JPH07245499A - Method for applying viscous fluid and component mounting device using this method - Google Patents

Abstract

PURPOSE:To coat a board with flux according to the pattern of a screen mask by copying the viscous fluid pattern of the screen mask on a transfer pad and then copying the pattern at the prescribed position on the board by moving a dummy nozzle. CONSTITUTION:A screen mask 65 is allowed to press-contact with the transfer pad 42 of a dummy nozzle 41, and after the prescribed time, a rod 71 is drawn in. Thus, viscous fluid L is adhered to the transfer pad. A controller moves a mounting head mounted with a dummy nozzle 41 to the prescribed land pattern on the board and then brings it down. Then, the bottom plane of the transfer pad 42 is allowed to press-contact with the board. The viscous fluid pattern in a shape corresponding to the land pattern adhered on the transfer pad is transferred to the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying a viscous fluid such as a flux onto a substrate, and an apparatus for surface-mounting electronic parts on the substrate.

[0002]

2. Description of the Related Art When a land portion on a substrate is provided with a solder precoat such as a solder plating, it is necessary to apply a flux before the surface mounting of a component thereon. Japanese Patent Laid-Open No. 2-84000 can be cited as an example of applying this flux in a component mounting apparatus. That is, when the flat IC is temporarily placed on the temporary placement centering unit during the movement of the flat IC onto the substrate to perform centering, the flux is immersed in the flux to apply the IC to the IC.
There is disclosed an automatic flat IC mounting machine of a system in which flux is applied to a component side, such as applying flux to leads and then mounting a flat IC at a predetermined position on a substrate. On the other hand, as a method of applying the flux to the substrate side, a dispenser (viscous fluid discharge device) is generally used, and as a component mounting device provided with a dispense nozzle, it is described in JP-A-1-249163. You can hang the die bonder. The dispense nozzle provided in the die bonder has a structure in which a discharge surface is a flat surface and a large number of holes are formed, and a fine discharge state equivalent to screen printing is realized.

[0003]

In the former type of automatic flat IC mounting machine, the lead may be deformed when the flux is applied to the IC lead. Also, depending on the amount of flux applied, while moving onto the substrate,
Excessive flux may be scattered. In the latter die bonder, a head for a dispense nozzle must be equipped in addition to the bonding head, resulting in an increase in size of the device. In consideration of such a problem, the present invention downsizes the mounting head of the component mounting apparatus by having both the component mounting function and the flux coating function, and coating the substrate with flux according to the pattern of the screen mask. It is intended to provide a device.

[0004]

According to the present invention, a viscous fluid is injected into a cylindrical container, and a screen mask is fixed to one end surface of a piston ring that axially slides on the inner peripheral surface of the container to obtain a viscous fluid. Float to cover the surface of the fluid. A transfer pad that copies the viscous fluid pattern of the screen mask is attached to the tip of the coating head that moves three-dimensionally. First, the transfer pad is pressed against the screen mask in the container to copy the viscous fluid pattern of the screen mask. , The coating head is moved onto the substrate, the transfer pad is brought into pressure contact with a predetermined position on the substrate surface, and the viscous fluid is attached to the substrate according to the pattern of the screen mask.

Further, according to the present invention, in the component mounting apparatus for holding the suction nozzle by the mounting head having the suction nozzle mounting / dismounting portion at the tip, picking up the component and mounting it on the surface of the board, the suction nozzle mounting / dismounting portion of the mounting head is used. Detachable dummy nozzles, a nozzle storage base that is placed within the movement range of the mounting head and temporarily holds each nozzle, and a cylinder-like cylinder that is placed below the dummy nozzle holding location of the nozzle storage base and is filled with viscous fluid. And the container of. A piston ring, which is slidable on its inner peripheral surface and cannot rotate, is inserted into the container, and a screen mask is fixed to one end surface of the piston ring to float so as to cover the liquid surface of the viscous fluid. A transfer pad that copies the viscous fluid pattern of the screen mask is attached to the tip of the dummy nozzle, the container is moved up and down toward the transfer pad of the dummy nozzle, and the screen mask is pressed against the transfer pad to attach a predetermined amount of viscous fluid. Arrange the lifting part. When the viscous fluid is applied to a predetermined position on the substrate by the preliminarily input mounting program, the elevating unit is driven to deposit a predetermined amount of the viscous fluid on the transfer pad of the dummy nozzle, and then the mounting head. The suction nozzle mounted on the substrate is replaced with a dummy nozzle, and then the mounting head is moved to bring the transfer pad into pressure contact with a predetermined position on the substrate, and a viscous fluid is attached to the substrate according to the pattern of the screen mask.

