JP3232653B2 - Bond application equipment - Google Patents

Abstract

PURPOSE:To provide a bond applying device by which the quantity of the bond to be applied to a substrate can be changed by selectively using plural syringes. CONSTITUTION:Plural syringes 28 are arranged around a rotor 22 and the rotor 22 is turned by a thrning means 25 to turn the desired syringes 28 to the bond applying position, causing the syringes 28 to be selected, and at the bond applying position, the syringes 28 have an air pressure giving means 60 in common.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bond applicator, and more particularly, to a method of selectively using a plurality of syringes to change the amount of a chip temporary fixing bond applied to a substrate. The present invention relates to a bond application device capable of forming a bond.

[0002]

2. Description of the Related Art When a chip mounted on a substrate by an electronic component mounting apparatus is large, such as a QFP, the chip is mounted on the substrate while moving the substrate in the XY directions at a high speed by the electronic component mounting apparatus. Also, during the transfer of the substrate from the electronic component mounting device to the reflow device, the chip is likely to be displaced on the substrate, so that a bond for temporary fixing is applied to a predetermined position of the substrate on which the chip is mounted by a bond application device. Thus, the chip is temporarily fixed by this bond.

Further, when mounting various types of chips on a substrate, it is necessary to adjust the amount of bond applied according to the chip size. These bond application devices were selectively driven to adjust the amount of bond applied.
Hereinafter, the conventional means will be described with reference to the drawings. FIG. 4 is a perspective view of a conventional bond coating apparatus. 1 is the substrate S
Conveyors 2 for conveying in the directions are positioning portions for the substrates S disposed on the bond application stages a, b, and c in the middle of the conveyor 1, and three are provided along the conveyor 1.
Reference numeral 3 denotes three bond coating devices disposed above each positioning unit 2.

[0004] Each bond coating device 3 has an XYZ table 6
And a pneumatic controller 7 for supplying pressurized air of a predetermined pressure to each syringe 5. In order to adjust the discharge amount of the bond B according to the size of the chip P, nozzles 4 having different sizes are provided in each syringe 5.
Is installed. The substrate S carried out by the conveyor 1 from the screen printing device (not shown) is sequentially positioned by the respective positioning portions 2 when reaching the bond application stages a, b, and c, and is positioned on the substrate S by the bond application devices 3. Is applied with a predetermined amount of bond B. Reference numeral 9 denotes a positioning portion of the substrate S arranged on the bonding stage d of the chip P.

[0005] Reference numeral 10 denotes three tray feeders on which chips P having different sizes are mounted, and 11 denotes a moving table on which the tray feeders 10 are mounted.
Is a ball screw for moving the movable base 11 in the X direction, and 13 is a nut. When the motor 14 is driven, the ball screw 1
2 rotates, the moving table 11 moves in the X direction, and the tray feeder 10 on which the desired chip P is placed is moved to the pickup stage e of the chip P.

Reference numeral 15 denotes an electronic component mounting apparatus, which includes a Y table 16 and a transfer head 17 provided on the Y table 16.
Consists of The Y table 16 is driven to move the transfer head 17 to the pickup stage e, and the nozzle 18
Then, the chips P of the tray feeder 10 are sucked and picked up, the transfer head 17 is moved to the bonding stage d, and the chips P are transferred and mounted on the substrate S positioned by the positioning unit 9.

[0007] The conventional device has the above-described configuration, and the operation will be described next. The substrate S carried out from the screen printing device is sequentially positioned at the positioning unit 2 of each of the bond application stages a, b, and c. Next, the XYZ table 6 is driven to lower the syringe 5 on the bond application position of the substrate S, and pressurized air is supplied from the air pressure controller 7 to the syringe 5. 4 to a predetermined amount of the bond B is applied on the substrate S.

Next, the substrate S is transported by the conveyor 1 to the bonding stage d, where it is positioned by the positioning unit 9. Next, the moving table 1 is driven by the drive of the motor 14.
1 is moved in the X direction, the tray feeder 10 on which the desired chip P is placed is positioned on the pickup stage e, and the Y table 16 is driven to move the chip P on the pickup stage e to the nozzle 18 of the transfer head 17. The chip P is mounted on the bond B of the substrate S by moving the transfer head 17 in the Y direction. Next, the motor 14 is driven to sequentially move the other tray feeders 10 to the pickup stage e, and the chips P of different sizes placed on the respective tray feeders 10 are mounted on the substrate S.
Are transferred and mounted one after another on Bond B.

[0009]

The conventional means is provided with a plurality of bond application stages a, b, and c in order to cope with mounting of various kinds of chips P, and each of the stages a, b, and c is provided with a bond application. A device 3 is provided. However, in such a configuration, each bond applicator 3 requires its own air pressure controller 7, and since the air pressure controller 7 is very expensive, the total price of the bond applicator 3 becomes extremely high. there were.

