JPH0763117B2 - Electronic component suction control device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a suction means called a collet or a vacuum chuck for sucking an electronic component such as a chip component or a die of a semiconductor element (diode, transistor, IC chip). Control, and more particularly to drive control of the suction means for the electronic component.

(B) Conventional technology Generally, as electronic parts, a chip mounter used for leadless chip parts including resistors, capacitors, and semiconductor elements mounted on a printed circuit board, and among semiconductor elements, especially IC chips are read. In a die bonder or the like fixed to a frame, a suction device called a vacuum chuck or a collet for transferring electronic parts is used. Therefore, as an example of the collet, 1981 11
The shape of the bonding collet can be mentioned as described in P.151-152 of the separate issue of electronic materials issued monthly. The bonding collet shown in FIG. 4 of the material is die-attached by a cam driving method or a digital driving method as a die attachment method at the time of bonding as a driving method.

(C) Problems to be Solved by the Invention In the normal cam drive method, when the thickness of the die (electronic component) to be processed changes, if the die is thinner than the standard thickness, Generally, a gap is formed between the collet and the die surface, and a suction error, a suction position shift, and a die stand-up easily occur.

Conversely, when handling a thick die, the collet will apply excessive pressure to the die, damaging the die surface,
Sometimes it may be damaged.

For this reason, conventionally, the same collet has been used within a certain allowable range of die thickness, but when it exceeds the allowable range, a different type of collet is replaced. Adjustment at the time of this replacement required skill and required a great deal of time.

Furthermore, there are always variations in the suction level height due to assembly and processing errors in equipment manufacturing.
When working at more than one station, the suction level at each station had to be readjusted, which required a great deal of labor.

As a means for solving the above drawbacks of the cam drive method, there is a digital drive method, but the above problems can be solved, but in general, compared with the cam drive method,
Motion characteristics such as high speed and acceleration characteristics are inferior.

Therefore, the present invention enables various electronic parts having different thicknesses to be handled without exchanging the suction means, and absorbs variations in suction level height in manufacturing the apparatus and ensures reliable suction. With the goal.

(D) Means for Solving the Problems For this purpose, the present invention provides a suction means for suctioning an electronic component, and a first movable first suction means for moving the suction means up and down by a fixed predetermined amount.
The driving means, the second driving means capable of moving the suction means up and down by the predetermined amount and then further moving up and down, and the descending amount of the suction means by the second driving means. The storage means for storing the electronic component according to the thickness thereof, and the first driving means for lowering the suction means by the predetermined amount and then the lowering amount stored in the storage means for lowering the electronic component And a control means for controlling so as to pick up the component.

(E) Action When the suction means descends to suck the electronic component with the above configuration, the control means first lowers the suction means by a predetermined fixed amount by the first drive means, and then by the second drive means. The suction means is lowered by the amount of movement stored in the storage means according to the thickness of the electronic component.

(F) Embodiment One embodiment of the present invention will be described below with reference to the drawings.

First, (1) is a collet as a suction means for sucking and holding a die (19) as an electronic component from above a wafer ring (18), and (3) is a collet shaft vertical guide, the guide (3) being fixed. A cam follower (3B) is pivotally supported above the support plate (3A).

(7) is an oscillating handler as a first driving means, which has a cam and a driving motor, and a cam output shaft (20) of the oscillating handler (7) moves up and down and turns. (4) is an arm, the support plate (3A) is fixed to one end of the arm (4), and the other end of the arm (4) is fixed to an arm vertical guide (5) together with the cam output shaft (20). Moving.

(6) is a pulse motor as a second drive means, a belt (10) is hung between a pulley (8) provided on the output shaft of the pulse motor and another pulley (9), and the pulley (9) is attached to the pulley (9). Is equipped with a screw shaft (9A). (2) is an upper and lower bar, which is guided by a guide (2A) on a base (7A) fixed to the housing part of the oscillating handler (7) and fixed to a nut body (2B) that moves up and down by a screw shaft (9A). Has been done.

Therefore, the arm (4), the guide (3) and the collet (1) are moved up and down by the driving of the oscillating handler (7) by the fixed predetermined movement amount (1) shown in FIG. 4, and the pulse motor (6) is moved. Drive pulleys (8), (9)
The nut body (2B) and the upper and lower bars (2) are moved up and down by a smaller amount (Δl) than the above l by the rotation of the screw shaft (9A) via the. The collet (1) is moved up and down via the cam follower (3B) by moving the upper and lower bars (2) up and down.

(11) is a keyboard for inputting various data, and the movement amount of the collet (1) by the pulse motor (6) according to the thickness of the die (19) is also input in advance, and the memory (14) as a storage means. Memorized in. (12) is an I / O as an input / output buffer, (13) is a CPU as a control means, and is a die (19)
The overall suction control of is controlled. A sensor (15) detects whether or not the collet (1) has dropped by a predetermined movement amount (1). Reference numeral (16) is a motor driving means which is a driving circuit of the pulse motor (6), and (17) is a driving means which is a driving circuit of the oscillating handler (7).