[0006]

The viscous fluid pattern of the screen mask is first transferred to the transfer pad, and then transferred to a predetermined position on the substrate by the movement of the dummy nozzle.

[0007]

Embodiment An embodiment will be described with reference to the drawings. A component mounting apparatus 10 shown in FIG. 1 performs a work of mounting electronic components on an electronic circuit board, has a base 11, and arranges various constituent elements in a table portion 12 on an upper surface thereof. is doing.
Reference numeral 13 is a conveyer passing through the center of the table portion 12, which is the substrate 1.
Plays a role of feeding and feeding the substrate 1 and positioning the substrate 1 at the working position. Reference numeral 14 denotes a first component arranging stage arranged on the left side, and 15 denotes a second component arranging stage arranged on the right side of the conveyor 13 toward the downstream side of the conveyor 13 in the substrate feeding direction. Occupies a predetermined position on both sides.

A plurality of component supply devices 20 are arranged in the first component arrangement stage 14 in a row in the horizontal direction in the feed direction of the conveyor 13. Parts supply device 2
Reference numeral 0 indicates that components are sent out from a tilted stick-shaped magazine, but there are many literatures on this kind of feeder (eg, US Pat. No. 4,731,923), and a detailed description thereof is omitted. To do. Second component placement stage 15
Also, each of the plurality of component supply devices 21 is connected to the conveyor 1
3 are arranged side by side in a row in the feeding direction 3. The component supply device 21 is of a type that supplies components using a component tape in which components are stored at a constant pitch, and there are many literature examples (eg, US Pat. No. 4,735,341).
Since it is well known, detailed description will be omitted.

At both ends of the table portion 12, support beams 22 and 23 that extend horizontally and at a right angle to the conveyor 13 are installed by raising a predetermined height from the table surface. Support beams 22, 2
Reference numerals 3 are parallel to each other and support a beam 24 movably in a direction perpendicular to its length direction by a combination of a rail and a slider (not shown). Also, the beam 24
Is connected to each pair of ball nuts (not shown) fitted to a pair of ball screws parallel to each other, and is moved by rotation of pulse motors 25 and 26. The moving direction is at a right angle to the length direction of itself or the substrate feeding direction of the conveyor 13, and in this case, this is the Y direction. A slider 27 is attached to the lower surface of the beam 24. The slider 27 is also moved by a ball screw (not shown), and rotation is given by a pulse motor 28 attached to the lower surface of the beam 24. When the ball screw rotates, the slider 27 moves to the beam 2
4 in the length direction, which is the X direction.

A slider 27 supports the mounting head 3 so as to be able to move up and down, and the mounting head 3 holds a replaceable suction nozzle 4. FIG. 2 is a partially cutaway side view showing the mounting head portion, and the detailed structure is disclosed in Japanese Patent Application Laid-Open No. 5-218689 filed by the applicant of the present invention. Only the part will be described. Thirty
Is an elevating device that vertically supports the mounting head 3 downward via an arm 31 and applies a height displacement (Z direction displacement) to the mounting head 3, and is fixed to the side surface of the slider 27. 32 is the arm 3
Spindle housing supported by 1, spindle 3
3 is rotatably supported vertically. The spindle 33 is formed in a cylindrical shape, the upper end opening is connected to the rotating shaft 341 of the pulse motor 34 via a coupling, and the lower part projects from the lower surface of the spindle housing 32. The rotation of the pulse motor 34 gives an angular displacement (θ displacement) around the Z direction.