[0010] Such a problem similarly occurs in a die bonder in which a bare chip cut from a wafer is mounted on a substrate such as a lead frame.

SUMMARY OF THE INVENTION An object of the present invention is to provide a small, compact, and low-cost bond application apparatus capable of applying bonds having different coating amounts on a substrate.

[0012]

For this purpose, the present invention provides a rotating body and a plurality of rotating bodies held around the rotating body so as to be able to move up and down.
And number of syringes, nozzles mounted desired syringe the rotor and rotating means for horizontally rotating so as to position the bond coating position, in the bond coating position at the bottom of the syringe out of the plurality pieces of syringe Apply air pressure to this syringe to discharge the bond from
That it consists of a air-pressure applying means and the bond coating position Shi
It is provided above the syringe and is connected to the air pressure applying means.
Joint having a blow-off hole, and this joint
And a connecting means for connecting to a syringe .

[0013]

[Action] In the above structure, by horizontally rotating the rotating member by the rotation means to move the desired syringe from a plurality pieces of the syringe to the bond coating position, connecting the joint to a syringe located in this bond coating position, The air pressure is applied from the air pressure applying means, and the bond in the syringe is discharged from the nozzle.

When applying a bond having a different amount of coating on the substrate by changing the syringe, the rotating body is horizontally rotated by a rotating means to move the desired syringe to the bond applying position, and the air pressure is similarly changed. The bond is discharged from the nozzle by applying air pressure from the applying means.

As described above, since the present means is provided with a plurality of syringes, it is possible to apply bonds having different application amounts on the substrate, and each of the syringes is arranged around the rotating body. Therefore, the bond application position can be made compact, and since each syringe shares an expensive air pressure applying means, the number of air pressure applying means can be reduced and the cost can be reduced.

[0016]

Next, an embodiment of the present invention will be described with reference to the drawings. In the figure, the same components as those of the conventional apparatus shown in FIG. FIG. 1 is a perspective view of a bond coating device and an electronic component mounting device according to the present invention.
Reference numeral 20 denotes a bond application device that applies the bond B onto the substrate S, and is disposed on the bond application stage f. Further, on the movable table 11, four tray feeders 10 on which chips P of different types are mounted, respectively, are mounted. The bond application device 20 includes a bond application unit 70 in which a bond application head 71 is mounted on the XYZ table 6, and a pneumatic controller 60 described later connected to the bond application head 71.

FIG. 2 is a perspective view of the bond coating head 71. The bond coating head 71 has a plurality of (four in this embodiment) syringes 28. Each syringe 2
Eight nozzles 42 have different hole diameters, and are selectively used according to the size of the chip P, as described in detail later.
FIG. 3 is a cross-sectional view of the bond application head 71. Reference numeral 21 denotes a U-shaped bracket viewed from the side, which is mounted on the XYZ table 6 and to which the components described below are assembled.

An opening 21a is provided below the bracket 21.
Is formed, and the position of the opening 21 a is the bond application position of the syringe 28. Reference numeral 22 denotes a rotating body, which is rotatably supported via a bearing 24 between a mounting plate 23 provided on an upper portion of the bracket 21 and a lower portion of the bracket 21. Reference numeral 25 denotes a motor for rotating the rotating body 22 about its axis, which is disposed above the bracket 21. The syringe 28 is provided with the rotating body 2
2 is held up and down freely. 26 is the motor 2
5 is a coupling for connecting the output shaft 27 and the rotating body 22. When the motor 25 is driven, the rotating body 22 rotates horizontally about the axis through the coupling 26. These components 21, 23 to 27 constitute a rotating means for horizontally rotating the rotating body 22 in order to position a desired syringe 28 from among the plurality of syringes 28 at the bond application position.

Reference numeral 45 denotes an encoder as a position detector, which is attached to the output shaft 27 of the motor 25 and has a slit for position detection formed at a position corresponding to each syringe 28; And a position sensor 44 which is provided on the upper part and detects this slit. Next, the structure of the valve mechanism 72 provided above the syringe 28 will be described in detail.

In the partially enlarged view of FIG. 3, reference numeral 30 denotes a plug mounted on the upper portion of the syringe 28, 31 denotes a ring-shaped valve seat formed on the inner peripheral surface of the plug 30 and having a tapered lower surface. Reference numeral 32 denotes a valve body which is mounted in the plug 30 so as to be able to move up and down. The valve body 32 includes a rod portion 32a protruding upward from a central valve hole of the valve seat 31, and a tapered enlarged portion 32b having an upper surface closely contacting the lower surface of the valve seat 31. Reference numeral 33 denotes a coil spring for resiliently popping the valve body 32, and is provided between the flange 32c provided at the upper end of the rod 32a and the upper surface of the valve seat 31. Due to the spring force of the coil spring 33, the valve body 32 is normally closed and constantly pressed against the valve seat 31.

