screw 15 for transmitting driving power of the dispenser guide 12 is attached to the body 14 via a bearing 16. Rotating shaft pulley 17 fixed to the ball screw 15
Is a pulley 19 and a belt 20 fixed to the pulse motor 18.
Tied with. The table 21 is slidably attached to a guide 22 fixed to the body 14, and a rotary shaft pulley 24 of a ball screw 23 that transmits sliding power of the table is connected by a pulley 26 fixed to a pulse motor 25 and a belt 27. Has been. The board transfer rails 28a and 28b are not attached to the adhesive applying device, but transfer the printed circuit board to a position where the device and the table 21 can be loaded.

Next, the operation of the configuration of this embodiment will be described. The printed board is carried onto the upper surface of the table 21 by the board carrying rail 28a when the table 21 has moved to a position where the board can be carried in. The three dispensers 13a, 13b, and 13c are for large parts, small parts, and minute parts, respectively, and have different nozzle shapes, and the dispenser can be selected according to the shape of the chip parts to be mounted. Pulse motor 18
Rotating by ball screw 15 with dispenser guide 12
The dispenser is selected by moving the dispenser to be driven and used onto a predetermined position on the substrate in a direction parallel to the substrate flow. At the same time, the table 21 is moved in the direction perpendicular to the substrate flow by the ball screw 23 rotated by the pulse motor 25 to move the predetermined position of the substrate below the alignment straight line of the dispenser. After the predetermined position of the substrate is moved right under the selected dispenser, the dispenser descends until the tip of the nozzle 29 touches the substrate and the adhesive is applied to the nozzle.
Discharge from 29. The printed board on which the adhesive has been applied is unloaded from the upper surface of the table 21 by the board transfer rail 28b when the table 21 has moved to a position where the board can be unloaded.

As a result, since the table 21 moves only in the direction perpendicular to the substrate flow, it is not necessary to provide a vertically movable substrate loading / unloading unit and a substrate unloading unit, and the overall size of the adhesive coating device is significantly reduced. .

The dispenser selection is performed by moving the adhesive application section in parallel with the flow of the substrate. Therefore, it is not necessary to mount a drive source for selecting the dispenser on the adhesive application section, which is mechanically simple.

As described above, according to the present invention, by providing the table that moves only in the direction perpendicular to the substrate flow, when a substrate is loaded into or unloaded from the table, a drive source is provided to prevent interference with the table. Movable substrate loading and unloading parts are not required, and the overall size of the adhesive application device is significantly reduced.

Further, according to the present invention, since the dispenser selection is performed by moving the adhesive applying section in which a plurality of dispensers are aligned in a direction parallel to the substrate flow, it is necessary to mount a drive source for selecting the dispenser on the adhesive applying section. It becomes mechanically simple.

[Brief description of drawings]

FIG. 1 is a perspective view of an adhesive applying device according to an embodiment of the present invention, FIG. 2 is a block diagram of a control unit, and FIGS.
FIG. 4 is an enlarged plan view of a mounted state of chip parts, and FIG. 4 is a perspective view of a conventional adhesive applying device. 13a, 13b, 13c …… Dispenser, 21 …… Table, 22…
…guide.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Susumu Takaichi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Koichi Morita, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Muneyoshi Fujiwara 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A table unit having a table capable of holding a substrate and movable only in a direction orthogonal to the substrate carrying direction, and a plurality of dispensers for applying an adhesive to the substrate are held so as to be vertically movable. And an adhesive application section configured to be movable only in a direction orthogonal to the moving direction of the table section, and a control section that moves the table to a predetermined position and selects a predetermined dispenser to apply the adhesive. The adhesive application device in which the plurality of dispensers are arranged in parallel along the moving direction of the adhesive application unit.