Reference numeral 35 denotes a rod which is installed inside the spindle 33 so as to be vertically movable and non-rotatable coaxially with the center of the spindle 33, and the lower end of which is projected from the lower surface of the spindle 33. The outer peripheral surface of the upper end portion of the rod 35 and the inner peripheral surface of the spindle 33 are sealed by the sealing means 330 to divide the hollow space of the spindle 33 at that position, but this does not hinder the vertical movement of the rod 35. Reference numeral 351 denotes a pair of levers swingably supported by a convex portion 350 projecting on the side surface of the lower end portion of the rod 35. The lever 352 at the tip is engaged with the neck portion (410 in FIG. 3) of the suction nozzle, Prevent the suction nozzle from falling off. Between the pair of levers 351,
A tension coil spring (not shown) is stretched, so that a force for pressing the roller 352 against the suction nozzle 4 is generated in the lever 351. The attached suction nozzle 4
Has its own suction path communicated with the air suction path (not shown) of the rod 35, which enables suction of components.
The suction nozzle 4 is a nozzle stocker 50, which will be described later.
It can be exchanged with another type provided in 51. 33
Reference numeral 1 denotes a spring inserted between the spindle 33 and the rod 35, which pushes down the rod 35 in the descending direction toward a descending stopper (not shown) provided at the lower end of the spindle 33.

The rotary shaft 341 of the pulse motor 34 is hollow, the lower end communicates with the hollow part of the spindle 33 through a coupling, and the rotary joint 342 for air piping is attached to the upper end of the rotary shaft 341. An air pressure source 37 is connected via the adjusting means 36. The air pressure adjusting means sets the air pressure according to a designated voltage or current value like an electropneumatic conversion regulator, and is connected to a control unit 9 described later. Therefore, air is supplied from the rotary joint 342 to the hollow portion of the spindle 33 via the rotary shaft 341 with the air pressure of the value designated by the control unit 9.

FIG. 3 is a front view showing the construction of the dummy nozzle 41 and the transfer pad 42 attached to it. The portion of the dummy nozzle 41 to be mounted on the rod 35 of the mounting head 3 has the same shape as other suction nozzles and also has a background plate 412 for image recognition, but does not have a suction path for sucking components. Absent. The transfer pad 42 is formed of an elastic body such as silicon rubber, and as shown in FIG.
3 are fitted so as to cover the lower surface of 3. Mounting block 4
3 has a hollow shaft protruding in the center of the upper surface, and the background plate 41
The tip of the dummy nozzle extending downward from 2 is fitted and fixed in this hollow shaft. In the present embodiment, the lower surface shape of the transfer pad 42 is a substantially quadrangle as shown by the imaginary line in FIG.

Reference numerals 50 and 51 are nozzle stockers arranged between the second component arrangement stage 15 and the conveyor 13.
The nozzle stocker 50 stocks a suction nozzle that holds a small component, and the nozzle stocker 51 stocks a suction nozzle that holds a large component. Further, the nozzle stocker 51 also has a place for stocking the dummy nozzle 41, and FIG. 4 is a partially cutaway schematic side view for explaining each component at the stock position of the dummy nozzle.
Reference numeral 510 denotes nozzle locking means that enters the space above the flange portion 411 of the dummy nozzle and temporarily stops the rise of the nozzle, and is arranged so as to be passed to the stock positions of other nozzles.

Reference numeral 6 denotes a cylindrical container in which the viscous fluid L is injected, which is arranged below the dummy nozzle holding place of the nozzle stocker 51. The container 6 beside itself and the relay pipe 6
It has a sub-container 61 that communicates with each other through 0, and these are placed on a plate 63 and fixed so that the axis of the container 6 coincides with the axis of the dummy nozzle 41. 64 is a container 6
A piston ring slidable on the inner peripheral surface in the axial direction is fixed to the lower surface of the screen mask 65 covering the liquid surface of the viscous fluid L, so that both are floated on the liquid surface. Further, the piston ring 64 has a concave portion on the outer periphery, and as shown in FIG. 5 (a plan view of the container 6 viewed from above), a key 641 fixed to a vertical key groove provided on the inner wall of the container 6 The recess is engaged so that it can slide in the axial direction and cannot rotate around the axis. The screen mask 65 has the same function as in screen printing, and when the viscous fluid L such as flux is pressed against the unmasked opening, the viscous fluid L oozes out therefrom.
In the present embodiment, for example, as shown in FIG. 5, a screen mask provided with four slit-shaped openings 651 corresponding to lands of a flat package (QFP) type IC having leads in four directions is attached.