A presser 40 connected to a rod 51 of a cylinder 50 is provided above the syringe 28 at the bond application position.
Is provided. When the rod 51 of the cylinder 50 projects, the presser 40 descends to push down the valve body 32 and open the valve hole. When the presser 40 rises, the valve element 32 is pushed up by the spring force of the coil spring 33 to close the valve hole, and the presser 40 further moves up and separates from the plug 30. These components 40, 50, and 51 constitute a pressing unit that presses down the syringe 28 from above at the bond application position. The cylinder 50 is bonded
A presser 40 as a joint is attached to the syringe 28 at the cloth position.
Are connected to each other. Next, each syringe 2
Elevating means for elevating and lowering 8 along the rotating body 22 will be described.

Reference numeral 34 denotes four vertical guide rails radially disposed on the peripheral surface of the rotating body 22, and reference numeral 35 denotes a slider that slides on the guide rail 34. Reference numeral 36 denotes an elevating plate attached to the slider 35, and a mounting bracket 29 for attaching the plug 30 to the syringe 28 is fixed to an upper portion of the elevating plate 36. In addition, a projection 55 is provided on the lower surface of the lower portion of the elevating plate 36 so as to abut on a stopper 54 protruding from the lower portion of the rotating body 22 to regulate the ascent of the elevating plate 36.

A support member 37 is attached to the elevating plate 36 and supports the syringe 28 in a detachable manner. 38 is a coil spring for raising the lowered syringe 28,
One end is attached to a pin 39 projecting above the rotating body 22, and the other end is attached to an upper part of the elevating plate 36. When the presser 40 descends and presses the syringe 28, the elevating plate 36 slides downward along the guide rail 34 together with the slider 35 against the spring force of the coil spring 38, whereby the syringe 28 descends. The nozzle 42 projects downward from the opening 21 a of the bracket 21. When the presser 40 rises, the slider 35 rises along the guide rail 34 by the spring force of the coil spring 38, whereby the syringe 28 rises until the projection 55 contacts the stopper 54.

The pressing element 40 is inserted into a guide ring 41 mounted on the mounting plate 23 so as to be able to move up and down. Reference numeral 46 denotes a pressurized air blowing hole formed in the lower end of the pressing element 40;
Reference numeral 7 denotes a connection plug connected to the outlet 46, and the connection plug 47 is connected to a pneumatic device 61 for generating pressurized air via a connection tube 49.

Reference numeral 60 denotes an air pressure controller as air pressure applying means for applying air pressure to the syringe 28 descending at the bond application position, and comprises the air pressure device 61 and a control unit 62. The control unit 62 controls the driving of the cylinder 50 based on a detection signal from the encoder 45 that notifies that the selected syringe 28 has reached the bond application position, and controls the diameter of the nozzle 42 of each syringe 28 of the pneumatic device 61. Control of the air pressure and the time for applying the air pressure according to the conditions.

The present apparatus has the above-described configuration, and the operation will be described next. As shown in FIG. 1, the substrate S unloaded from the screen printing apparatus is positioned on the positioning section 2 of the bond application stage f. Next, the XYZ table 6 is driven to move the bond application head 71 to the bond application position on the substrate S. Next, in FIG. 3, the motor 25 is driven to rotate the rotating body 22, and the chip P mounted on the substrate S
Is positioned at the bond application position. When the position sensor 44 detects that the syringe 28 has reached the bond application position,
A detection signal is sent from the position sensor 44 to the control unit 62, and a drive command is issued from the control unit 62 to the cylinder 50, the rod 51 descends, and the presser 40 descends and comes into contact with the plug 30. The body 32 is depressed and the valve hole opens. Then, the pressing element 40 further descends, and the syringe 28 descends along the guide rail 34, and the nozzle 42 projects downward from the opening 21 a of the bracket 21.

Next, pressurized air corresponding to the selected syringe 28 is supplied from the pneumatic device 61 by the pneumatic device 61 on the basis of the drive command of the control unit 62 to the blowout hole 46 of the presser 40 from the pneumatic device 61.
Then, the pressurized air is supplied into the syringe 28 from the plug 30 in the valve open state, and a predetermined amount of the bond B is discharged onto the substrate S from the nozzle 42 by the air pressure.