Next, the operation of the present invention will be described. First, when the die (19) is sucked from the wafer ring (18), the collet (1) is moved from the position of the distance (L) to the die (19) as shown in FIG. ) Is lowered by the cam mechanism of the oscillating handler (7). That is, the CPU (13) is the driving means (1
The oscillating handler (7) is driven by 7) to lower the arm (4), the guide (3) and the collet (1) by a predetermined moving amount (l) and rotate them by a predetermined angle. Therefore, the cam follower (3B) is located immediately below the upper and lower bars (2) (see FIG. 1).

Then, in response to the lowering of the collet (1), the sensor (1
5) detects its position. The pulse motor connected to the motor drive means (16) by reading the data keyed in beforehand from the keyboard (11) according to the size (thickness) of the die (19) from the stored memory (14) by the CPU (13). (6) is controlled, a predetermined number of pulses are driven, and the distance (Δl)
Only, the collet (1) is further lowered. That is, the pulleys (8), (9) are driven by driving the pulse motor (6).
And by rotating the screw shaft (9A) and lowering the nut body (2B) and the upper and lower bars (2) by a distance (Δl),
By pressing the upper and lower bars (2), the supporting plate (3A), the arm (4), the collet shaft vertical guide (3) and the collet (1) are also lowered by the distance (Δl) via the cam follower (3B).

Accordingly, the total moving distance (L) of the collet (1) is l.
It becomes + Δl, approaches the die (19), and adsorbs by vacuum. After the die (19) is attracted, the pulse motor (6) is driven by the motor driving means (16) for a predetermined number of pulses to drive the distance (Δl) to raise the collet (1). After the pulse motor (6) has rotated for the number of pulses corresponding to l, it stops. According to the rise of the collet (1), the position of the collet (1) is detected by the sensor (15), and the I / O (12) is switched so as to switch from the pulse motor (6) to the oscillating handler (7). ) And a driving signal (17), the oscillating handler (7) operates, and while further turning, the distance rises by a distance (l), and the total movement amount (L) becomes equal to the lowering amount (l +). Δl) The ascending of the oscillating handler (7) is stopped, and in order to immediately transfer the die (19) to a predetermined position, the oscillating handler (7) is swung to perform the next step (die bonding).
Etc. are prepared.

About this time for example turning, as shown in FIG. 5 (angle theta), with vertical stroke _{L 1 = l 1 + △ l} 1 for positioning by the position of A (component positioning device, l ₁ the cam, △ l ₁ Is digitally moved up and down by a predetermined pulse) and at position B (up and down movement for adsorption on the wafer ring (18), at stroke L ₂ = l ₂ + Δl ₂ , l ₂ is a cam and Δl ₂ is a digital The above process is achieved by a predetermined operation at each position (by the automatic movement).

In contrast to this operation, as shown in FIG. 3, the characteristic diagram shows that the collet (1) descends at time T ₁ until the completion of adsorption of the die (19), and T ₂ shows the original position of the collet (1). The time in one step is T ₁ + T ₂ . In this case, the keyboard (1
The desired speed can be achieved by setting the speed from 1).

(G) Effect of the Invention As described above, according to the present invention, the suction means is lowered by the fixed predetermined amount by the first driving means, and is lowered by the lowering amount stored in the storage means described later, so that the electronic component is supplied from the component supply unit. Since the control means controls the suction means so as to suction, various electronic components having different thicknesses can be handled without replacing the suction means. However, for example, when a cam driving system using a motor is used as the first driving means, a section that is not affected by the thickness of the electronic component can be moved at high speed, and a section that is affected by the thickness can be moved. Can digitally control the second drive means by arbitrarily setting it according to the thickness of various electronic parts, and can freely set the acceleration characteristics without impacting the electronic parts. Since it can handle variations in the above, the advantages of both can be fully demonstrated. The present invention can also be applied to mounting of components.

[Brief description of drawings]

FIG. 1 is a front view of an essential part of a suction control device for electronic parts of the present invention, FIG. 2 is a block diagram of the device, FIG. 3 is a characteristic diagram for explaining the device, and FIG. 4 is the device. FIG. 5 shows an enlarged characteristic view of an essential part for the explanation of FIG. (1) …… Colette, (2) …… Upper and lower bars, (4) ……
Arm, (5) ... arm up / down guide, (6) ... pulse motor, (7) ... oscillating handler, (11) ...
… Keyboard, (13) …… CPU (control means), (14)…
… Memory (storage), (19) …… die.

Claims (1)

[Claims] 1. A suction means for sucking an electronic component, a first drive means capable of vertically moving the suction means by a fixed predetermined amount, and a first drive means for moving the suction means by the predetermined amount. Second drive means capable of further moving up and down after being moved up and down by a minute,
Storage means for storing the amount of lowering of the suction means by the second drive means according to the thickness of the electronic component, and the storage means after lowering the suction means by the predetermined amount by the first drive means. A suction control device for an electronic component, comprising: a control unit that controls the component supply unit to lower the stored lowering amount so as to suck the electronic component.