Reference numeral 66 is a proximity sensor that outputs a detection signal when the piston ring 64 approaches in front of itself from the vertical direction. The proximity sensor 66 is opened on the side wall of the container 6 at a position slightly higher than the height of the relay pipe 60. It is screwed inward into the hole. 67 is a check valve screwed into a hole formed in the upper side wall of the sub-container 61, to which a fluid supply device 69 is connected via a hose 68. The check valve 67 is used for the fluid supply device 6
The viscous fluid sent from the container 9 is opened only in the direction in which it flows into the sub container 61, and is closed in the direction in which it flows out. The proximity sensor 66 and the fluid supply device 69 are connected to the control unit 9 described later, and when the detection signal of the proximity sensor informs that the remaining amount of the viscous fluid L is small, the fluid supply device 69 supplements the viscous fluid. It

An air cylinder 7 pushes up the container 6 and presses the upper surface of the screen mask 65 against the lower surface of the transfer pad 42 mounted on the dummy nozzle.
It is fixed upwards on top of 2, and connects its rod 71 to the plate 63. The axis of the air cylinder 7 is also located on the extension of the axis of the dummy nozzle 41, and the rod 7
The extrusion stroke of 1 is set to a distance that can reach the lower surface of the transfer pad 42 even at the lower limit position of the screen mask detected by the proximity sensor 66. Thus, the screen mask 65 is pressed against the lower surface of the transfer pad 42 by the pushing force of the air cylinder 7, and the four openings 6
The viscous fluid L is exuded from 51 and attached to the transfer pad.

Reference numeral 8 denotes a fixed component recognition camera arranged beside the component arrangement stage 14. This forms part of a visual recognition device that measures the amount of misalignment of parts. Reference numeral 9 is a control unit arranged inside the base 11. Control unit 9
Is the movement of the beam 24 in the Y direction, the movement of the mounting head 3 in the X and Z directions, the θ rotation of the rod 35 about the Z axis, the air pressure setting of the air pressure adjusting means 36, and the suction nozzle 4 according to the mounting program input in advance. And the drive of the fluid supply device 68 and the air cylinder 7 are controlled.

The operation of the component mounting apparatus 10 is as follows. First, the conveyor 13 carries the substrate 1 from one side and positions it at a predetermined position. An adhesive has already been applied to the parts of the substrate 1 where the parts are to be mounted. Here, the control unit 9 controls the movement of the beam 24 in the Y direction and the movement of the mounting head 3 in the X and Z directions according to a mounting program input in advance, and positions the suction nozzle 4 on a predetermined component supply device. And the suction nozzle 4 of the mounting head 3
And let the parts pick up. Then substrate 1
And mounts the component by giving θ to the mounting head 3 around the Z axis according to the component picked up. Depending on the component to be mounted, the suction nozzle is replaced to continue the mounting operation, or the air pressure adjusting means 36 is instructed to press the rod 35 in the spindle 33 with a predetermined air pressure to apply a predetermined pressure on the substrate. The parts are attached by pressure.

Ordinary components are imaged by a mirror device mounted on the mounting head 3 and a component recognition camera (not shown), the amount of positional deviation is measured, and XY is determined based on the measurement result.
The amount of movement in the direction and the θ angle are corrected and then mounted on the substrate 1. For large parts such as a QFP type IC that cannot fit in the field of view of the camera on the side of the mounting head 3, after the pickup, the mounting head 3 is positioned on the part recognition camera 6 and the amount of displacement of the part is measured. Based on the measurement result, the amount of movement in the XY directions and the θ angle are corrected, and then the component is mounted on the substrate 1.

When mounting the QFP type IC or the like, when the land portion of the substrate 1 is solder-plated, the operation of applying the flux to the relevant portion will be described in detail. The controller 9 moves the mounting head 3 to place the nozzle currently mounted on the nozzle stocker 50 or 51 at a predetermined position. The nozzle locking means 510 disposed at that position is driven to stop the rise of the nozzle, and then the mounting head 3
Is lifted to forcibly disengage the pair of rollers 352 from the neck portion of the nozzle, and only the nozzle remains in the stock position. At the same time, the controller 9 drives the air cylinder 7 to push out the rod 71, press the screen mask 65 against the transfer pad 42 of the dummy nozzle 41 held in the nozzle stocker, and pull in the rod 71 after a predetermined time has elapsed. Let Thus, after the viscous fluid L adheres to the transfer pad according to the pushing force of the air cylinder 7 and the pressure contact time,
The mounting head 3 with no nozzles mounted thereon is moved to the stock position of the dummy nozzle 41 of the nozzle stocker and lowered to move the pair of rollers 352 to the neck portion 410 of the dummy nozzle 41.
Engage with. Then, the nozzle locking means 510 is opened, and the mounting head 3 is raised to mount the dummy nozzle 41 on the mounting head.

The control unit 9 moves the mounting head 3 having the dummy nozzle 41 mounted thereon onto a predetermined land pattern of the substrate 1 and then lowers it to bring the lower surface of the transfer pad 42 into pressure contact with the substrate and attach it thereto. A viscous fluid pattern having a shape corresponding to the land pattern is transferred to the substrate. After that, the mounting head 3 is raised and moved to store the dummy nozzle 41 in the nozzle stocker 51, and instead, a large suction nozzle for the QFP type IC is mounted on the mounting head, and the mounting operation described above is performed. A predetermined QFP type IC lead is placed on the land portion coated with the fluid L.

When it is desired to adjust the amount of viscous fluid deposited on the substrate, the dummy nozzle is once mounted on the mounting head, and the dummy nozzle is pressurized at the stock position by utilizing the pressing force adjusting mechanism at the time of mounting the component. do it. That is, the control unit 9 mounts the dummy nozzle on the mounting head before pushing out the rod 71, and drives the air cylinder 7 with the mounting head 3 slightly lifted. Then, a command is issued to the air pressure adjusting means 36, the compressed air from the air pressure source 37 is adjusted in accordance with the command value, and the compressed air is sent into the spindle 33. When the transfer pad 42 comes into contact with the screen mask 65, the rod 35 moves upward from a lowering stopper (not shown) of the spindle 33 to compress the spring 331 due to an overstroke at the time of contact, and on the screen mask 65, The respective weights of the rod 35, the dummy nozzle 41, the mounting block 43 and the transfer pad 42, and the spring pressure of the spring 331 are applied. In this state, air flows into the spindle at a desired pressure and the rod 3
Since the upper end of 5 is pushed down, the pressure applied to the screen mask can be adjusted within the range of the maximum air pressure value of compressed air from the above-mentioned steady pressure value. Therefore, the amount of the viscous fluid that oozes out of the opening 651 of the screen mask can be adjusted by the controller 9 issuing a command to the air pressure adjusting means 36.

When the viscous fluid L is desired to be deposited on the substrate with high accuracy, the mounting head 3 is placed on the component recognition camera 8 and the viscous fluid pattern attached to the transfer pad is recognized. Then, the position is measured, and based on the measurement result, the transfer amount in the XY directions and the θ angle may be corrected, and then the transfer pad 42 may be brought into contact with the substrate 1.

When the viscous fluid transfer operation as described above is repeatedly performed, the amount of the viscous fluid L decreases, and the screen mask 65 and the piston ring 64 descend to reach the front of the proximity sensor 66. The proximity sensor 66 detects the presence of the piston ring 64 and informs the control unit 9,
The controller 9 drives the fluid supply device 69 to drive the viscous fluid L.
Is poured into the sub-container 61 through the hose 68 and the check valve 67 for a predetermined amount to perform automatic replenishment.

In this embodiment, the case where the dummy nozzle for applying the viscous fluid is replaced and mounted on the mounting head that moves in the XY direction to apply the viscous fluid on the substrate has been described. However, the peripheral edge of the rotary index table is equally spaced. It can be applied also to a component mounting apparatus in which the mounting head is disposed on the substrate and the substrate side is moved in the XY direction by equipping the viscous fluid container with the nozzle replacement mechanism, the nozzle stocker, and the screen mask, and the mechanism for moving it up and down. is there. The material of the transfer pad is silicon rubber in this embodiment, but various elastic bodies used for tacho printing can be used. The liquid amount detecting means is not limited to the proximity sensor, and liquid level position detection by a photo sensor or the like can be used instead.

Further, in the present embodiment, the container 6 with the screen mask floating is arranged below the dummy nozzle storage location of the nozzle stocker and is moved up and down. It is also possible to mount and fix the head 3 at a predetermined position within the moving range without providing an elevating mechanism, and press the transfer pad 42 against the screen mask 65 by moving the mounting head in the X, Y, and Z directions. That is, the mounting head 3 with the dummy nozzle 41 mounted thereon is moved onto the container 6, and the dummy nozzle is lowered to press the transfer pad 42 against the screen mask 65 to copy the viscous fluid pattern. At this time, when it is desired to adjust the amount of the viscous fluid to be copied, as described above, the control unit 9 may be instructed to the air pressure adjusting unit 36 to pressurize the dummy nozzle 41 with a desired pressure.

[0028]

According to the present invention, during the execution of the component mounting program, the suction nozzle of the mounting head is replaced with a nozzle for applying viscous fluid such as flux, and the viscous fluid is adhered to the substrate according to the intended shape pattern. Therefore, it is not necessary to provide a coating head separately from the mounting head, and there is no need to provide a syringe or the like containing a viscous fluid on the mounting head side, which is effective for downsizing the device. Further, since the transfer pad is made of an elastic material such as silicon rubber, the viscous fluid can be uniformly applied even if there is some unevenness on the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view of a component mounting apparatus showing an embodiment of the present invention.

FIG. 2 is a partially cutaway side view showing a mounting head portion of the component mounting apparatus.

FIG. 3 is a front view showing a configuration of a dummy nozzle included in the component mounting apparatus and a transfer pad mounted on the dummy nozzle.

FIG. 4 is a partially cutaway schematic side view illustrating components of a dummy nozzle storage location provided in the component mounting apparatus.

5 is a plan view of the vicinity of the container 6 in FIG. 4 as viewed from above.

[Explanation of symbols]

 1 Substrate 3 Mounting Head 4 Adsorption Nozzle 41 Dummy Nozzle 42 Transfer Pad 50, 51 Nozzle Stocker (Nozzle Storage) 6 Container 64 Piston Ring 65 Screen Mask 66 Proximity Sensor (Liquid Volume Detection Means) 67 Check Valve (Fluid Injection Port) 69 Fluid supply device 7 Air cylinder (elevating part) 8 Camera for component recognition 9 Control part L Viscous fluid

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication location H01L 23/50 N H05K 3/34 503 B 8718-4E

Claims (4)

[Claims] 1. When applying a viscous fluid to a substrate surface, the viscous fluid is injected into a cylindrical container, and a screen mask is fixed to one end surface of a piston ring that axially slides on the inner peripheral surface of the container. Then, the transfer pad that floats so as to cover the liquid surface of the viscous fluid and moves the three-dimensionally is attached to the tip of the coating head, which transfers the viscous fluid pattern of the screen mask, and drives the coating head. The transfer pad is pressed against the screen mask in the container to copy the viscous fluid pattern of the screen mask, and then the coating head is moved onto the substrate so that the transfer pad is pressed onto a predetermined position on the substrate surface. A viscous fluid application method characterized in that a viscous fluid is adhered to a substrate according to the pattern. 2. A component mounting apparatus comprising: a mounting head having a suction nozzle attaching / detaching portion at a tip thereof to hold the suction nozzle, pick up a component, and surface-mount it on a substrate; . a. A dummy nozzle that can be attached to and detached from the suction nozzle attachment / detachment portion of the mounting head. b. A nozzle storage table that is arranged within a moving range of the mounting head and temporarily holds the dummy nozzle and the suction nozzle. c. A cylindrical container, which is arranged below the dummy nozzle holding place of the nozzle storage table and into which a viscous fluid is injected. d. A piston ring that is slidable in the axial direction on the inner peripheral surface of the container and is not rotatable around the axis. e. A screen mask fixed to one end surface of the piston ring and floated so as to cover the liquid surface of the viscous fluid. f. A transfer pad mounted on the tip of the dummy nozzle to copy the viscous fluid pattern of the screen mask. g. An elevating part for elevating the container toward a transfer pad of the dummy nozzle and pressing the screen mask against the transfer pad to adhere a predetermined amount of viscous fluid. h. When the viscous fluid is applied to a predetermined place on the substrate by the mounting program entered in advance, the elevating part is driven to attach a predetermined amount of the viscous fluid to the transfer pad of the dummy nozzle, and then mounted on the mounting head. The control unit that replaces the suction nozzles with dummy nozzles, then moves the mounting head to press the transfer pad against a predetermined position on the substrate, and adheres the viscous fluid to the substrate according to the pattern of the screen mask. 3. The liquid amount of the viscous fluid in the container according to claim 2, wherein the container is a communication tube, the piston ring and the screen mask are floated on one side, and a fluid injection port is fixed on the other side. And a fluid supply device that supplies a viscous fluid to the fluid injection port according to the detection information of the liquid volume detection means. 4. The component mounting apparatus according to claim 2, wherein the viscous fluid is a flux.