After the end of the discharge, the driving of the pneumatic device 61 is stopped according to a command from the control unit 62, and the cylinder 50 is driven in the reverse direction to retract the rod 51 and raise the pressing element 40. Syringe 2 descended with this
Reference numeral 8 denotes a protrusion 55 of the lifting plate
4 until it comes into contact with the coil spring 38. Thereafter, the rod 51 is retracted, and the presser 40 returns to the original position.

Next, when the used syringe 28 is changed and the bond B having a different coating amount is coated on the substrate S, X
The YZ table 6 is driven to move the bond application head 71 to another bond application position, and then the motor 25 is driven to rotate the rotating body 22, and the syringe equipped with the nozzle 42 corresponding to the chip P of another type is mounted. 28 is moved to the bond application position, and the cylinder 50 is driven to lower the presser 40 in the same manner as described above, whereby the nozzle 42 of the syringe 28 protrudes below the opening 21 a and is supplied from the pneumatic device 61. Nozzle 42 by the air pressure of the compressed air
From the substrate S to the amount of the bond B corresponding to the chip P of another type.
Discharge upward.

After the discharge of the bond B, the cylinder 50
Is driven in the reverse direction to raise the pressing element 40, and the syringe 28 is raised by the spring force of the coil spring 38, and further raises the pressing element 40 to the original position. Thereafter, such an operation is repeated until all the bonds are applied to the substrate S.

In FIG. 1, the substrate S on which the application of the bond B has been completed is moved to the bonding stage d by the conveyor 1 and positioned there by the positioning unit 9. Next, while the motor 14 is driven to move the movable base 11 in the X direction, the chips P of different types placed on the four tray feeders 10 are sequentially placed on the corresponding bonds B of the substrate S by the electronic component mounting apparatus 15. Mount on top.

The bond applicator 20 is provided with a plurality of syringes 28 in the apparatus as described above, and is supplied from the pneumatic controller 60 while vertically moving the syringe 28 having the desired nozzle 42 selectively at the bond application position. Since the bond B is discharged from the nozzle 42 onto the substrate S by the compressed air that has been applied, even if a plurality of bond coating apparatuses are not arranged on the bond coating stage as in the conventional means, one bond can be bonded. The bonder B having a different coating amount corresponding to the type of the chip P can be coated on the substrate S by the coating device 20.

The mode of use of the present apparatus is not limited to the above embodiment. For example, even if a plurality of the same syringes 28 having nozzles 42 of the same hole diameter are held by the rotating body 22 and these syringes 28 are sequentially used. In this manner, the frequency of replacement of the syringe 28 can be reduced, and the bond can be connected and applied for a long time.

In the embodiment, the electronic component mounting apparatus for transferring and mounting the chip P on the substrate S has been described as an example. However, the present invention is also applicable to a die bonder for mounting a bare chip cut from a wafer on a substrate such as a lead frame. it can.

[0035]

As described above, the present invention has a plurality of syringes and a syringe at a bond application position.
Connected to the joint and the air pressure
The syringe is attached around the rotating body.
Circumference can be applied to desired different bond of the coating amount on the substrate by syringe while rotating the, yet each syringe, since disposed around the rotating body, wear configuration the bond coating position compactly . Also on the syringe side
A valve mechanism is provided, and the joint moves down
Open the valve mechanism by pushing down the valve element of the valve mechanism.
So one air for multiple syringes
The pressure applying means can be shared.

[Brief description of the drawings]

FIG. 1 is a perspective view of a bond coating apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a bond coating apparatus according to one embodiment of the present invention.

FIG. 3 is a front view of a bond coating apparatus according to one embodiment of the present invention.

FIG. 4 is a perspective view of a bond application apparatus according to a conventional means.

[Explanation of symbols]

 22 rotating body 25 rotating means 28 syringe 42 nozzle 60 air pressure applying means B bond

──────────────────────────────────────────────────続 き Continued on the front page (58) Investigated field (Int. Cl. ⁷ , DB name) B05C 5/00-5/02 H01L 21/52 H05K 3/34 504

Claims (2)

(57) [Claims] And 1. A rotary member, and a plurality pieces of syringes which are vertically movable held around the rotating body, the rotating body of the desired syringe from these multiple pieces of the syringe so as to position the bond coating position and rotating means for horizontally rotating, in order to discharge the bond from the nozzle attached to the bottom of the syringe in this bond coating position, Ri consists empty pressure applying means to grant air pressure to the syringe, also Bonn
Above the syringe at the application position
A joint having an outlet connected to the feeding means;
Connecting means for connecting the joint part of
Bond coating apparatus, characterized in that was e. 2. A valve mechanism is provided on the syringe side.
The joint section descends and pushes the valve body of this valve mechanism.
Lowering the valve mechanism to open it
The bond coating device according to claim 1, wherein: